Abstract: A wiring board includes an insulating layer that is formed by using insulating resin and a wiring layer that is formed on a surface of the insulating layer. The wiring layer includes a first area in which a wire is formed, and a second area that includes a pad to which the wire formed in the first area is connected and that has a smaller wire width than the first area. The insulating layer includes a conductor portion that is formed by using a conductor in only a range that overlaps with the second area in plan view, and that is sandwiched between insulating resin.

Abstract: A wiring board includes a base material, a through hole that is formed in the base material, a magnetic member that is embedded in the through hole, and a plating film that covers end faces of the magnetic member exposed from the through hole. The magnetic member includes a conductor wire that is covered by a magnetic body. A wiring board manufacturing method includes forming a through hole in a base material, forming a magnetic member by covering a conductor wire by a magnetic body, embedding the magnetic member in the through hole, and forming a plating film that covers end faces of the magnetic member exposed from the through hole.

Abstract: A substrate fixing device includes an electrostatic chuck on a baseplate, and a porous body in a gas hole piercing through a substrate of the electrostatic chuck. The electrostatic chuck attracts an object onto a first surface of the substrate. The gas hole includes a first recess formed in a second surface of the substrate facing the baseplate and depressed toward the first surface, a second recess formed at the bottom of the first recess and depressed toward the first surface, and a through hole extending from the bottom of the second recess to the first surface. The first recess is entirely and the second recess is partly filled with the porous body. A region of the second recess unfilled with the porous body is a recess in the porous body depressed toward the second surface relative to where the bottom of the second recess communicates with the through hole.

Abstract: A wiring board includes a plurality of insulating layers each being made of flexible insulating resin, and a conductor layer that is laminated on the plurality of insulating layers and that has a conductor pattern. The conductor layer includes a conductor pattern that has a certain shape in which a plurality of unit patterns are connected in plan view. The unit pattern includes a U-shaped pattern, an inverted U-shaped pattern that is arranged such that an opening side is located away from an opening side of the U-shaped pattern, and a straight line pattern that connects center portions of the U-shaped pattern and the inverted U-shaped pattern.

Abstract: An embedded printed circuit board includes a first substrate, a semiconductor chip mounted on the first substrate, a second substrate provided on the first substrate via the semiconductor chip so that the semiconductor chip is sandwiched between the first substrate and the second substrate, a first resin filled between the semiconductor chip and the first substrate and having a cladding portion covering a side surface of the semiconductor chip, and a second resin filled between the first substrate and the second substrate and encapsulating the semiconductor chip and the first resin. The first resin includes a protrusion protruding from the cladding portion toward the second substrate.

Abstract: An electrostatic chuck includes: a base body having: a mounting face on which an object to be adsorbed is to be mounted; and a back face that is opposite to the mounting face; an insulating layer that is formed on the back face; a heating element that is built in the insulating layer and configured to generate heat; and at least one thermal diffusion layer that is built in the base body and configured to diffuse the heat generated by the heating element. The at least one thermal diffusion layer is formed of a material higher in thermal conductivity than the base body.

Abstract: An optical waveguide on a wiring substrate includes a first cladding layer, a first metallic film forming protrusion formed on the first cladding layer and including an inclined surface inclined with respect to an upper surface of the first cladding layer, a first metallic film formed on at least the inclined surface, a core layer formed on the first cladding layer so as to cover a portion of the first metallic film, a second cladding layer formed on the first cladding layer, so as to cover at least an upper surface and both side surfaces of the core layer, and a pair of first protrusions formed on the first cladding layer with the core layer interposed therebetween in a plan view and protruding from the first cladding layer, so as to be separated from the core layer and the first metallic film forming protrusion.

Abstract: A columnar metal component includes a first main surface, and a second main surface on an opposite side to the first main surface. The first main surface includes a first groove. The metal component includes a through-hole penetrating the metal component from the first main surface to the second main surface.

Abstract: An electrostatic chuck includes a ceramic plate, an adsorption electrode, a ground electrode, and a wiring. The adsorption electrode is built-in near one surface of the ceramic plate. The ground electrode is arranged in the ceramic plate between the other surface of the ceramic plate and the adsorption electrode, and can be connected to a ground potential. The wiring is connected to the ground electrode in the ceramic plate and extends to the one surface of the ceramic plate.

Abstract: A component-containing substrate includes a substrate base. The substrate base includes one or more wiring layers and one or more insulating layers and includes a cavity. The component-containing substrate further includes a pad at the bottom of the cavity and an electronic component bonded to a surface of the pad exposed in the cavity. A trench is formed in the surface of the pad, the trench continuing from the inside to the outside of the perimeter of the electronic component in a plan view.

Abstract: A loop heat pipe includes: an evaporator; a condenser; a liquid pipe; a vapor pipe; and a loop-like flow channel through which the working fluid flows. At least one of the evaporator, the condenser, the liquid pipe, and the vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer. The inner metal layer includes a porous body. The porous body includes: a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, wherein the first bottomed hole and the second bottomed hole partially communicates with each other through the pore; and a first column portion provided inside the first bottomed hole. The first column portion is bonded to the first outer metal layer.

Abstract: The electrostatic chuck includes an insulating substrate having a placement surface on which a suction target object is placed and an opposite surface provided on an opposite side to the placement surface; and a gas hole penetrating from the opposite surface to the placement surface. The gas hole has a first hole portion extending from the opposite surface toward the placement surface, a second hole portion extending from the placement surface toward the opposite surface, and a third hole portion provided between the first hole portion and the second hole portion and formed to communicate the first hole portion and the second hole portion each other. The first hole portion is provided not to overlap with the second hole portion in a plan view.

Abstract: An optical module includes a first cladding layer formed on a substrate, a first groove extending through the first cladding layer in a thickness direction, and a second cladding layer formed on the first cladding layer. The optical module further includes a second groove extending through the first cladding layer and the second cladding layer in the thickness direction, a silicon photonics component mounted on the first cladding layer, and a single-mode fiber fitted into the second groove. The silicon photonics component includes a main body and an optical axis located below the main body. The lower surface of the main body is in contact with the upper surface of the first cladding layer. The optical axis is retained within the first groove. A circumferential surface of the single-mode fiber is in contact with a bottom surface of the second groove and a wall surface of the second groove.

Abstract: An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.

Abstract: An embedded PCB includes a first substrate, an electronic component mounted on the first substrate, a second substrate provided on a side opposite to the first substrate with the electronic component interposed therebetween, and electrically connected to the first substrate via substrate bonding members, and an encapsulating resin filled between the first and second substrates, covering the electronic component, and also filled between the electronic component and the first substrate. The first substrate includes, on a side closer to the electronic component, pads to be bonded to electrodes of the electronic component via bonding portions, and a protective insulating layer including openings. The pads include outermost peripheral pads in an outermost periphery including four corners of an approximately rectangular area in a plan view, and inner pads in an area surrounded by the outermost peripheral pads.

Abstract: An interconnect substrate includes an insulating resin layer having a first surface and a second surface opposite the first surface, a redistribution layer provided on the first surface of the insulating resin layer, a first connection terminal exposed at the second surface of the insulating resin layer, and a conductive via provided in the insulating resin layer to electrically connect the redistribution layer and the first connection terminal, wherein the insulating resin layer includes a first resin layer constituting the second surface and containing a first filler, a second resin layer provided on the first resin layer, and a third resin layer provided on the second resin layer, the third resin layer containing a second filler and constituting the first surface, and wherein an average particle diameter of the first filler is greater than an average particle diameter of the second filler.

Abstract: A ceramic substrate includes a substrate main body, and a conductor layer provided inside of the substrate main body. The substrate main body includes an insulator layer that is ceramics composed of aluminum oxide, and a composite oxide layer of aluminum and silicon, the composite oxide layer being formed between the insulator layer and the conductor layer.

Abstract: A wiring board includes a wiring layer, an insulating layer, a plurality of opening portions, and a connection terminal. The insulating layer is laminated on the wiring layer and covers a wiring pattern. Each of the plurality of opening portions penetrates through the insulating layer to the wiring pattern. The connection terminal is formed on the respective opening portions and comes into contact with the upper surface of the wiring pattern. The wiring layer includes a first wiring pattern, and a second wiring pattern that is formed of a plurality of laminated metal layers and that is thicker than the first wiring pattern. An upper surface of a metal layer serving as an uppermost layer of the second wiring pattern is a contact surface with the connection terminal and has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer.

Abstract: A wiring substrate includes an insulating layer, a pad in a via hole piercing through the insulating layer and exposed at a first surface of the insulating layer, a via conductor on the pad in the via hole, and a wiring part on a second surface of the insulating layer facing away from the first surface. The wiring part is connected to the pad through the via conductor in the via hole.

Abstract: A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate and configured to adsorb a substrate by electrostatic force. The electrostatic chuck includes: a ceramic layer that is formed of a ceramic and that is configured to adsorb the substrate in a state that the ceramic layer contacts the substrate; a first heater pattern that is disposed on the ceramic layer and configured to generate heat; an insulating resin layer that is disposed on the first heater pattern to cover the first heater pattern; a second heater pattern that is disposed on the insulating resin layer and configured to generate heat; and an electrically conductive member that penetrates the insulating resin layer such that one end of the electrically conductive member contacts a surface of the first heater pattern and the other end of the electrically conductive member contacts a surface of the second heater pattern.