Patents Assigned to Shinko Electric Industries Co., LTD
  • Patent number: 10446512
    Abstract: A conductive ball includes a copper ball, a nickel layer formed with being patterned on an outer surface of the copper ball, and a tin-based solder covering each outer surface of the copper ball and the nickel layer.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: October 15, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kei Murayama
  • Patent number: 10446513
    Abstract: A conductive ball includes a copper ball, a nickel layer covering an outer surface of the copper ball, a copper layer covering an outer surface of the nickel layer, and a tin-based solder covering an outer surface of the copper layer. A copper weight of the copper layer relative to a summed weight of the tin-based solder and the copper layer is 0.7 wt % to 3 wt %.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: October 15, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kei Murayama
  • Patent number: 10438883
    Abstract: A wiring board includes an insulator layer having a top surface, and a plurality of pads arranged in a pad arrangement region on the top surface of the insulator layer. The pad arrangement region includes a first region in which a first plurality of pads among the plurality of pads are arranged at a first density, and a second region in which a second plurality of pads among the plurality of pads are arranged at a second density lower than the first density. At least one dummy pad is arranged juxtaposed to at least one of the second plurality of pads in the second region of the pad arrangement region.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: October 8, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kei Imafuji
  • Patent number: 10412828
    Abstract: A wiring substrate includes a substrate body, a first wiring, and a second wiring. The first wiring and the second wiring are located on an upper surface of the substrate body. The wiring substrate further includes a solder resist layer that covers the first wiring and the second wiring. The solder resist layer includes a first opening that partially exposes the second wiring and a missing portion that partially exposes the first wiring. The wiring substrate further includes an insulation coating that covers an inner wall of the missing portion, the first wiring exposed by the missing portion, and at least a portion of an upper surface of the solder resist layer. The insulation coating includes a second opening that is in communication with the first opening and partially exposes the second wiring.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: September 10, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kaoru Yamakawa
  • Patent number: 10408546
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; and a vapor line that connects the evaporator and the condenser, wherein the evaporator, the vapor line, the liquid line and the condenser form a flow path that is a loop through which the working fluid or vapor of the working fluid flows, wherein in the condenser and the vapor line, a wall portion of the flow path is constituted by a metal layer, wherein a drain line formed to be separated and apart from the flow path is provided in the wall portion, and wherein a drawing line connecting the drain line and the flow path is provided in the wall portion.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: September 10, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Kurashima, Yoshihiro Machida
  • Patent number: 10404033
    Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: September 3, 2019
    Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shigeru Matsushita, Katsuya Nakazawa, Eiichiro Okahisa, Kazuma Kozuru
  • Publication number: 20190264989
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 29, 2019
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 10398027
    Abstract: A wiring board includes: a wiring structure including: a first insulating layer; a first wiring layer formed on a bottom surface of the first insulating layer; and a protective insulating layer which covers the bottom surface of the first insulating layer and has a first opening; and a support base member bonded to the protective insulating layer with an adhesive layer and has a second opening. A diameter of the second opening at a position between the top surface and the bottom surface of the support base member in a thickness direction of the support base member is smaller than a diameter of the second opening at the top surface of the support base member and a diameter of the second opening at the bottom surface of the support base member, and smaller than a diameter of the first opening.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: August 27, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazuhiro Oshima, Junji Sato, Hitoshi Kondo, Katsuya Fukase
  • Patent number: 10390719
    Abstract: A patch-type module includes a substrate provided with one surface and another surface that is a sticky surface; an air cell mounted to the substrate; a seal that blocks air from entering the air cell whose first surface is attached to the air cell; an electronic component mounted on the substrate; and a protection sheet that is attached to the sticky surface of the substrate through an adhesion layer, wherein a second surface of the seal is attached to the protection sheet through the adhesion layer, wherein when the protection sheet is peeled, the adhesion layer and the seal are peeled together to expose the sticky surface of the substrate and start introduction of air inside the air cell so that electric power is capable of being power supplied to the electronic component from the air cell.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: August 27, 2019
    Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., NIHON KOHDEN CORPORATION
    Inventors: Kazuyuki Kubota, Norihito Konno
  • Patent number: 10395810
    Abstract: An inductor includes a stacked body with a plurality of structural bodies that are stacked. Each of the plurality of structural bodies includes a wiring and an insulation layer formed on the wiring. The wirings of the plurality of structural bodies are connected in series to form a helical coil. The inductor further includes a through hole, which extends through the stacked body in a thickness direction of the stacked body, and a plurality of discrete insulation films, which are spaced apart from each other and cover surfaces of the wires of the plurality of structural bodies exposed from a surface of the stacked body.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 27, 2019
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato, Yasuyoshi Horikawa
  • Patent number: 10396017
    Abstract: A lead frame includes a frame part, a lead extending inward from the frame part and having a front surface and a back surface, and an external connection terminal formed at a part of the lead in an extension direction and protruding from the back surface of the lead. The lead includes a pentagonal shape in a cross-section where the front surface of the lead faces upward, the pentagonal shape having a quadrangular main body part and a triangular protrusion protruding from a lower surface of the main body part. A width of a lower end of the main body part is smaller than a width of an upper end of the main body part.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: August 27, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Konosuke Kobayashi, Koji Ato, Makoto Takeuchi
  • Patent number: 10396024
    Abstract: A wiring substrate includes a first insulating layer including a first through-hole formed through the first insulating layer in a thickness direction, a wiring layer formed on a lower surface of the first insulating layer, and a via wiring filled in the first through-hole and connected to the wiring layer, the via wiring having such a shape that it gradually becomes thinner from one side close to the lower surface of the first insulating layer toward the other side close to an upper surface of the first insulating layer, the via wiring including a first recess formed in an upper end surface of the via wiring. An upper end portion of the via wiring is an electrode pad for electric connection with an electronic component.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: August 27, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kosuke Tsukamoto
  • Patent number: 10386387
    Abstract: A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes formed at positions corresponding to the first through-holes, and a silicon oxide layer formed on exposed surfaces of the first silicon substrate and the second silicon substrate.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: August 20, 2019
    Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., JAPAN ELECTRONIC MATERIALS CORPORATION
    Inventors: Kosuke Fujihara, Yuichiro Shimizu
  • Patent number: 10389084
    Abstract: An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: August 20, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yasuyuki Kimura
  • Patent number: 10386407
    Abstract: A socket has a main body that accommodates a PCBA (Printed Circuit Board Assembly) to be inspected. The PCBA includes a substrate mounted with an electronic component, and terminals protruding from the substrate and having side surfaces exposed at an outer peripheral surface of the substrate, and the terminals are positioned within a cavity or opening of the main body in a state in which the PCBA is accommodated in the cavity or opening. The socket further has probes respectively including a fixed part fixed to the main body, and a movable part movable with respect to the fixed part, and a pressing part to press against the movable part of the probe. The movable part includes a tip end part that moves to a position contactable to the side surface of one terminal within the cavity or opening, when the pressing part presses against the movable part.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: August 20, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazuyuki Kubota, Tomoki Kobayashi
  • Patent number: 10381253
    Abstract: An electrostatic chuck includes a dielectric layer and a conductive layer located inside the dielectric layer. The dielectric layer includes an upper surface and a plurality of protrusions protruding from the upper surface. Each of the protrusions includes a top portion that serves as an attraction surface on which a substrate is attracted. The dielectric layer includes a plurality of first dielectric portions and a second dielectric portion. The second dielectric portion surrounds each of the first dielectric portions in the upper surface of the dielectric layer. At least some of the first dielectric portions include the protrusions and are bonded to the conductive layer. Each of the first dielectric portions is formed from a material that differs from that of the second dielectric portion.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: August 13, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Kazuyoshi Miyamoto, Kazunori Shimizu
  • Patent number: 10383228
    Abstract: An electronic component device includes a first coreless wiring substrate, an electronic component mounted on the first coreless wiring substrate, a second coreless wiring substrate disposed above the first coreless wiring substrate and the electronic component such that the second coreless wiring substrate is spaced from the first coreless wiring substrate and the electronic component, a connection terminal that connects the first coreless wiring substrate and the second coreless wiring substrate, and a sealing resin filled between the first and second coreless wiring substrates. Each of the first and second coreless wiring substrates include an insulating layer, a wiring layer, and a reinforcing layer embedded in the insulating layer and provided in a region overlaying the electronic component.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: August 13, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Masahiro Kyozuka
  • Patent number: 10381292
    Abstract: A lead frame includes a plate portion provided with a first surface and a second surface, the second surface being opposite to the first surface; a protruding portion integrally formed with the plate portion to be protruded from the first surface of the plate portion, wherein a surface of the lead frame includes a work affected layer existing region at which a work affected layer is formed, and a work affected layer non-existing region at which a work affected layer is not formed, wherein a front end surface of the protruding portion is the work affected layer existing region, wherein a region of the first surface at which the protruding portion is not formed is the work affected layer non-existing region, and wherein the second surface of the plate portion includes the work affected layer non-existing region.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: August 13, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Koji Watanabe, Kentaro Kaneko
  • Publication number: 20190234692
    Abstract: A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.
    Type: Application
    Filed: January 11, 2019
    Publication date: August 1, 2019
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventor: Takahiko Kiso
  • Patent number: 10366949
    Abstract: A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via wiring. A first through hole of the first insulating layer is filled with the via wiring. The second wiring structure includes a second wiring layer and a second insulating layer. The second wiring layer is formed on an upper surface of the first insulating layer and an upper end surface of the via wiring. The second wiring layer partially includes a roughened surface. The second insulating layer is stacked on the upper surface of the first insulating layer and covers the second wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The roughened surface of the second wiring layer has a smaller surface roughness than the first wiring layer.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: July 30, 2019
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Noriyoshi Shimizu, Yusuke Gozu, Jun Furuichi, Akio Rokugawa, Takashi Ito