Patents Assigned to Silicon Valley Group, Inc.
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Patent number: 6414276Abstract: This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.Type: GrantFiled: March 7, 2000Date of Patent: July 2, 2002Assignee: Silicon Valley Group, Inc.Inventor: Dikran S. Babikian
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Patent number: 6387602Abstract: A reticle cleaning apparatus that utilizes an ultraviolet light source in an oxygen-containing environment to cleanse organic contaminants from a reticle. The reticle cleaning apparatus of the present invention enables the storage of multiple reticles for use in a lithography tool in an environment which contains organic contaminants. A stored reticle is translated to a reticle cleaning station within the lithography tool in order to cleanse the reticle of organic contaminants. This cleaning can be performed while the projection optics of the tool exposes a wafer using another reticle previously cleaned by the reticle cleaning apparatus. Upon completion of the reticle cleaning process, the reticle is immediately translated to the exposure path of the lithography tool. The reticle cleaning process is performed during normal operation of the lithography tool at room temperature, atmospheric pressure and in an oxygen-containing environment.Type: GrantFiled: February 15, 2000Date of Patent: May 14, 2002Assignee: Silicon Valley Group, Inc.Inventors: Cindy J. Hayden, David H. Peterson
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Patent number: 6369874Abstract: A windowless system and apparatus are provided that prevent outgases from contaminating the projection optics of an in-vacuum lithography system. The outgassing mitigation apparatus comprises a chimney that is substantially closed at one end, a duct fluidly coupled to the chimney, and a baffle disposed within the chimney. The chimney of the outgassing mitigation apparatus is funnel shaped at the end that is substantially closed. This end of the chimney has an opening that permits a beam or bundle of light to pass through the chimney. A rotating barrier, having at least one aperture for the passage of light, can be positioned near the chimney so that the rotating barrier substantially closes an open end of the chimney except when one of the apertures of the rotating barrier is passing by the chimney. This rotating barrier can be chilled by a refrigerator unit, which is radiantly coupled to a portion of the rotating barrier. A motor is used to rotate the barrier.Type: GrantFiled: April 18, 2000Date of Patent: April 9, 2002Assignee: Silicon Valley Group, Inc.Inventor: Santiago E. del Puerto
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Publication number: 20020027718Abstract: An optical reduction system for use in the photolithographic manufacture of semiconductor devices having one or more quarter-wave plates operating near the long conjugate end. A quarter-wave plate after the reticle provides linearly polarized light at or near the beamsplitter. A quarter-wave plate before the reticle provides circularly polarized or generally unpolarized light at or near the reticle. Additional quarter-wave plates are used to further reduce transmission loss and asymmetries from feature orientation. The optical reduction system provides a relatively high numerical aperture of 0.7 capable of patterning features smaller than 0.25 microns over a 26 mm×5 mm field. The optical reduction system is thereby well adapted to a step and scan microlithographic exposure tool as used in semiconductor manufacturing. Several other embodiments combine elements of different refracting power to widen the spectral bandwidth which can be achieved.Type: ApplicationFiled: April 25, 2001Publication date: March 7, 2002Applicant: Silicon Valley Group, Inc.Inventor: Justin L. Kreuzer
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Publication number: 20020027719Abstract: An optical reduction system with polarization dose sensitive output for use in the photolithographic manufacture of semiconductor devices having variable compensation for reticle retardation before the long conjugate end. The variable compensation component(s) before the reticle provides accurate adjustment of the polarization state at or near the reticle. The variable compensation components can be variable wave plates, layered wave plates, opposing mirrors, a Berek's compensator and/or a Soleil-Babinet compensator. The catadioptric optical reduction system provides a relatively high numerical aperture of 0.7 capable of patterning features smaller than 0.25 microns over a 26 mm×5 mm field. The optical reduction system is thereby well adapted to a step and scan microlithographic exposure tool as used in semiconductor manufacturing. Several other embodiments combine elements of different refracting power to widen the spectral bandwidth which can be achieved.Type: ApplicationFiled: April 25, 2001Publication date: March 7, 2002Applicant: Silicon Valley Group, Inc.Inventor: Justin L. Kreuzer
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Publication number: 20020021460Abstract: Characterization of an optical system is quickly and easily obtained in a single acquisition step by obtaining image data within a volume of image space. A reticle and image plane are positioned obliquely with respect to each other such that a reticle having a plurality of feature sets thereon, including periodic patterns or gratings, is imaged in a volume of space, including the depth of focus. Metrology tools are used to analyze the detected or recorded image in the volume of space through the depth of focus in a single step or exposure to determine the imaging characteristics of an optical system. Focus, field curvature, astigmatism, spherical, coma, and/or focal plane deviations can be determined. The present invention is particularly applicable to semiconductor manufacturing and photolithographic techniques used therein, and is able to quickly characterize an optical system in a single exposure with dramatically increased data quality and continuous coverage of the full parameter space.Type: ApplicationFiled: July 19, 2001Publication date: February 21, 2002Applicant: Silicon Valley Group, Inc.Inventor: Matthew E. Hansen
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Publication number: 20020011478Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.Type: ApplicationFiled: August 21, 2001Publication date: January 31, 2002Applicant: Silicon Valley Group, Inc.Inventors: Christopher Ratliff, Taiqing Qiu, Jeff Kowalski, Morteza Yadollahi, Saeed Sedehi
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Patent number: 6324003Abstract: A calcium fluoride (CaF2) stress plate provides a predetermined amount of optical delay. The CaF2 stress plate has surfaces that lie in CaF2 cubic planes, and delays an optical wavefront that is incident to a set of cubic planes along a transmission axis. To implement the desired delay, the CaF2 stress plate has a first index of refraction that is seen by a first field component of the optical wavefront, and a second index of refraction that is seen by a second field component of the optical wavefront. The optical delay of the stress plate is proportional to the differences between the two indexes of refraction. Embodiments of the invention include a method of fabricating the CaF2 stress plate from a sample of CaF2 material. The method includes the step of determining the orientation of the cubic planes for the CaF2 sample, as the sample is typically oriented along the cleave planes. Next, the sample is processed to generate a CaF2 plate whose surfaces are oriented in CaF2 cubic planes.Type: GrantFiled: December 23, 1999Date of Patent: November 27, 2001Assignee: Silicon Valley Group, Inc.Inventor: Gene Jay Martin
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Patent number: 6322337Abstract: The present invention provides systems and methods of dispensing liquids. In one embodiment, the system includes a pump with a removable pump module with at least one displacement piston and at least one piston valve. A motor and base assembly provide the supporting components of the pump which can be used in environments where precise small volumes of ultra-pure liquids must be transferred from a reservoir to a point of use. The preferred embodiment of the system prevents contaminants and air bubbles from being introduced into the liquid to be dispensed by placing a filter across the discharge line downstream from the pump, and providing a separate drawback line for performing the drawback of the liquid in the dispensing nozzle.Type: GrantFiled: July 24, 1999Date of Patent: November 27, 2001Assignees: Ivek Corporation, Silicon Valley Group, Inc.Inventors: Douglas S. Bensley, John E. Barney, Frank Dimaggio, Mark Tanny, Dikran Babikian
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Publication number: 20010038442Abstract: A method and apparatus for providing a purged optical path between an optical source surface and an optical target surface and for permitting relative movement between the optical source surface and the optical target surface is described. The apparatus includes a body, a central cavity, at least one gas supply bore, and at least one gas removal bore. The body defines first and second opposing surfaces. The first opposing surface is configured for positioning closely adjacent to the optical target surface. The second opposing surface is configured to mate with the optical source surface. The central cavity is formed in the body for passing light through the body, the central cavity being open at the first and second opposing surfaces. The at least one gas supply bore is formed in the body for suppling a flow of a purge gas to the central cavity.Type: ApplicationFiled: May 2, 2001Publication date: November 8, 2001Applicant: Silicon Valley Group, Inc.Inventors: Eric C. Hansell, Jose V. Herrera, Richard L. Huse, Jorge S. Ivaldi, Stephen G. Krehley, Thomas P. Shamaly
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Apparatus, system, and method for precision positioning and alignment of a lens in an optical system
Publication number: 20010033437Abstract: An apparatus, system, and method for precision positioning and alignment of a lens in an optical system, wherein a first support for coupling to the peripheral edge of the lens is connected to a concentric second support using a plurality of positioning devices. At least one positioning device is configured to move the first support in an axial direction relative to the second support. Each positioning device comprises a lever, an actuator, and a flexure. The lever has a pivot point and is mounted on the second support. The actuator is connected to the lever and used to operate the lever about its pivot point. The flexure has a first end connected to the lever between the actuator and the pivot point. A second end of the flexure is connected to the first support. A second positioning device is used to move the first support relative to the second support in a direction substantially perpendicular to the axial direction.Type: ApplicationFiled: April 25, 2001Publication date: October 25, 2001Applicant: Silicon Valley Group, Inc.Inventors: Michael F. Meehan, David G. Taub, Daniel N. Galburt -
Patent number: 6307682Abstract: The present invention provides an illumination system for varying the size of an illumination field incident to a scattering optical element. The illumination field is subsequently imaged to a reticle in a photolithographic process. The illumination system includes, in series along an optical axis of the illumination system, an optical source, a beam conditioner, a first optical integrator, a first or input collimating lens, a zoom array integrator (ZAI), a second or output collimating lens, the optical scattering element, a relay lens, and the reticle. The ZAI includes an assembly of fixed and moveable lens components arranged to vary the size of the illumination field throughout a zoom range of the ZAI while maintaining telecentric illumination at a substantially fixed numerical aperture. Illumination telecentricity and substantially fixed numerical apertures are maintained at both the scattering optical element and the reticle throughout the zoom range.Type: GrantFiled: February 16, 2000Date of Patent: October 23, 2001Assignee: Silicon Valley Group, Inc.Inventors: Jeffrey M. Hoffman, Joseph M. Kunick, Mark Oskotsky, Lev Ryzhikov
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Patent number: 6307619Abstract: A scanning framing blade apparatus includes a stationary assembly having a plurality of magnets; first and second carriage assemblies that each have a plurality of coils. The first and second carriage assemblies are supported on the stationary assembly by a plurality of air bearings that permit the first and second carriage assemblies to move in only one degree of freedom. In addition, the scanning framing blade apparatus includes first and second framing blades that are attached to the first and second carriage assemblies, respectively. The scanning framing blade apparatus also includes a controller that is coupled to the plurality of coils. The controller is adapted to energize at least one of the plurality of coils, thereby causing at least one of the carriage assemblies and corresponding framing blade to move in the one degree. This motion controls illumination onto a reticle during a substrate scanning process.Type: GrantFiled: March 23, 2000Date of Patent: October 23, 2001Assignee: Silicon Valley Group, Inc.Inventors: Daniel N. Galburt, Waiming Tam
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Patent number: 6302662Abstract: The present invention provides systems and methods of dispensing liquids. In one embodiment, the system includes a pump with a removable pump module with at least one displacement piston and at least one piston valve. A motor and base assembly provides the supporting components of the pump, which can be used in environments where precise small volumes of ultra-pure liquids must be transferred from a reservoir to a point of use. The preferred embodiment of the system prevents contaminants and air bubbles from being introduced into the liquid to be dispensed by placing a filter across the discharge line downstream from the pump, and providing a separate drawback line for performing the drawback of the liquid in the dispensing nozzle.Type: GrantFiled: March 9, 2000Date of Patent: October 16, 2001Assignees: Ivek Corporation, Silicon Valley Group, Inc.Inventors: Douglas S. Bensley, John E. Barney, Frank Dimaggio, Mark Tanny
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Patent number: 6300600Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.Type: GrantFiled: August 12, 1999Date of Patent: October 9, 2001Assignee: Silicon Valley Group, Inc.Inventors: Christopher Ratliff, Taiqing Qiu, Jeff Kowalski, Morteza Yadollahi, Saeed Sedehi
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Patent number: 6254936Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).Type: GrantFiled: December 29, 1998Date of Patent: July 3, 2001Assignee: Silicon Valley Group, Inc.Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Reese Reynolds, Scott C. Wackerman
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Patent number: 6248171Abstract: Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. An apparatus for minimizing fluid impingement force on a polymer layer to be developed on a substrate includes: a nozzle including: a developer manifold adapted to supply a developer fluid; a plurality of developer fluid conduits coupled to the developer manifold; a rinse manifold adapted to supply a rinse fluid; and a plurality of rinse fluid conduits coupled to the developer manifold.Type: GrantFiled: December 28, 1998Date of Patent: June 19, 2001Assignee: Silicon Valley Group, Inc.Inventors: Emir Gurer, Ed C. Lee, Murthy Krishna, Reese Reynolds, John Salois, Royal Cherry
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Patent number: 6246203Abstract: Systems and methods are described for direct skew control and interlock of a gantry. An apparatus includes a gantry that includes a first member defining a gantry primary axis Z, a cross member defining a secondary axis X that is coupled to the first member via a trunnion, and a second member defining a gantry primary axis Z′ coupled to the cross member via an elastic hinge. A method for controlling skew on a cross member moved by a first and second driver includes moving the first and second drivers to a first position, measuring a resulting skew value, and correcting the skew on the cross member by moving the first driver and/or the second driver.Type: GrantFiled: February 5, 1999Date of Patent: June 12, 2001Assignee: Silicon Valley Group, Inc.Inventors: Rexford Abbott, Son Phi
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Patent number: 6242364Abstract: An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.Type: GrantFiled: March 23, 1999Date of Patent: June 5, 2001Assignee: Silicon Valley Group, Inc.Inventors: Emir Gurer, Ed C. Lee, Richard Savage
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Patent number: 6238735Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.Type: GrantFiled: September 8, 1999Date of Patent: May 29, 2001Assignee: Silicon Valley Group, Inc.Inventors: Robert P. Mandal, James C. Grambow, Ted C. Dettes, Donald R. Sauer, Emir Gurer, Edmond R. Ward