Patents Assigned to SMART PACKAGING SOLUTIONS
  • Patent number: 12639547
    Abstract: Example embodiments relate to chip cards with optimized coupling antennas and methods for the production thereof. An example contactless or mixed contact and contactless chip card includes a chip card body and an antenna insert interposed between outer layers of the chip card body. The antenna insert includes a substrate. The antenna insert also includes on at least one side of the substrate, coils of a concentrator configured to be electromagnetically coupled to coils of an antenna of an electronic module arranged in a cavity of the chip card body. The concentrator includes at least one inner coil that emerges in the cavity and is flush with inner side walls of the cavity of the chip card body.
    Type: Grant
    Filed: July 22, 2023
    Date of Patent: May 26, 2026
    Assignee: Smart Packaging Solutions
    Inventors: Guillaume Guerin, Luc Lefebvre, Stephan Danler Baumgartner
  • Patent number: 12602564
    Abstract: An integrated circuit module is provided for post-lamination implanting into a smartcard body. The integrated circuit module includes a contact plate, a biometric sensor, a secure element, and means for electrical connection to an antenna embedded within the smartcard body. The secure element includes contact and contactless communication logic, and is configured to perform at least one smartcard function utilising the biometric sensor.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: April 14, 2026
    Assignee: SMART PACKAGING SOLUTIONS
    Inventor: Robert Mueller
  • Patent number: 12579389
    Abstract: A structure for aligning a biometrically-authorisable smartcard with respect to a smartphone during biometric enrolment of the smartcard. The structure includes a smartcard area for receiving the smartcard and a guide for aligning the structure in a predetermined position with respect to the smartphone. The alignment structure is configured such that, when the smartcard is received in the smartcard area and the structure is aligned in the predetermined position with respect to the smartphone, the smartcard is located proximate a near field communication antenna of the smartphone such that the smartcard receives power from the antenna.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: March 17, 2026
    Assignee: SMART PACKAGING SOLUTIONS
    Inventor: Robert Mueller
  • Patent number: 12512420
    Abstract: The invention relates to an electronic module (30) intended to be held in place on a carrier (1) by a holding means (4), the electronic module (30) consisting of a plurality of layers, comprising a first carrier layer (10) carrying one or more contacts (11), a first face (10b) of the carrier layer (10) is in contact with a first face (12a; 53a) of a substrate (12; 53) and comprising a face of the substrate (12b; 53b) carrying one or more antennas (13; 50, 51), the antenna(s) (13; 50, 51) being connected to an integrated circuit (14) via feeder links (15).
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: December 30, 2025
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Cécile Carrier, Maxime Di Bernardo, Kevin Fabrizio
  • Patent number: 12505326
    Abstract: The invention relates to a portable communicating object (20) the operating mode of which is a contact or contactless mode, or a hybrid mode which is both contact and contactless, said object comprising a body (50) having external protective layers (15, 16) and an insert (40) placed between said protective layers, said insert (40) comprising a substrate (41) bearing a first electronic component (11; 60) having first connection pads (17) and further bearing at least a second electronic component taking the form of an electronic module (12) placed in a cavity (51) of the body (50), which cavity is obtained by machining, said electronic module (12) having second connection pads (18), and said insert (40) further comprising, on the one hand, interconnecting tracks (21, 22, 23, 24) intended to connect said first electronic component (11; 60) with said electronic module (12) so as to ensure electrical power is supplied thereto or data transferred therebetween, and on the other hand, connecting tracks (29) between s
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: December 23, 2025
    Assignee: Smart Packaging Solutions
    Inventors: Damien Aubert, Turelier Mathieu
  • Patent number: 12505329
    Abstract: A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object is provided. The process includes at least the following steps: Using a single-sided film consisting of one or more contact regions and a dielectric comprising one or more apertures, Using a substrate comprising one or more electrically conductive regions intended for the contactless communication of the object, Securing said single-sided film and said substrate together, Positioning an integrated circuit and connecting it to the contact regions of the single-sided film and at least to one terminal of at least one of said electrically conductive regions, Depositing a protective layer incorporating at least said integrated circuit. Also provided is a module obtained by means of the process.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: December 23, 2025
    Assignee: Smart Packaging Solutions
    Inventors: Bernard Calvas, Pierre Volpe
  • Publication number: 20250338101
    Abstract: The invention relates to a coupling device for near-field communication between a contactless communicating device and a radio transmitter, the device comprising:—a flexible support; and—an antenna on the support. The device essentially further comprises:—positioning means for the relative positioning of the coupling device with the communicating device or with the transmitter, the relative positioning means comprising at least one from among securing means and visual referencing means, the antenna of the coupling device then being in a relative position such that when the near-field communication antenna of the communicating device is powered by the transmitter, the antenna of the coupling device is arranged in the field lines of the contactless communicating device and in the field lines of the transmitter.
    Type: Application
    Filed: May 10, 2023
    Publication date: October 30, 2025
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Anthony DESJOUIS, Stephan DANLER BAUMGARTNER, Guillaume GERIN
  • Patent number: 12277466
    Abstract: The invention relates to an antenna inlay for a smart card with a contactless communication interface or a dual contact and contactless communication interface. The antenna inlay does not have a layer of plastic material, and is essentially constituted by a metal sheet comprising conductive turns delimited by zones rendered non-conductive by anodization.
    Type: Grant
    Filed: August 25, 2023
    Date of Patent: April 15, 2025
    Assignee: Smart Packaging Solutions
    Inventors: Sautet Alexandre, Turelier Mathieu, Richard Damien
  • Publication number: 20240185020
    Abstract: The invention relates to an electronic module for a chip card, comprising a substrate having, on a first face, a terminal block of electrical contacts that are standardized according to the ISO 7816 standard enabling an operation by contact with the corresponding contacts of a chip card reader and connection sinks positioned opposite the standardized contacts, the substrate comprising, on a second face, an antenna and a microelectronic chip protected by an encapsulation zone and provided with a communication interface with contact and a contactless communication interface provided with two terminals intended to be connected to the two ends of an antenna of the electronic module arranged inside the encapsulation zone, wherein the antenna comprises at least two separate and non-concentric spiral windings, arranged such that none of the spiral windings surrounds the set of connection sinks of the module.
    Type: Application
    Filed: December 30, 2020
    Publication date: June 6, 2024
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Sebastian MARMUGI, Stephan DANLER BAUMGARTNER, Guillaume GUERIN
  • Publication number: 20240070433
    Abstract: The invention relates to an antenna inlay for a smart card with a contactless communication interface or a dual contact and contactless communication interface. The antenna inlay does not have a layer of plastic material, and is essentially constituted by a metal sheet comprising conductive turns delimited by zones rendered non-conductive by anodization.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 29, 2024
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Sautet ALEXANDRE, Turelier MATHIEU, Richard DAMIEN
  • Patent number: 11822990
    Abstract: A contactless or hybrid contact and contactless chip card, includes a card body composed of a stack of layers and provided with a cavity into which an electronic module is inserted. The electronic module includes a microelectronic chip connected to an inductive or capacitive coupling means for coupling with, or a physical connection to, at least one antenna arranged in the card body. The card body comprises a metal plate forming a core and the periphery of which has at least one edge delimiting at least one recess in which the other layers of the chip card are positioned.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 21, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Guillaume Gerin, Stephan Danler-Baumgartner, Damien Richard
  • Patent number: 11681891
    Abstract: An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: June 20, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Kevin Fabrizio, Guillaume Gerin
  • Patent number: 11630978
    Abstract: The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 18, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Lea Vaccarello, Guillaume Gerin, Stephan Danler-Baumgartner
  • Publication number: 20220207317
    Abstract: An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.
    Type: Application
    Filed: April 17, 2020
    Publication date: June 30, 2022
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Kevin FABRIZIO, Guillaume GERIN
  • Publication number: 20220172015
    Abstract: A contactless or hybrid contact and contactless chip card, includes a card body composed of a stack of layers and provided with a cavity into which an electronic module is inserted. The electronic module includes a microelectronic chip connected to an inductive or capacitive coupling means for coupling with, or a physical connection to, at least one antenna arranged in the card body. The card body comprises a metal plate forming a core and the periphery of which has at least one edge delimiting at least one recess in which the other layers of the chip card are positioned.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 2, 2022
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Guillaume GERIN, Stephan DANLER-BAUMGARTNER, Damien RICHARD
  • Publication number: 20220083830
    Abstract: The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.
    Type: Application
    Filed: December 6, 2019
    Publication date: March 17, 2022
    Applicant: Smart Packaging Solutions
    Inventors: Lea VACCARELLO, Guillaume GERIN, Stephan DANLER-BAUMGARTNER
  • Patent number: 11275912
    Abstract: A secured document, in the form of a booklet made up of at least one page that can be folded about a folding axis, includes a transponder provided with an electronic chip including memory for data storage and a transponder antenna. The secured document further includes two amplifier antennas, separate from the antenna of the transponder, arranged on pages of the booklet so that, in the open document position, one of the amplifier antennas amplifies the electromagnetic flux picked up by the antenna of the transponder to allow the document to communicate with a remote reader, and, in the closed document position, the amplifier antennas are configured so that the electromagnetic flux picked up by the antenna of the transponder is below a minimal threshold that allows the electronic chip to communicate with a remote reader.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: March 15, 2022
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin Mear, Stéphan Danler-Baumgartner
  • Patent number: 11250306
    Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: February 15, 2022
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Bernard Calvas, Guillaume Gerin, Kevin Fabrizio
  • Publication number: 20210182510
    Abstract: A secured document, in the form of a booklet made up of at least one page that can be folded about a folding axis, includes a transponder provided with an electronic chip including memory for data storage and a transponder antenna. The secured document further includes two amplifier antennas, separate from the antenna of the transponder, arranged on pages of the booklet so that, in the open document position, one of the amplifier antennas amplifies the electromagnetic flux picked up by the antenna of the transponder to allow the document to communicate with a remote reader, and, in the closed document position, the amplifier antennas are configured so that the electromagnetic flux picked up by the antenna of the transponder is below a minimal threshold that allows the electronic chip to communicate with a remote reader.
    Type: Application
    Filed: May 16, 2019
    Publication date: June 17, 2021
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin MEAR, Stéphan DANLER-BAUMGARTNER
  • Patent number: D955392
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: June 21, 2022
    Assignee: SMART PACKAGING SOLUTIONS
    Inventor: Kevin Fabrizio