Abstract: Improved techniques for sensing and reporting power consumption from a single or multiple power supplies are disclosed. The disclosed techniques comprise integrated circuit solutions for sensing power. In some embodiments, an integrated circuit comprises circuitry for converting source voltage into a pulse-width modulation (PWM) signal and circuitry for modulating the PWM signal with a current sense signal to determine sensed power.

Abstract: A contactless encoder is disclosed. The encoder comprises a selector configured to select one of a plurality of states associated with the encoder. The encoder furthermore comprises an integrated circuit comprising a finite state machine configured to detect a currently selected state by the selector and generate an output signal corresponding to the detected currently selected state, wherein the currently selected state is detected based on a capacitive coupling between the selector and a portion of the encoder associated with the currently selected state.

Abstract: A security integrated circuit is disclosed. In some embodiments, the security integrated circuit comprises metal configured memory that stores a first portion of each of a plurality of keys, programmable memory that stores a second portion of each of the plurality of keys, and an interface for connecting to an external authentication system. The metal configured memory and programmable memory store a prescribed finite number of host keys and matching device keys. In response to a received host key from the external authentication system, a matching device key is provided by the security integrated circuit.

Abstract: A technique for enhancing the conduction of a p-channel device is disclosed. Specifically, a negative charge pump is configured to provide a gate drive voltage to a p-channel device. The negative charge pump creates a negative voltage potential below ground and facilitates increased gate drive for the p-channel device. The gate drive voltage output by the negative charge pump may be selected such that it is optimal for the p-channel device operation.

Abstract: Smart USB plug detection is disclosed. In some embodiments, a battery charger identification chip includes circuitry configured to determine whether an external USB device has been plugged into a USB port of an associated system while the system is in a sleep mode and includes a pin configured to output a control signal indicating whether an external USB device is plugged into the system, wherein when an external USB device is plugged into the system the control signal facilitates powering on a current limit switch that is otherwise powered off during the sleep mode and wherein the current limit switch facilitates regulated delivery of current to the plugged in external USB device.

Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.

Abstract: A low cost, high efficiency light-emitting diode design is disclosed. In some embodiments, a p-n junction of a light-emitting diode is formed in an epitaxial layer grown on a substrate. Grinding the backside of an associated wafer after encapsulation not only opens a light path for the light emitting diode but removes most residual defects.

Abstract: A lateral power MOSFET structure is disclosed. In some embodiments, a semiconductor device comprises substantially concentric source, channel, and drain regions; a metal layer at least in part comprising a drain plane disposed over the source, channel, and drain regions; and a metal layer at least in part comprising a source plane disposed over the source, channel, and drain regions.

Abstract: A single integrated circuit that supports both power switching and data switching is disclosed. In some embodiments, the integrated circuit comprises a driver circuit configured to drive a switch of an associated line in a power mode or in a data mode and one or more decoupling capacitor ground switches, wherein each decoupling capacitor ground switch connects an associated decoupling capacitor to ground in the power mode and wherein each decoupling capacitor ground switch leaves an associated decoupling capacitor floating in the data mode.

Abstract: An integrated circuit frequency generator is disclosed. In some embodiments, the frequency generator comprises an electronic oscillator configured to generate an oscillator frequency and calibration circuitry configured to periodically calibrate the electronic oscillator with respect to a reference frequency source. When a primary power source is unavailable, an output frequency is generated from the oscillator frequency, and the reference frequency source is powered-on only during calibration cycles.

Abstract: An integrated circuit for switching a transistor is disclosed. In some embodiments, an operational amplifier is configured to drive a transistor, and slew rate control circuitry is configured to control the slew rate of the transistor source voltage during turn on. The transistor source voltage is employed as feedback to the operational amplifier to facilitate closed loop control of the transistor source voltage during switching of the transistor.

Abstract: Improved techniques for sensing and reporting consumed power are disclosed. The disclosed techniques comprise an integrated circuit solution for sensing power. In some embodiments, such an integrated circuit comprises a resistor on which a sense voltage sensed across an external resistor in response to a load current is mirrored and an analog-to-digital converter configured to regulate the voltage across the resistor and output a binary value representing power. The binary value representing power may integrate one or more electrical or environmental parameters such as current, voltage, temperature, battery voltage, etc.

Abstract: Various techniques for dynamic power FET switching are disclosed. In some embodiments, a device comprises an array of two or more independently switchable power MOSFETs that are configured to sense current in a high current mode and a low current mode as well as circuitry for automatically switching from the low current mode to the high current mode when sensed current is above a threshold to switch to the high current mode.

Abstract: A capacitive coupling based proximity sensor is disclosed. In some embodiments, a sensor embedded in a mobile device comprises a transmitter configured to transmit a transmit signal and a receiver configured to receive a receive signal via capacitive coupling between the receiver and the transmitter as well as a circuit configured to detect human proximity to the mobile device in the event that the receive signal does not sufficiently match the transmit signal and configured to generate an output signal indicating human proximity to the mobile device that is employed to facilitate an appropriate response.

Abstract: A four pin integrated circuit MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) load switch is disclosed that provides full features including adjustable ramp time/rate, adjustable discharge time/rate, temperature control, over-current control, and short circuit protection. In some embodiments, the adjustable ramp is based on the voltage or current input into the integrated circuit.

Abstract: A capacitive coupling based sensor is disclosed. In some embodiments, a sensor comprises a transmitter and a receiver that are configured to be capacitively coupled when a coupling condition is satisfied as well as a circuit configured to determine whether a received signal that is received by the receiver matches a transmitted signal that is transmitted by the transmitter.

Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.

Abstract: An integrated circuit frequency generator is disclosed. In some embodiments, the frequency generator comprises an electronic oscillator configured to generate an oscillator frequency and calibration circuitry configured to periodically calibrate the electronic oscillator with respect to a reference frequency source. When a primary power source is unavailable, an output frequency is generated from the oscillator frequency, and the reference frequency source is powered-on only during calibration cycles.

Abstract: A four pin integrated circuit MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) load switch is disclosed that provides full features including adjustable ramp time/rate, adjustable discharge time/rate, temperature control, over-current control, and short circuit protection. In some embodiments, the adjustable ramp is based on the voltage or current input into the integrated circuit.

Abstract: An integrated circuit for switching a transistor is disclosed. In some embodiments, an operational amplifier is configured to drive a transistor, and slew rate control circuitry is configured to control the slew rate of the transistor source voltage during turn on. The transistor source voltage is employed as feedback to the operational amplifier to facilitate closed loop control of the transistor source voltage during switching of the transistor.