Abstract: In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary.

Abstract: The printed circuit boards (LP) are conducted through treatment baths (BB1 through BB3) in vertical attitude on at least two horizontal conveying paths (TW1 through TW4) proceeding next to one another, these treatment baths being accommodated in treatment cells (BZ10 through BZ13, BZ20 through BZ23, BZ30 through BZ33) that are arranged successively and next to one another. The end walls of the treatment cells are provided with vertical slots (S) and allocated seals (D) for the passage of the printed circuit boards. The bath liquid emerging from treatment cells arranged next to one another is collected in common collecting tanks (AW1 through AW3) and is returned into the treatment cells with the assistance of pumps (P). A common treatment cell for treatment zones lying next to one another can also be provided in a common collecting tank. The conveying of the printed circuit boards on the conveying paths lying next to one another preferably ensues with a common conveyor device.

Abstract: The plate-shaped workpieces (W) are conducted through a treatment cell (BZ) containing a treatment bath in vertical attitude on a horizontal conveying path with the assistance of contacting and conveying means, the end walls of said treatment cell having vertical slots for the passage of the workpieces (W). The bath liquid emerging from the treatment (BZ) is collected in a collecting tank and is returned such into the treatment cell (BZ) with the assistance of a pump that an at least largely vertical flow direction (SR) derives at both sides of the conveying path. The bath liquid is diverted toward the surface of the workpieces (W) with guide devices (LV) arranged at both sides of the convoying path in the treatment cell (BZ). An improved ion exchange in the region of the workpieces (W) is effected by the guide devices (LV). In, for example, the electrolytic treatment of printed circuit boards, the metal deposition can thus be undertaken with high current densities.

Abstract: The flat workpieces (W) are conveyed in the vertical position on a horizontal transport path through at least one processing cell (BZ) that contains a processing bath, vertical slots (S) for the passage of the workpieces (W) being provided in the end walls of the processing cell (BZ). Bars or rods which are arranged in pairs in the processing bath, such that they are loose in the vertical direction, are assigned in pairs to the slots (S) as seals (D) and are pressed by the liquid pressure against one another or against the workpiece (W) respectively passing through, and against the assigned end wall of the processing cell (BZ). Seals (D) having a circuilar cylindrical cross section rotate while the workpieces (W) are passing through. The seals (D) are preferably arranged in end chambers (SK) which are fitted at the ends to the processing cells.