Patents Assigned to Shinko Electric Industries Co., LTD
  • Publication number: 20250012985
    Abstract: An optical module includes a first cladding layer formed on a substrate, a first groove extending through the first cladding layer in a thickness direction, and a second cladding layer formed on the first cladding layer. The optical module further includes a second groove extending through the first cladding layer and the second cladding layer in the thickness direction, a silicon photonics component mounted on the first cladding layer, and a single-mode fiber fitted into the second groove. The silicon photonics component includes a main body and an optical axis located below the main body. The lower surface of the main body is in contact with the upper surface of the first cladding layer. The optical axis is retained within the first groove. A circumferential surface of the single-mode fiber is in contact with a bottom surface of the second groove and a wall surface of the second groove.
    Type: Application
    Filed: July 1, 2024
    Publication date: January 9, 2025
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventor: Kenji Yanagisawa
  • Patent number: 11978831
    Abstract: A light emitting device includes a light-transmissive ceramic substrate, a light emitting element mounted on the ceramic substrate, a wiring arranged inside the ceramic substrate and electrically connected to the light emitting element, a base material faced to the ceramic substrate, and a seal member hermetically sealing a gap between the ceramic substrate and the base material. The light emitting element is arranged in a space surrounded by the ceramic substrate, the base material, and the seal member. The wiring includes a wiring layer extending in a planar direction of the ceramic substrate.
    Type: Grant
    Filed: June 12, 2021
    Date of Patent: May 7, 2024
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Masaya Tsuno
  • Publication number: 20230367065
    Abstract: A silicon photonics element including an optical element that has no self-luminescent capability, a first optical waveguide that connects the optical element to an outside of the silicon photonics element, a ring resonator optically connected to the first optical waveguide and located proximate to the first optical waveguide, and a second optical waveguide optically connected to the ring resonator and located proximate to the ring resonator. The first optical waveguide includes a first end surface connected to the outside of the silicon photonics element, and the second optical waveguide includes a second end surface connected to the outside of the silicon photonics element.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 16, 2023
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Yuji Furuta
  • Patent number: 11811009
    Abstract: A light emitting device includes a ceramic substrate, a light emitting element, and a wiring. The light emitting element is formed on an upper surface of the ceramic substrate. The wiring is arranged inside the ceramic substrate and is electrically and directly connected to the light emitting element. The light emitting element includes a structure in which a lower semiconductor layer, an active layer, and an upper semiconductor layer are sequentially stacked.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: November 7, 2023
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Yuichiro Shimizu, Masaya Tsuno
  • Patent number: 11658015
    Abstract: A ceramic structure includes a base body, and a thermoelectric device having a part in directly contact with the base body. The base body is a ceramic consisting of aluminum oxide. The thermoelectric device comprises a conductor part that is a sintered body having an alloy of tungsten and rhenium, as a main component, and including nickel oxide, aluminum oxide and silicon dioxide.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: May 23, 2023
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Tomotake Minemura
  • Patent number: 11333443
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 17, 2022
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Yoshihiro Machida, Takahiko Kiso
  • Publication number: 20220011055
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Publication number: 20210391518
    Abstract: A light emitting device includes a ceramic substrate, a light emitting element, and a wiring. The light emitting element is formed on an upper surface of the ceramic substrate. The wiring is arranged inside the ceramic substrate and is electrically and directly connected to the light emitting element. The light emitting element includes a structure in which a lower semiconductor layer, an active layer, and an upper semiconductor layer are sequentially stacked.
    Type: Application
    Filed: June 9, 2021
    Publication date: December 16, 2021
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Yuichiro Shimizu, Masaya Tsuno
  • Publication number: 20210391508
    Abstract: A light emitting device includes a light-transmissive ceramic substrate, a light emitting element mounted on the ceramic substrate, a wiring arranged inside the ceramic substrate and electrically connected to the light emitting element, a base material faced to the ceramic substrate, and a seal member hermetically sealing a gap between the ceramic substrate and the base material. The light emitting element is arranged in a space surrounded by the ceramic substrate, the base material, and the seal member. The wiring includes a wiring layer extending in a planar direction of the ceramic substrate.
    Type: Application
    Filed: June 12, 2021
    Publication date: December 16, 2021
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Michio Horiuchi, Masaya Tsuno
  • Patent number: 11193717
    Abstract: A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: December 7, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Takahiko Kiso
  • Patent number: 11143461
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 12, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 11125954
    Abstract: An optical waveguide includes a first clad layer, core layers each formed on the first clad layer, a second clad layer formed on the first clad layer to cover the core layers, grooves each provided corresponding to one of the core layers. The optical waveguide further includes inclined surfaces each disposed in the corresponding groove to face an end surface of the corresponding core layer in an extension direction of the core layers. Each inclined surface is inclined with respect to the extension direction of the core layers. The optical waveguide further includes optical path changing mirrors each formed on the corresponding inclined surface. The grooves are physically separate from each other. Each inclined surface is formed in only the first and second clad layers. Each optical path changing mirror is not in contact with the core layers and is physically separate from the core layers.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: September 21, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Kenji Yanagisawa
  • Patent number: 11060798
    Abstract: A loop heat pipe includes an evaporator, a condenser, a liquid pipe, and a vapor pipe. The liquid pipe is formed a metal layer stack of metal layers. The metal layers include a first metal layer through which a first through hole extends in a thickness-wise direction. The liquid pipe includes a flow passage formed by at least the first through hole and having four walls that define the flow passage. The liquid pipe further includes a plurality of porous bodies that form at least two of the four walls of the flow passage.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 13, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Yoshihiro Machida
  • Publication number: 20210018702
    Abstract: An optical waveguide includes a first clad layer, core layers each formed on the first clad layer, a second clad layer formed on the first clad layer to cover the core layers, grooves each provided corresponding to one of the core layers. The optical waveguide further includes inclined surfaces each disposed in the corresponding groove to face an end surface of the corresponding core layer in an extension direction of the core layers. Each inclined surface is inclined with respect to the extension direction of the core layers. The optical waveguide further includes optical path changing mirrors each formed on the corresponding inclined surface. The grooves are physically separate from each other. Each inclined surface is formed in only the first and second clad layers. Each optical path changing mirror is not in contact with the core layers and is physically separate from the core layers.
    Type: Application
    Filed: July 14, 2020
    Publication date: January 21, 2021
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Kenji Yanagisawa
  • Patent number: 10859321
    Abstract: A heat pipe includes an inlet through which a working fluid is injected. The inlet includes a non-sealed portion and a sealed portion connected to the non-sealed portion. The non-sealed portion and the sealed portion each include two outermost metal layers and a plurality of intermediate metal layers stacked between the outermost metal layers. The heat pipe further includes a porous body arranged in the inlet.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: December 8, 2020
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10665533
    Abstract: A lead frame includes a conductive member, a plating layer, and an oxide film. The conductive member includes a rough surface. The plating layer is formed on the rough surface and configured to be connected to a semiconductor element. The oxide film covers the rough surface at least around the plating layer.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: May 26, 2020
    Assignee: Shinko Electric Industries, Co., Ltd.
    Inventors: Kesayuki Sonehara, Muneaki Kure, Yosuke Aruga
  • Publication number: 20200096261
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 26, 2020
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Yoshihiro Machida, Takahiko Kiso
  • Patent number: 10524388
    Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 31, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Patent number: 10497640
    Abstract: A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 3, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 10466428
    Abstract: An optical waveguide device includes an optical-electrical hybrid substrate and a lens component mounted on the optical-electrical hybrid substrate. The optical-electrical hybrid substrate includes a wiring substrate and an optical waveguide on the wiring substrate. An optical path changer is arranged on an end of the optical waveguide. The optical waveguide includes an opening configured to expose a connection pad of the wiring substrate. The lens component includes a component body including a conductive member receptacle at a position corresponding to the opening of the optical waveguide. The lens component includes a conductive member partially accommodated in the conductive member receptacle and configured to connect the lens component to the connection pad.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: November 5, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Kenji Yanagisawa