Abstract: A cable includes an insulating part and one or more conducting parts disposed inside the insulating part. The insulating part includes a polymer resin layer with a product of shrinkage ratios CMD*TD, which is expressed as a product of a longitudinal shrinkage ratio and a transverse shrinkage ratio, of less than 0.24.

Abstract: One embodiment may provide a method for producing a polyimide film, the method comprising the steps of: polishing the surface of a casting body; producing a gel sheet by casting a precursor on the polished surface of the casting body, and drying same; and producing a polyimide film by heat-treating the gel sheet, wherein the roughness of the polished surface of the casting body is 0.1 nm to 160 nm, and when the area of the casting body onto which the precursor is casted is partitioned by 1 cm×1 cm, the area corresponding to a defect reduction region is at least 90%, and the polyimide film has a yellowness of at most 3, a haze of at most 1%, a permeability of at least 88%, a modulus of at least 5.0 GPa and a surface hardness of at least HB.

Abstract: A film for glass bonding includes a thiourethane layer comprising a heterocyclo-alkanediyl-based repeat unit indicated by Formula 1, and a linear alkanediyl-based repeat unit indicated by Formula 2, and a base layer, disposed on a surface of the thiourethane layer, comprising a polyvinyl acetal resin and a plasticizer. In the Formula 1, R1 is —O— or —S—, and X is a heterocyclo-alkanediyl group having carbon atoms of 3 to 10 and sulfur atoms of 1 to 5, and in the Formula 2, R2 is —O— or —S—, and n2 is an integer of 4 to 10.

Abstract: A film for glass lamination includes a metal salt or a metal ion. A first absolute value in a gradient of concentration of metal ions within a depth of 6 to 45 nm from a surface of the film is greater than a second absolute value in the gradient of the concentration of the metal ions within a depth of 86 to 125 nm from the surface. A first average value of the concentration of the metal ions within the depth of 6 to 45 nm is 2.5 times or more than a second average value of the concentration of the metal ions within the depth of 86 to 125 nm.

Abstract: A laminated film for bonding includes: a skin layer comprising a first polyvinyl acetal resin and a first plasticizer; and a core layer comprising a second polyvinyl acetal resin and a second plasticizer, wherein the core layer comprises a metal salt having a refractive index higher than a refractive index of the second plasticizer, wherein a difference between a refractive index of the skin layer and a refractive index of the core layer is 0.0060 or less, and wherein the metal salt is a compound indicated by the following Formula 1: Mn·Xm??[Formula 1] in the Formula 1, M is magnesium (Mg), calcium (Ca), sodium (Na), or potassium (K), X is Cl, SO4, or NO3, and n and m are integers of 1 or 2, respectively.

Abstract: The laminated film for bonding comprises: a first layer; a second layer disposed opposite to the first layer; and a third layer interposed between the first layer and the second layer, wherein the laminated film comprises a first end having a first thickness and a second end having a second thickness different from the first thickness, and a measuring area disposed between the first end and the second end and having a center thickness, wherein the center thickness is less than or equal to a middle value of the first thickness and the second thickness, wherein a penetration coefficient (Fpe) at the measuring area is 1.35 kgf/mm2*mm or more, and wherein, a ratio of a sum of a thickness of the first layer and a thickness of the second layer to a thickness of the third layer is 100:12 to 24.

Abstract: An embodiment relates to an aromatic polythiol compound for optical materials, and the aromatic polythiol compound according to the embodiment contains a phenyl group and a large number of sulfur atoms in its polythiol structure so that a polymerizable composition and an optical material obtained therefrom have excellent optical properties such as high refractive index and low specific gravity, as well as excellent mechanical properties such as low cure shrinkage; thus, they can be advantageously used for producing various plastic optical lenses such as eyeglass lenses and camera lenses.

Abstract: One embodiment may provide a polyamide-imide film which is colorless and transparent while having an adequate level of solubility and excellent mechanical properties, the polyamide-imide film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, for a square cross-section of 1 cm×1 cm and a thickness of 30 um to 100 mm, the polyamide-imide film has a dissolution time of 5-60 minutes in 10 ml of dimethylacetamide (DMAc), and for a thickness of 50 mm, the polyamide-imide film has a yellowness of at most 5, a haze of at most 2%, a permeability of at least 85% and a modulus of at least 5.0 GPa.

Abstract: Example embodiments provide a resin layer, a light transmitting laminate, and a vehicle. The resin layer includes at least one laminating layer containing a polyvinyl acetal resin, a plasticizer, and a bonding strength modifier. The surface of the laminating layer includes a portion having a hydrophobicity of 3.5 to 10, as calculated by Equation 1: Hydrophobicity=Non-polarity/polarity??(1) where the non-polarity represents the non-polar fraction of the surface free energy of the laminating layer and the polarity represents the polar fraction of the surface free energy of the laminating layer. The resin layer has good shelf moisture resistance, undergoes less change in yellowness index, and has effectively controllable bonding strength due to its controlled hydrophobicity.

Abstract: An embodiment relates to a packaging substrate turd a semiconductor device, the semiconductor device comprising: an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit, wherein a glass substrate is used as the core of the packaging substrate so as to achieve a closer connection between the semiconductor element and a motherboard, thereby allowing an electrical signal to be transmitted over as short a distance as possible. Accordingly, provided is a packaging substrate which can significantly improve electrical characteristics such as signal transmission speed, can substantially prevent the occurrence of a parasitic element and thus more simplify the insulation layer treatment process, and can be applied to a high-speed circuit.

Abstract: An embodiment relates to a loading cassette and a target substrate loading method to which same is applied. The loading cassette according to the embodiment comprises: an upper plate; a lower plate facing the upper plate while having a space therebetween; an edge support part for connecting the upper plate to the lower plate and supporting the left and right edges of a target substrate; and a rear surface support part for connecting the upper plate to the lower plate and supporting the center and the rear surface-edge of the target substrate.

Abstract: The embodiment relates to a packaging substrate and a semiconductor device, comprising an element unit comprising a semiconductor element; and a packaging substrate electrically connected to the element unit; and it applies a glass substrate as a core of the packaging substrate, thereby can significantly improve electrical properties such as a signal transmission rate by connecting the semiconductor element and a motherboard to be closer to each other so that electrical signals are transmitted through as short a path as possible. Therefore, it can significantly improve electrical properties such a signal transmission rate, substantially prevent generating of parasitic element, and simplify a process of treatment for an insulating layer, and thus provides a packaging substrate applicable to a high-speed circuit.

Abstract: Embodiments relate to a polymerizable composition comprising a phosphorus-based mold releasing agent for an optical use whose preparation process is improved, and a process for preparing the phosphorus-based mold releasing agent. The phosphorus-based mold releasing agents can be prepared more easily and conveniently by using phosphorous pentoxide, which can easily react with a monoalcohol and/or water at room temperature in the absence of a catalyst or a solvent. In addition, byproducts are not generated during the reaction. Thus, when a lens is produced by using the mold release agent obtained therefrom, it is possible to prevent a defective appearance of the lens that may be caused by byproducts, thereby further enhancing the appearance properties thereof. Further, since separate steps for removing byproducts, specifically, such steps as washing and filtration, are not required, wastewater is not generated.

Abstract: The polyvinyl acetal resin composition includes: a polyvinyl acetal resin, a plasticizer, a metal salt compound, and a benzotriazole-based compound, wherein the metal salt compound is a metal salt of hydroxyl carboxyl acid having two to sixteen carbon atoms, wherein the metal salt compound is included in an amount of less than 0.05 wt % based on a total weight of the polyvinyl acetal resin composition, and wherein the metal salt compound is included in an amount of 16 parts by weight or less based on the benzotriazole-based compound of 100 parts by weight.

Abstract: A bonding laminated film for bonding, and a light transmission laminate are provided. The bonding laminating film and the light transmission laminate comprise a first layer comprising a first surface and a second surface opposite to the first surface, and a second layer disposed inside the first layer and comprising a wedge part whose cross section is triangular or trapezoidal in a part or a whole of the second layer. The refractive index of the second layer is higher than the refractive index of the first layer. The bonding laminated film has an overall even thickness, and has anti-double-image elements in a desired area though a bonding laminated film, and has a substantially non-wedge shape.

Abstract: The polyvinyl acetal resin composition includes: a polyvinyl acetal resin, a plasticizer, a metal salt compound, and a benzotriazole-based compound, wherein the metal salt compound is a metal salt of hydroxyl carboxyl acid having two to sixteen carbon atoms, wherein the metal salt compound is included in an amount of less than 0.05 wt % based on a total weight of the polyvinyl acetal resin composition, and wherein the metal salt compound is included in an amount of 16 parts by weight or less based on the benzotriazole-based compound of 100 parts by weight.

Abstract: A packaging glass substrate for semiconductor includes a glass substrate with a first surface and a second surface facing each other, and a plurality of core vias penetrating through the glass substrate in a thickness direction, wherein a plain line is a line linking places where the core vias are not formed, a via line is a line linking places where the core vias are formed, a stress difference value (P) is a value according to Equation (1), and the stress difference value (P) is 1.5 MPa or less, Equation (1): P=Vp?Np where P is a stress difference value measured at the same glass substrate, Vp is a difference between the maximum value and the minimum value of stress measured at the via line, and Np is a difference between the maximum value and the minimum value of stress measured at the plain line.

Abstract: A packaging substrate includes a core layer including a glass substrate with a first surface and a second surface facing each other, and a plurality of core vias. The plurality of core vias penetrating through the glass substrate in a thickness direction, each comprising a circular core via having a circular opening part and a non-circular core via having a 1.2 or more aspect ratio in the x-y direction of an opening part. One or more electric power transmitting elements are disposed on the non-circular core via.

Abstract: A wafer having relaxation moduli different by 450 GPa or less, as determined by dynamic mechanical analysis, when loaded to 1 N and 18 N with a loading rate of 0.1 N/min at a temperature of 25° C.

Abstract: A semiconductor apparatus includes a semiconductor element unit comprising one or more semiconductor elements, a packaging substrate, and a motherboard. The packaging substrate, connected to the semiconductor elements, includes a core layer and an upper layer disposed on the core layer. The core layer includes a glass substrate, a core via, and a core distribution layer. The glass substrate having a first surface and a second surface facing each other. A part of the core distribution layer connects electrically conductive layers of the first surface and an electrically conductive layer of the second surface through the core via penetrating through the glass substrate. A thickness of a thinner one among electrically conductive layers of the core distribution layer is the same as or greater than a width of a thinner one among the electrically conductive layers of the upper layer.