Patents Assigned to Silecs Oy
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Patent number: 9884879Abstract: A method for preparation and polymerization of siloxane monomers of Formula I is presented. The synthesis includes the selective reaction between silanol containing unit and alkoxy containing units in the presence of basic catalyst. The siloxane monomers of the invention can be used for preparation of siloxane polymers with good flexibility and cracking threshold, and functional sites, useful for applications requiring low metal content in semiconductor industry.Type: GrantFiled: September 30, 2016Date of Patent: February 6, 2018Assignee: Silecs OyInventor: Jyri Paulasaari
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Patent number: 9458183Abstract: A method for preparation and polymerization of siloxane monomers of Formula I is presented. The synthesis includes the selective reaction between silanol containing unit and alkoxy containing units in the presence of basic catalyst. The siloxane monomers of the invention can be used for preparation of siloxane polymers with good flexibility and cracking threshold, and functional sites, useful for applications requiring low metal content in semiconductor industry.Type: GrantFiled: June 14, 2012Date of Patent: October 4, 2016Assignee: Silecs OyInventor: Jyri Paulasaari
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Patent number: 9190616Abstract: Synthesis of thianthrene moiety containing silane and germane monomers and their polymerization is presented. The polymers show high refractive index, high transparency and excellent thermal stability. They are useful as dielectric films for semiconductor industry and for optical applications, including high-RI materials in CMOS image sensors.Type: GrantFiled: June 14, 2012Date of Patent: November 17, 2015Assignee: Silecs OyInventors: Jyri Paulasaari, Juha T. Rantala
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Patent number: 8952121Abstract: A novel novolac prepared by acid catalyzed condensation between biphenols or bisphenofluorenes and fluorenone is presented. The polymers exhibit excellent oxidative thermal stability and high carbon content, suitable for dielectric, etch stop applications as spin-on material.Type: GrantFiled: June 6, 2012Date of Patent: February 10, 2015Assignee: Silecs OYInventor: Jyri Paulasaari
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Publication number: 20140217539Abstract: A semiconductor device comprising a semiconductor substrate with a plurality of photo-diodes arranged in the semiconductor substrate with interconnect layers defining apertures at the photo-diodes and a first polymer which fills the gaps such as to cover the photo-diode. Further, layers of color filters are arranged on top the gap filling polymer layer opposite to the photo-diodes and a second polymer arranged on the interconnect layers covers and planarizes and passivates the color filter layers. On top of the planarizing polymer there is a plurality of micro-lenses opposite to the color filters, and a third polymer layer is deposited on the micro-lenses for passivating the micro-lenses. According to the invention the polymer materials are comprised of a siloxane polymer which gives thermally and mechanically stable, high index of refraction, dense dielectric films exhibiting high-cracking threshold, low pore volume and pore size.Type: ApplicationFiled: April 10, 2014Publication date: August 7, 2014Applicant: Silecs OyInventor: Juha T. Rantala
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Patent number: 7955660Abstract: A method for producing a polymer for semiconductor optoelectronics, comprising the steps of providing a monomer is produced having the formula: wherein: R1 is a hydrolysable group R2 is hydrogen, and R3 is a bridging linear or branched bivalent hydrocarbyl group, said monomer being produced by hydrosilylation of the corresponding starting materials, and homo- or copolymerizing the monomer to produce a polymer.Type: GrantFiled: September 30, 2009Date of Patent: June 7, 2011Assignee: Silecs OyInventors: Juha T. Rantala, Jyri Paulasaari, Jarkko Pietikäinen
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Patent number: 7833820Abstract: A method of producing a polymer composition for semiconductor optoelectronics, comprising the steps of providing at least one type of disilane monomer which is homo- or copolymerized to form a (co)polymer and then combined with nanoparticles to provide a polymer composition. The nanoparticle containing composition has excellent properties with high refractive index or dielectric constant.Type: GrantFiled: December 13, 2007Date of Patent: November 16, 2010Assignee: Silecs OyInventor: Juha Rantala
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Patent number: 7646081Abstract: Method for forming a low dielectric constant structure on a semiconductor substrate by CVD processing. The method comprises using a precursor containing chemical compound having the formula of (R1-R2)n-Si—(X1)4-n, wherein X1 is hydrogen, halogen, acyloxy, alkoxy or OH group, R2 is an optional group and comprises an aromatic group having 6 carbon atoms and R1 is a substituent at position 4 of R2 selected from an alkyl group having from 1 to 4 carbon atoms, an alkenyl group having from 2 to 5 carbon atoms, an alkynyl group having from 2 to 5 carbon atoms, Cl or F; n is an integer 1-3. The present precursors allow for a lowering of the electronic dielectric constant compared to conventional dielectric materials, such as silicon dioxide or phenyl modified organo-containing silicon dioxide.Type: GrantFiled: July 8, 2004Date of Patent: January 12, 2010Assignee: Silecs OyInventor: Juha T. Rantala
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Patent number: 7643717Abstract: Waveguides are disclosed (and other devices and materials including but not limited to hybrid organic-inorganic coatings, passivation materials, glob top materials, underfill materials, materials for IC and other applications, microlenses and any of a wide variety of optical devices) that benefit by being formed of a novel hybrid organic-inorganic material. In one embodiment of the invention, a method for making a waveguide includes: forming a lower cladding layer on a substrate; forming a core layer after the lower cladding layer; and forming an upper cladding layer after the core layer; wherein the lower cladding layer, core layer and/or upper cladding layer comprises a hybrid organic-inorganic material—that has many desirable properties relating to stability, hydrophobicity, roughness, optical absorbance, polarization dependent loss, among others.Type: GrantFiled: May 17, 2002Date of Patent: January 5, 2010Assignee: Silecs OyInventors: Juha T. Rantala, Arto L. T. Maaninen, T. Teemu T. Tormanen, Tiina J. Maaninen, Jarkko J. Pietikainen
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Patent number: 7622399Abstract: A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1° C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.Type: GrantFiled: March 10, 2004Date of Patent: November 24, 2009Assignee: Silecs OyInventors: Jason Reid, Nigel Hackera, Nina Pirilä, Juha Rantala, William McLaughlin
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Patent number: 7514709Abstract: A low dielectric constant polymer, comprising monomeric units derived from a compound having the general formula I (R1—R2)n—Si—(X1)4-n, wherein each X1 is independently selected from hydrogen and inorganic leaving groups, R2 is an optional group and comprises an alkylene having 1 to 6 carbon atoms or an arylene, R1 is a polycycloalkyl group and n is an integer 1 to 3. The polymer has excellent electrical and mechanical properties.Type: GrantFiled: April 13, 2004Date of Patent: April 7, 2009Assignee: Silecs OyInventors: Juha T. Rantala, Jyri Paulasaari, Janne Kylmä
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Patent number: 7504470Abstract: A thin film comprising a composition obtained by polymerizing a monomer having the formula I: wherein: R1 is a hydrolysable group, R2 is a polarizability reducing organic group, and R3 is a bridging hydrocarbon group, to form a siloxane material. The invention also concerns methods for producing the thin films. The thin film can be used a low k dielectric in integrated circuit devices. The novel dielectric materials have excellent properties of planarization resulting in good local and global planarity on top a semiconductor substrate topography, which reduces or eliminates the need for chemical mechanical planarization after dielectric and oxide liner deposition.Type: GrantFiled: August 31, 2005Date of Patent: March 17, 2009Assignee: Silecs OyInventors: Juha T. Rantala, Jyri Paulasaari, Janne Kylmä, Turo T. Törmänen, Jarkko Pietikäinen, Nigel Hacker, Admir Hadzic
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Patent number: 7479462Abstract: Thin films are disclosed that are suitable as dielectrics in IC's and for other similar applications. In particular, the invention concerns thin films comprising compositions obtainable by hydrolysis of two or more silicon compounds, which yield an at least partially cross-linked siloxane structure. The invention also concerns a method for producing such films by preparing siloxane compositions by hydrolysis of suitable reactants, by applying the hydrolyzed compositions on a substrate in the form of a thin layer and by curing the layer to form a film. In one example, a thin film comprising a composition is obtained by hydrolyzing a monomeric silicon compound having at least one hydrocarbyl radical, containing an unsaturated carbon-to-carbon bond, and at least one hydrolyzable group attached to the silicon atom of the compound with another monomeric silicon compound having at least one aryl group and at least one hydrolyzable group attached to the silicon atom of the compound to form a siloxane material.Type: GrantFiled: August 29, 2005Date of Patent: January 20, 2009Assignee: Silecs OyInventors: Juha T. Rantala, Jason S. Reid, Nungavram S. Viswanathan, T.Teemu T. Tormanen
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Patent number: 7473650Abstract: A method for making an integrated circuit is disclosed as comprising depositing alternating regions of electrically conductive and dielectric materials on a substrate, wherein an area of dielectric material is formed by: a silane precursor having a fully or partially fluorinated first organic group comprising an unsaturated carbon-carbon double bond, the fully or partially fluorinated organic group bound to silicon in the silane precursor; forming from the silane precursor a hybrid organic-inorganic material having a molecular weight of at least 500 on a substrate; and increasing the molecular weight of the hybrid material by exposure to heat, electromagnetic radiation or electron beam so as to break the unsaturated carbon-carbon double bond and cross link via the fully or partially fluorinated organic group.Type: GrantFiled: December 1, 2006Date of Patent: January 6, 2009Assignee: Silecs OyInventors: Juha T. Rantala, Jason S. Reid, T. Teemu T. Tormanen, Nungavram S. Viswanathan, Arto L. T. Maaninen
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Patent number: 7280731Abstract: Waveguides having high stability are disclosed (and other devices and materials including but not limited to coatings, passivation materials, glob top materials, underfill materials, materials for IC and other applications, microlenses and any of a wide variety of optical devices) that benefit by being formed of a novel hybrid organic-inorganic material. In one embodiment of the invention, a method for making a waveguide includes: forming a lower cladding layer on a substrate; forming a core layer after the lower cladding layer; and forming an upper cladding layer after the core layer; wherein the lower cladding layer, core layer and/or upper cladding layer comprises a stable material with a relatively high glass transition temperature. Preferably the material is one that does not degrade or otherwise physically and/or chemically change upon further processing or when in use. Preferably the stable waveguide material of the invention can be heated in supercritical water vapor at 2 atm and at 120 C.Type: GrantFiled: July 5, 2002Date of Patent: October 9, 2007Assignee: Silecs OyInventor: Juha T. Rantala
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Patent number: 7256467Abstract: A micro-electromechanical device is formed on a substrate. The device has sliding, abrading or impacting surfaces. At least one of these surfaces is covered with an anti-stiction material. The anti-stiction material is provided from a slicon compound precursor (e.g. silane, silanol) or multiple silicon compound precursors. Preferably the precursor(s) is fluorinated—more preferably perfluorinated, and is deposited with a solvent as a low molecular weight oligomer or in monomeric form. Examples include silanes (fluorinated or not) with aromatic or polycyclic ring sturctures, and/or silanes (fluorinated or not) having alkenyl, alkynyl, epoxy or acrylate groups. Mixtures either or both of these groups with alkyl chain silanes (preferably fluorinated) are also contemplated.Type: GrantFiled: June 4, 2003Date of Patent: August 14, 2007Assignee: Silecs OyInventors: Jason S. Reid, Nungavram S. Viswanathan
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Patent number: 7161019Abstract: A compound of the general formula R1MR4R5R6 is provided where R1 is a partially or fully fluorinated aryl, alkyl, alkenyl or alkynyl group, wherein M is selected from group 14 of the periodic table, wherein R4, R5 and R6 are independently an alkoxy group OR3 or a halogen group X—except, a) where R4, R5 and R6 are each ethoxy, M is Si and R1 is perfluorinated phenyl or perfluorinated vinyl; b) where R4 is ethoxy, R5 and R6 are chlorine, M is Si, and R1 is perfluorinated phenyl; or c) where R4, R5 and R6 are chlorine, M is Si, and R1 is perfluorinated phenyl, perfluorinated methyl or perfluorinated vinyl. This compound formed can be further reacted to attach an additional organic R group, and/or hydrolyzed, alone or with one or more similar compounds, to form a material having a molecular weight of from 500 to 10,000, which material can be deposited on various substrates as a coating or deposited and patterned for a waveguide or other optical device components.Type: GrantFiled: June 8, 2004Date of Patent: January 9, 2007Assignee: Silecs OyInventors: Juha A. Rantala, Arto L. T. Maaninen, Tina J. Maaninen, Jarkko J. Pietikainen
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Patent number: 7144827Abstract: A method for making an integrated circuit is disclosed as comprising depositing alternating regions of electrically conductive and dielectric materials on a substrate, wherein an area of dielectric material is formed by: a silane precursor having a fully or partially fluorinated first organic group comprising an unsaturated carbon-carbon double bond, the fully or partially fluorinated organic group bound to silicon in the silane precursor; forming from the silane precursor a hybrid organic-inorganic material having a molecular weight of at least 500 on a substrate; and increasing the molecular weight of the hybrid material by exposure to heat, electromagnetic radiation or electron beam so as to break the unsaturated carbon-carbon double bond and cross link via the fully or partially fluorinated organic group.Type: GrantFiled: January 17, 2003Date of Patent: December 5, 2006Assignee: Silecs OyInventors: Juha T. Rantala, Jason S. Reid, T Teemu T. Tormanen, Nungavram S. Viswanathan, Arto L. T. Maaninen
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Patent number: 7098346Abstract: A compound of the general formula: R1R2R4MR5, wherein R1, R2 and R4 are independently an aryl, alkyl, alkenyl or alkynyl group, wherein at least one of R1, R2 and R4 is fully or partially fluorinated, wherein M is selected from group 14 of the periodic table, and wherein R5 is either an alkoxy group, OR3, or a halogen group, X. This compound formed can be further reacted to attach an additional organic R group, and/or hydrolyzed with one or more similar compounds (preferably having one or two R groups bound to M), to form a material having a molecular weight of from 500 to 10,000, which material can be deposited on various substrates as a coating or deposited and patterned for a waveguide or other optical device components. Methods for making and using compounds of the general formula R1R2R4MR5 are also disclosed.Type: GrantFiled: December 8, 2004Date of Patent: August 29, 2006Assignee: Silecs OyInventors: Juha A. Rantala, Arto L. T. Maaninen, Tiina J. Maaninen, Jarkko J. Pietikainen
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Patent number: 7062145Abstract: Waveguides are disclosed (and other devices and materials including but not limited to hydrophobic coatings, passivation materials, glob top materials, underfill materials, dielectric materials for IC and other applications, microlenses and any of a wide variety of optical devices) that benefit by a high hydrophobicity and high stability and, among other things. In one embodiment of the invention, a method for making a waveguide comprises: forming a lower cladding layer on a substrate; forming a core layer after the lower cladding layer; and forming an upper cladding layer after the core layer; wherein the lower cladding layer, core layer and/or upper cladding layer is hydrophobic and results, if exposed to water, in a water contact angle of 90 degrees or more.Type: GrantFiled: May 17, 2002Date of Patent: June 13, 2006Assignee: Silecs OyInventors: Juha T. Rantala, Arto L. T. Maaninen, T. Teemu T. Tormanen, Tiina J. Maaninen, Jarkko J. Pietikainen