Abstract: A packaged acoustic wave component is disclosed. The packaged acoustic wave component can include a first acoustic wave resonator that includes a first interdigital transducer electrode that is positioned over a first piezoelectric layer. The packaged acoustic wave component can also include a second acoustic wave resonator including a second interdigital transducer electrode positioned over a second piezoelectric layer. The second piezoelectric layer is bonded to the first piezoelectric layer. The packaged acoustic wave component can further include a stopper structure that is positioned over the first piezoelectric layer. The first stopper structure is positioned above a via and extends through the first piezoelectric layer. The stopper structure is in electrical communication with the first interdigital transducer electrode and includes a material which reflects at least fifty percent of light having a wavelength of 355 nanometers.

Abstract: Apparatus and the methods for stacked power amplifiers are provided. In certain embodiments, a mobile device includes a transceiver that generates a first radio frequency input signal and a second radio frequency input signal, and a front end system including a stacked power amplifier that receives power from a power high supply voltage and a power low supply voltage. The stacked power amplifier includes a first power amplifier that amplifies the first radio frequency input signal and a second power amplifier that amplifies the second radio frequency input signal. The first power amplifier and the second power amplifier are electrically connected in a stack between the power high supply voltage and the power low supply voltage and operate with a shared DC bias current.

Abstract: An acoustic wave element is disclosed. The acoustic wave element can include a piezoelectric layer that includes aluminum nitride. The acoustic wave element can also include a diamond like carbon layer. The acoustic wave element can further include an interdigital transducer electrode that is positioned on the piezoelectric layer. The piezoelectric layer is positioned between the interdigital transducer electrode and the diamond like carbon layer. The acoustic wave element is configured to generate a Lamb wave having a wavelength of ?.

Abstract: An acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode disposed over the piezoelectric layer. The interdigital transducer electrode is thicker in a center region of the interdigital transducer electrode than in a gap region of the interdigital transducer electrode to thereby reduce a mass loading of the interdigital transducer electrode in the gap region. The interdigital transducer electrode has a layer of less dense material disposed of a layer of more dense material.

Abstract: A low-dropout (LDO) voltage regulation circuit comprises a first supply voltage, a first transistor, an overshoot control module, and coupling circuitry configured to couple the first supply voltage, the transistor, and the overshoot control module at a first node.

Abstract: Apparatus and methods for adaptive power amplifier biasing are provided. In certain embodiments, a power amplifier system includes a power amplifier that provides amplification to a radio frequency (RF) signal, and a power amplifier bias control circuit that generates a bias signal of the power amplifier based on a bandwidth signal indicating a bandwidth of the RF signal. The power amplifier bias control circuit has a bandwidth that adapts to the bandwidth of the RF signal as indicated by the bandwidth signal.

Abstract: Integrated Doherty power amplifiers are provided herein. In certain implementations, a Doherty power amplifier includes a carrier amplification stage that generates a carrier signal, a peaking amplification stage that generates a peaking signal, and an antenna structure that combines the carrier signal and the peaking signal. The antenna structure radiates a transmit wave in which the carrier signal and the peaking signal are combined with a phase shift.

Abstract: In at least one embodiment, a method for operating a receiver includes configuring a receiver front-end circuit of the receiver according to a selected power consumption configuration. The method includes adjusting a quiescent current of a programmable flat gain stage coupled to the receiver front-end circuit according to the selected power consumption configuration to compensate for any gain loss of the receiver front-end circuit in the selected power consumption configuration. The selected power consumption configuration may be a reduced power consumption configuration and the programmable flat gain stage may be configured to at least partially compensate for the gain loss of the receiver front-end circuit in the reduced power consumption configuration.

Abstract: A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.

Abstract: Architectures and techniques relate to selectively implementing certain components to filter emissions. For example, a circuit can include a filter associated with a first frequency range, a first switch, and a second switch. The first switch can be configured to, in a filter state, route a signal through the filter and configured to, in a bypass state, route the signal to an output node while bypassing the filter. The second switch can be configured to, in the filter state, route the signal from the filter to the output node.

Abstract: A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Abstract: Embodiments of this disclosure relate to reducing coupling between acoustic wave resonators. An isolation region of a substrate can be located between acoustic wave resonators. The isolation region can reduce capacitive coupling through the substrate between the acoustic wave resonators. In certain embodiments, the isolation region can be located between acoustic wave resonators of different filters to thereby increase isolation between the filters.

Abstract: Dispersive delay lines are disclosed. The dispersive delay line can include a piezoelectric substrate having a first interdigital transducer electrode on a first region of the piezoelectric substrate and a second interdigital transducer electrode on a second region of the piezoelectric substrate. The dispersive delay line is arranged such that an acoustic wave is configured to propagate from the first interdigital transducer electrode to the second interdigital transducer electrode though a third region of the piezoelectric substrate. An additional material positioned on the third region of the piezoelectric substrate can impact acoustic wave propagation velocity. Related radio frequency modules, wireless communications devices, and methods are disclosed.

Abstract: A filter with bulk acoustic wave devices is disclosed. The filter includes a first bulk acoustic wave resonator and a second bulk acoustic wave resonator. The first bulk acoustic wave resonator includes a first raised frame structure. The first raised frame structure is a multi-layer raised frame structure. The second bulk acoustic wave resonator includes a second raised frame structure. The first raised frame structure has at least one more raised frame layer than the second raised frame structure.

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Abstract: An isolation capacitor structure reduces the likelihood of breakdown in the passivation layers by physically re-shaping or dividing the top plate of the isolation capacitor into two segments. In that way, the electric field is driven down and away from the passivation surfaces. One embodiment utilizes a series capacitor formed by the top metal plate of the capacitor and an additional “top hat” plate above the top metal plate that redirects the fields into the main isolation capacitor. Vias may be included between the top hat plate and the top metal plate. Another approach reshapes the top plate to have an integrated top hat structure and achieves similar results of directing charge down and away from the passivation layer surface breakdown paths.

Abstract: A calibration operation determines a resistance of a sense resistor in a POE system. A voltage measurement is taken with a first current flowing through the sense resistor. A second voltage measurement is taken with a second current flowing through the resistor. A resistance value of the sense resistor is determined based on a voltage difference between the first and second voltage measurements and a current difference between the first current and the second currents.

Abstract: Aspects of this disclosure relate to an acoustic wave device having an overtone mode as a main mode. The acoustic wave device is sufficiently asymmetric on opposing sides of a piezoelectric layer over an acoustic reflector such that the main mode of the acoustic wave device is the overtone mode.

Abstract: A printed circuit board for use in an electronics package has a die attach pad and one or more adhesion strips outside the die attach pad. The adhesion strip(s) facilitate adhesion of a mold compound over the die attach pad and die and inhibits (e.g., prevents) delamination of the mold compound from the die attach pad.

Abstract: Radio frequency front-end systems with filter reuse. In certain embodiments, a front-end system includes a filter, a low noise amplifier (LNA), and a switch interposed between the filter and an input to the LNA. In a first state of the switch, the filter serves to filter a radio frequency signal that is amplified by the LNA. The front-end system further includes a power amplifier that is coupled to the switch. Additionally, in a second state of the switch, the filter serves to filter an amplified radio frequency transmit signal provided by the power amplifier. Accordingly, a filter along a receive path of the front-end system is reused for transmit.