Patents Assigned to Skyworks Solutions, Inc.
  • Semiconductor-on-insulator transistor layout for radio frequency power amplifiers
    Patent number: 11804435
    Abstract: A semiconductor-on-insulator die includes a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer. The die includes at least one contact pad and a transistor including a first terminal formed within the active layer. A conduction path can include a plurality of first conduction path portions extending between the first terminal and the at least one contact pad and residing within a footprint of the at least one contact pad.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: October 31, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yang Liu, Yong Hee Lee, Thomas Obkircher
  • Surface acoustic wave resonator with reduced frequency shift
    Patent number: 11804822
    Abstract: Aspects of this disclosure relate to a surface acoustic wave resonator. The surface acoustic wave resonator includes a piezoelectric substrate, interdigital transducer electrodes formed on an upper surface of the piezoelectric substrate, a dielectric temperature compensation layer formed on the piezoelectric substrate to cover the interdigital transducer electrodes, and a dielectric passivation layer over the temperature compensation layer. The passivation layer may include an oxide layer configured to have a sound velocity greater than that of the temperature compensation layer to suppress a transverse signal transmission.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: October 31, 2023
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Hironori Fukuhara, Keiichi Maki, Yuya Hiramatsu
  • Mobile device front end architecture for multiple frequency bands
    Patent number: 11799502
    Abstract: A radio frequency circuit for concurrent comprises a first power amplifier, a second power amplifier, a low noise amplifier and a plurality of switches. The first power amplifier is configured to amplify signals of a first frequency band. The second power amplifier is configured to amplify signals of at least one of a second frequency band and a third frequency band, where the first frequency band is disposed between the second and the third frequency bands. The low noise amplifier is configured to amplify signals of the first, the second, and the third frequency bands. The plurality of switches is configured to route the signals through at least one of the first power amplifier, the second power amplifier, and the low noise amplifier.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: October 24, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventor: David Richard Pehlke
  • Acoustic wave device with multi-layer interdigital transducer electrode
    Patent number: 11799445
    Abstract: Aspects of this disclosure relate to an acoustic wave device that includes a multi-layer interdigital transducer electrode. The acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode includes a first interdigital transducer electrode layer positioned between a second interdigital transducer electrode layer and the piezoelectric layer. The second interdigital transducer electrode layer can include aluminum and having a thickness of at least 200 nanometers. The acoustic wave device can include a temperature compensation layer arranged such that the interdigital transducer electrode is positioned between the piezoelectric layer and at least a portion of the temperature compensation layer. Related filters, modules, wireless communication devices, and methods are disclosed.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: October 24, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Tomoya Kodama, Shinichi Hakamada, Hironori Fukuhara, Yosuke Hamaoka
  • Parallel hybrid acoustic passive filter
    Patent number: 11799439
    Abstract: Aspects of this disclosure relate to a parallel hybrid acoustic passive filter. The parallel hybrid acoustic passive filter includes a first sub-filter and a second sub-filter. The first sub-filter includes a first acoustic resonator and a first non-acoustic passive component. The second sub-filter includes a second acoustic resonator and second first non-acoustic passive component. The first sub-filter and the second sub-filter are together arranged to filter a radio frequency signal. The parallel hybrid acoustic filter can be a band pass filter or a band stop filter, for example. Related multiplexers, wireless communication devices, and methods are disclosed.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: October 24, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hai H. Ta, Bo Pan, Weimin Sun
  • Temperature-based bandgap reference circuit
    Patent number: 11797042
    Abstract: Circuits, systems, and methods to switch modes based on temperature and to provide reference voltages are discussed herein. For example, a bandgap reference circuit may include one or more impedance elements and one or more switches coupled to the one or more impedance elements. The one or more switches may be controllable based on a temperature signal. The bandgap reference circuit may be configured to provide a bandgap reference voltage that is associated with less than a particular amount of voltage variation.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: October 24, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventor: Bang Li Liang
  • Acoustic wave resonator with multiple resonant frequencies
    Patent number: 11799447
    Abstract: Aspects of this disclosure relate to an acoustic wave resonator having at least two resonant frequencies. An acoustic wave filter can include series acoustic wave resonators and shunt acoustic wave resonators together arranged to filter a radio frequency signal. A first shunt resonator of the shunt acoustic wave resonators can include an interdigital transducer electrode and have at least a first resonant frequency and a second resonant frequency. Related acoustic wave resonators, multiplexers, wireless devices, and methods are disclosed.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: October 24, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yasufumi Kaneda, Yiliu Wang, Tomoya Komatsu
  • SURFACE ACOUSTIC WAVE FILTERS WITH SUPPRESSED CAVITY BENDING
    Publication number: 20230336159
    Abstract: A surface acoustic wave (SAW) filter package comprises a substrate, one or more trenches formed in the substrate, a SAW filter formed in each trench of the one or more trenches, and a cavity forming layer extending horizontally across the substrate and each trench.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 19, 2023
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Yuya Hiramatsu, Hiroyuki Nakamura, Keiichi Maki, Kyohei Kobayashi
  • Apparatus and methods for phase shifting
    Patent number: 11791800
    Abstract: Apparatus and methods for phase shifting are provided herein. In certain embodiments, a phase shifter includes a first port, a first controllable reflective load, a second port, a second controllable reflective load, and a pair of coupled lines that are electromagnetically coupled to one another. The pair of coupled lines includes a first conductive line between the first port and the first controllable reflective load and a second conductive line between the second controllable reflective load and the second port. At least one of the first controllable reflective load or the second controllable reflective load includes a switched transmission line load.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: October 17, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Mostafa Azizi, Hassan Sarbishaei
  • Hybrid acoustic LC filter with harmonic suppression
    Patent number: 11791793
    Abstract: Aspects of this disclosure relate to hybrid acoustic LC filter with harmonic suppression. The hybrid acoustic LC filter includes a hybrid passive/acoustic and a non-acoustic LC filter cascaded with the hybrid passive/acoustic filter. The hybrid passive/acoustic filter can be configured to filter a radio frequency signal. The hybrid passive/acoustic filter can include acoustic resonators and a non-acoustic passive component. The non-acoustic LC filter can be configured to suppress a harmonic of the radio frequency signal. The non-acoustic LC filter can be a low pass filter or a harmonic notch filter, for example. Related multiplexers, wireless communication devices, and methods are disclosed.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: October 17, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Weimin Sun, Hai H. Ta, Bo Pan
  • Radio-frequency front-end architecture
    Patent number: 11791850
    Abstract: A radio-frequency front-end architecture can include a quadplexer configured to support uplink carrier aggregation with a first antenna. The quadplexer can include a low-band filter, a mid-band filter, a first high-band filter, and a second high-band filter, with each filter having a respective input node, and the quadplexer including a common output node associated with the first antenna. The front-end architecture can further include a triplexer configured to support uplink carrier aggregation with a second antenna. The triplexer can include a mid-band filter, a first high-band filter, and a second high-band filter, with each filter having a respective input node, and the triplexer including a common output node associated with the second antenna.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: October 17, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventor: Joel Richard King
  • METHOD OF MANUFACTURE OF ACOUSTIC WAVE DEVICE WITH TRENCH PORTIONS FOR TRANSVERSE MODE SUPPRESSION
    Publication number: 20230327630
    Abstract: A method of manufacturing an acoustic wave device is provided. The method of manufacturing the acoustic wave device comprises providing a layer of piezoelectric material, disposing a pair of interdigital transducer electrodes on an upper surface of the layer of piezoelectric material, each interdigital transducer electrode including a bus bar and a plurality of electrode fingers extending from the bus bar towards an edge region of the interdigital transducer electrode at the distal ends of the electrode fingers, and etching trench portions into the upper surface of the layer of piezoelectric material, the trench portions overlapping with the edge regions of the interdigital transducer electrodes. The formation of the trench portions through etching results in an easier fabrication, that is less likely to damage the interdigital transducer electrodes.
    Type: Application
    Filed: April 5, 2023
    Publication date: October 12, 2023
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Rei Goto, Hironori Fukuhara, Benjamin Paul Abbott
  • Power amplifier antenna structure
    Patent number: 11784611
    Abstract: Integrated Doherty power amplifiers are provided herein. In certain implementations, a Doherty power amplifier includes a carrier amplification stage that generates a carrier signal, a peaking amplification stage that generates a peaking signal, and an antenna structure that combines the carrier signal and the peaking signal. The antenna structure radiates a transmit wave in which the carrier signal and the peaking signal are combined with a phase shift.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: October 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Patrick Marcus Naraine, William J. Domino, Serge Francois Drogi, René Rodríguez
  • Stack assembly for radio-frequency applications
    Patent number: 11785853
    Abstract: Stack assembly for radio-frequency applications. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.
    Type: Grant
    Filed: June 13, 2021
    Date of Patent: October 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hardik Bhupendra Modi, Adarsh Karan Jaiswal, Anil K. Agarwal, Engin Ibrahim Pehlivanoglu
  • Method for forming multiple bulk acoustic wave filters on shared die
    Patent number: 11784634
    Abstract: Bulk acoustic wave resonators of two or more different filters can be on a common die. The two filters can be included in a multiplexer, such as a duplexer, or implemented as standalone filters. With bulk acoustic wave resonators of two or more filters on the same die, the filters can be implemented in less physical space compared to implementing the same filters of different die. Related methods, radio frequency systems, radio frequency modules, and wireless communication devices are also disclosed.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: October 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Akshara Kankar, Tomoya Komatsu, Abhishek Dey, Nan Wu, Stephane Richard Marie Wloczysiak
  • Adaptive degeneration circuits
    Patent number: 11784620
    Abstract: This disclosure relates to variable-gain amplifiers that include degeneration circuits configured to adapt to a gain mode that is currently being implemented. For example, a variable-gain amplifier can operate in a plurality of gain modes to amplify a signal with different levels of amplification. The variable-gain amplifier can include a gain circuit configured to amplify a signal and a degeneration circuit coupled to the gain circuit. The degeneration circuit can include an inductor and a switching-capacitive arm coupled in parallel to the inductor. The degeneration circuit can operate based on a current gain mode to change an inductance for the variable-gain amplifier.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: October 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Xingyi Hua, Weiheng Chang
  • Laser-marked packaged surface acoustic wave devices
    Patent number: 11784622
    Abstract: Methods for making laser-marked packaged surface acoustic wave devices are provided. The method may include directly marking a surface of a piezoelectric substrate, where the opposite surface of the piezoelectric substrate includes a package structure encapsulating a surface acoustic wave device. The method may include exposing the surface of the piezoelectric substrate to light from a deep ultraviolet laser. By using a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings may extend less than 1 micrometer into the piezoelectric substrate, and do not affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: October 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Li Ann Koo, Takashi Inoue, Vivian Sing Zhi Lee, Ping Yi Tan
  • Antenna-plexer for interference cancellation
    Patent number: 11784419
    Abstract: Antenna-plexers for interference cancellation are provided herein. In certain embodiments, a wireless device includes an antenna, an antenna-plexer coupled to the antenna and configured to generate a feedback signal, a transmitter configured to transmit a transmit signal to the antenna by way of the antenna-plexer, a receiver configured to process a receive signal, and a feedback receiver configured to process the feedback signal from the antenna-plexer to provide compensation to the receive signal.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: October 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: David Richard Pehlke, Anand Raghavan, Poul Olesen, Werner Schelmbauer, Thorsten Tracht, Wolfgang Thomann, Amir Israel Rubin, Assi Jakoby, Ofer Benjamin
  • REDUCTION OF ON-DIE PARASITIC CAPACITANCE FOR 5G FILTER DESIGN WITH HIGH ISOLATION
    Publication number: 20230318568
    Abstract: An acoustic wave filter assembly having reduced on-die capacitance and improved isolation for high-frequency applications. The acoustic wave filter assembly includes a filter port, an antenna port, an acoustic wave filter connected between the filter port and the antenna port, one or more ground pins connected between the filter port and the antenna port, and a metallic guard ring extending around the acoustic wave filter assembly. At least one of the one or more ground pins is connected to the metallic guard ring. A diplexer, multiplexer, radio-frequency module and wireless device are also provided.
    Type: Application
    Filed: March 23, 2023
    Publication date: October 5, 2023
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Hai H. Ta, Shihan Qin, Nicholas Quinn Muhlmeyer, Weimin Sun
  • Ceramic filter using stepped impedance resonators having an inner cavity with a decreasing inner diameter provided by a plurality of steps
    Patent number: 11777185
    Abstract: Disclosed are embodiments of ceramic radiofrequency filters advantageous as RF components. The ceramic filters can include a ceramic impedance resonator, wherein the inner diameter of the ceramic stepped impedance resonator can vary from one end to another end. The inner diameter can be designed to provide different impedances in the ceramic resonator.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: October 3, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventor: John Kenneth Darling