Abstract: A vacuum lock for a vacuum coating plant comprises a chamber for receiving a substrate carrier, wherein the chamber comprises a first and a second inner surface. A conveyor is configured for conveying the substrate carrier. The vacuum lock comprises a flow channel assembly for evacuating and venting the chamber, the flow channel assembly being configured to cause a gas flow between both the first inner surface and a first substrate carrier surface facing the first inner surface and between the second inner surface and a second substrate carrier surface facing the second inner surface. The substrate carrier can be positioned between the first and the second inner surfaces such that a ratio of a first distance between the first inner surface and the first substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1, and a ratio of a second distance between the second inner surface and the second substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1.

Abstract: The disclosure relates to a method of determining a velocity profile for the movement of a substrate to be coated relative to a coating source.

Abstract: A device for treating substrates by a treating liquid has at least one rotatably supported support roller which a substrate to be treated rests on during operation. The support roller has a hollow cylinder having a porous rigid material which the substrate to be treated rests on during operation. The device is configured to deliver, during operation, treating liquid via the interior of the hollow cylinder of the at least one support roller through the porous rigid material to the external surface of the hollow cylinder in order to treat at least one surface of the substrate by the treating liquid. The device is configured to treat several substrates in the form of plate-shaped separate wafers arranged one behind the other and/or next to one another in the device, by the treating liquid and to transport the substrates in a transport plane during the treatment.

Abstract: An illuminant comprising a transparent substrate layer with a first index of refraction, a connecting layer with a second index of refraction that differs from the first index of refraction, and a metallic, translucent layer, wherein the connecting layer is arranged between the substrate layer and the metallic layer, and wherein on the side facing the connecting layer the substrate layer comprises a plurality of decoupling structures suitable for decoupling light that propagates within the substrate layer from the substrate layer in the direction towards the metallic layer.

Abstract: A vacuum lock for a vacuum coating plant comprises a chamber for receiving a substrate carrier, wherein the chamber comprises a first and a second inner surface. A conveyor is configured for conveying the substrate carrier. The vacuum lock comprises a flow channel assembly for evacuating and venting the chamber, the flow channel assembly being configured to cause a gas flow between both the first inner surface and a first substrate carrier surface facing the first inner surface and between the second inner surface and a second substrate carrier surface facing the second inner surface. The substrate carrier can be positioned between the first and the second inner surfaces such that a ratio of a first distance between the first inner surface and the first substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1, and a ratio of a second distance between the second inner surface and the second substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1.

Abstract: The disclosure relates to a method of determining a velocity profile for the movement of a substrate to be coated relative to a coating source.

Abstract: An illuminant comprising a transparent substrate layer with a first index of refraction, a connecting layer with a second index of refraction that differs from the first index of refraction, and a metallic, translucent layer, wherein the connecting layer is arranged between the substrate layer and the metallic layer, and wherein on the side facing the connecting layer the substrate layer comprises a plurality of decoupling structures suitable for decoupling light that propagates within the substrate layer from the substrate layer in the direction towards the metallic layer.

Abstract: A system and a corresponding method for simultaneous rotation and levitation of a substrate during deposition and/or etching of the substrate are disclosed. The system comprises a carrier located below the substrate, wherein the carrier comprises at least two gas inlets to provide gas to a bottom surface of the substrate to levitate the substrate above the carrier. The system further comprises at least one holding member connected to the carrier and being configured to restrict horizontal drifting of the substrate.

Abstract: A system for gas phase deposition comprises a gas injector configured to process gases to a substrate for gas phase deposition onto the substrate. The gas injector comprises a first flow path and a second flow path different from the first flow path. The system comprises a first temperature adjustment mechanism associated with the first flow path to control a temperature of a process gas passing through the first flow path. The system comprises a second temperature adjustment mechanism associated with at least the second flow path to control a temperature of a process gas passing through the second flow path. The first temperature adjustment mechanism and the second temperature adjustment mechanism are operable independently of each other. The system is configured to cause rotation and levitation of the substrate during etching of the substrate and/or deposition.

Abstract: A continuous system for transmitting accelerating forces and decelerating forces by interlocking, consisting of at least one carrier system having at least two connecting elements, a plurality of transport systems arranged one behind the other, wherein each transport system has a cam drum or cylindrical cam having a helical groove and the connecting elements of the carrier system are suitable for interlockingly engaging with the groove of the cam drum, and at least one motor, which drives the cam drums.

Abstract: A method and a device for stringing together objects in transport systems, preferably in coating systems, for adjusting the distance between two objects, preferably substrates or substrate holders, being arranged one behind the other, wherein the front object moves at a process speed vp in the transport system and the rear object is at an undefined distance from the front object. The method comprises the following steps: (a) accelerating the rear substrate to an initial speed vx>vp; (b) detecting an increase in the driving torque when the rear substrate moves against the front substrate; (c) delaying the rear substrate by a predetermined value in order to establish a predetermined distance ap from the front substrate; and (d) adjusting the speed of the rear substrate to the process speed vp.

Abstract: A system and method for treating a substrate in a reaction chamber. A transfer chamber is arranged between a first lock and a second lock, wherein the second lock is provided between the transfer chamber and the reaction chamber. A substrate is transferred into the transfer chamber through the first lock, and the first lock is closed. In a next step, the transfer chamber is flooded with the same gas as in the reaction chamber and the pressure and temperature of the gaseous atmosphere in the transfer chamber is controlled to be the same as in the reaction chamber. Then, the second lock is opened and the substrate is transferred from the transfer chamber into the reaction chamber to treat the substrate. A computer program product for carrying out the above method.

Abstract: The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and a method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.

Abstract: The invention relates to a method and a device for aligning substrates (2) in an XY-plane. A polygonal, flat substrate (2), the substrate plane of which is parallel to the XY-plane or lies in the XY-plane, is aligned with respect to reference coordinates and a reference angular position in the XY-plane. A corner (12) of the substrate (2) is detected using image detecting means (9). In addition, the position coordinates of the substrate (2) are determined. Using evaluating means (10), the angular position of the corner (12) of the substrate (2) in the XY-plane is determined, and the position differences between the reference coordinates and the position coordinates as well as the angle difference between the reference angular position and the angular position of the substrate corner (12) are calculated. The substrate (2) is moved and/or rotated in the XY-plane according to the determined position difference or the angle difference.

Abstract: A method for coating a substrate with an AlOx layer, in particular an Al2O3 layer, comprising the following method steps: (a) providing an inductively coupled plasma source (ICP source) having a reaction chamber and at least one RF inductor, (b) introducing an aluminium compound, preferably trimethylaluminium (TMA) into the ICP source, (c) introducing oxygen and/or an oxygen compound as reactive gas into the ICP source and inductively coupling of energy into the ICP source for forming a plasma, and (d) depositing the AlOx layer on the substrate. The invention also relates to a coating assembly for depositing thin layers on a substrate, in particular for carrying out the above method. The coating assembly comprises an inductively coupled plasma source (ICP) having a reaction chamber and at least one RF inductor, a substrate holder for arranging the substrate in the reaction chamber and channels for introducing the aluminium compound and a reactive gas in the ICP source.

Abstract: An object (1) is identified based on the unique, characteristic, optical properties (10) before the object is processed in a facility (3). In addition, a clear identification is assigned to the object (1). All production data and process parameters for all facilities (3) through which the object (1) passes are stored together with the identification in an electronic data processing means (6). After the object (1) has passed through a facility (3), the object (1) can be identified again based on its unique, characteristic, optical properties (10). Thus, it can be examined whether the system for tracking the object (1) within a production facility (3) functions without errors. Alternatively, the new identification can also be used to assign a new identification to an object (1) for which the unique, characteristic, optical properties (10) have changed during the production process.

Abstract: A method for operating a first and a second electrical load or consumer in an alternating current network. The method can be operated in an optional first operating mode, in which the positive and negative half waves for each load are controlled with a first leading edge phase angle. In addition, a second operating mode is provided, in which a first part of the positive and negative half waves for the first load and a second part of the positive and negative half waves for the second load are controlled with respective second leading edge phase angles. Furthermore, a device for performing the method, having first and second leading edge phase-angle control for the first and second loads.

Abstract: A device for transporting a substrate (5) into a working area (2, 3, 22) which can be temporarily separated in a vacuum-tight manner, and a corresponding method. A transport element (4) transports a substrate (5) in the plane (XY) to a defined working area (2, 3, 22) of a chamber (1). The transport element (4) has a deflectable sealing frame (6) which can be moved in a Z-direction perpendicular with respect to the XY-plane. The sealing frame (6) has two opposing sealing surfaces (10, 11) in the Z-direction. By pressing a closure element (16, 21, 24) against a first sealing surface (10, 11) and thus pressing the second sealing surface (11, 10) against a chamber wall (32, 31), the space of the working area (2, 3, 22) of the chamber (1) can be sealed.

Abstract: The invention describes a method and a device for introducing and removing substrates. Substrates (5) are transported into a lock (2) by a transport element (4). A collection container (3) is located in the lock below the substrates (5) for collecting possible substrate fragments (19). The substrates (5) are removed together with the collection container (3) and the lock cover (18) once the lock (2) has been flooded. The lock cover (18) and the collection container (3) form an almost closed box around the substrates (5). After the substrates (5) have been replaced and the collection container (3) has been emptied, the new substrates (5) are introduced together with the collection container. All the steps are carried out in the machine cycle to ensure an effective production process.

Abstract: A die stamper assembly comprises a first die part for holding a first stamper and a second die part for mounting a second stamper, the die parts cooperating to define a mould cavity. The first stamper is mounted at a boundary of the first die part and the second stamper is mounted at a boundary of the second die part. The die stamper assembly further comprises a venting ring configured around and moveable with respect to the first die part and defining an outer boundary of the mould cavity. A venting holder arranged for holding the circumference of the first stamper and positioned between the first die part and the venting ring to attach the first stamper on the first die part allows venting of air escaping from the mould cavity and prevents leaking of plastic material out of the mould cavity.