Patents Assigned to Siliconware Precision Industries Co., Ltd.
  • Patent number: 11069661
    Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: July 20, 2021
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Patent number: 11069633
    Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 20, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Publication number: 20210210435
    Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.
    Type: Application
    Filed: August 19, 2020
    Publication date: July 8, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 11056442
    Abstract: A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body. The obtuse portion includes a plurality of turning surfaces to disperse the stress of the substrate body generated in the packaging process. Therefore, the substrate body is prevented from being cracked. A method for fabricating the substrate structure and an electronic package including the substrate structure are also provided.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: July 6, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
  • Patent number: 11056470
    Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 6, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu
  • Publication number: 20210203057
    Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.
    Type: Application
    Filed: April 27, 2020
    Publication date: July 1, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Rung-Jeng Lin, Han-Hung Chen, Shi-Min Zhou, Kuo-Hua Yu, Chang-Fu Lin
  • Publication number: 20210175196
    Abstract: A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.
    Type: Application
    Filed: March 17, 2020
    Publication date: June 10, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hsin-Yi Liao, Cheng-Kai Chang, Bo-Hao Ma, Chun-Chi Ke
  • Publication number: 20210104491
    Abstract: An electronic package is provided, including: a first carrying structure having a first circuit layer; a package module disposed on the first carrying structure and electrically connected to the first circuit layer; a first electronic component disposed on the first carrying structure and electrically connected to the first circuit layer; and a second electronic component stacked on and electrically connected to the first electronic component. As the second electronic component is stacked with the first electronic component, a surface area of the first carrying structure that the first and second electronic components occupy is reduced, and the electronic package can have sufficient space to accommodate the package modules. A method for fabricating an electronic package is also provided.
    Type: Application
    Filed: November 18, 2019
    Publication date: April 8, 2021
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Hsin-Yi Liao, Cheng-Kai Chang
  • Publication number: 20210082837
    Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.
    Type: Application
    Filed: May 6, 2020
    Publication date: March 18, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
  • Publication number: 20210083389
    Abstract: An electronic package and a method for manufacturing the same are provided, where at least one substrate structure having a second antenna portion is disposed on a carrier structure having a first antenna portion, and then an antenna structure having a first antenna body and a second antenna body is stacked on the carrier structure by a plurality of supporting members to cover the first antenna portion and the second antenna portion, so that the first antenna body corresponds to the first antenna portion, and the second antenna body corresponds to the second antenna portion. The substrate structure is disposed on the carrier structure to generate 5G millimeter waves of different frequencies, such that the antenna structure can generate different antenna signals based on needs.
    Type: Application
    Filed: August 19, 2020
    Publication date: March 18, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Piao Tung, Wen-Jung Tsai
  • Patent number: 10950507
    Abstract: An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads so as to facilitate electrical testing of the interposer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: March 16, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Lu-Yi Chen, Chi-Hsin Chiu, Shih-Kuang Chiu
  • Patent number: 10950520
    Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: March 16, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai, En-Li Lin, Kaun-I Cheng, Wei-Ping Wang
  • Patent number: 10945140
    Abstract: An automated antenna testing device is disclosed. A carrying stand for objects-to-be-tested to be carried thereon, and an antenna stand corresponding to the carrying stand are installed in a receiving space of a cavity part on a machine part, and a conveyance device for moving the objects-to-be-tested to the carrying stand is installed on the machine part. The conveyance device and the cavity part are installed independently, therefore, an OTA testing environment can be prevented from being affected by external factors.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: March 9, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Cheng-Tsai Hsieh, Cheng-Shao Chen
  • Patent number: 10916838
    Abstract: An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: February 9, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chi-Liang Shih
  • Patent number: 10916526
    Abstract: A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: February 9, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Chih-Chiang He
  • Patent number: 10903547
    Abstract: An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: January 26, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen
  • Patent number: 10903088
    Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: January 26, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shu-Chi Chang, Wei Ping Wang, Hsien-Lung Hsiao, Kaun-I Cheng
  • Patent number: 10903167
    Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: January 26, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu
  • Patent number: 10872847
    Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 22, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
  • Patent number: 10872870
    Abstract: The present invention provides a semiconductor structure and a method of fabricating the same. The method includes: providing a chip having conductive pads, forming a metal layer on the conductive pads, forming a passivation layer on a portion of the metal layer, and forming conductive pillars on the metal layer. Since the metal layer is protected by the passivation layer, the undercut problem is solved, the supporting strength of the conductive pillars is increased, and the product reliability is improved.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: December 22, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yi-Cheih Chen, Sung-Huan Sun, Cheng-An Chang, Chien-Hung Wu, Fu-Tang Huang