Patents Assigned to SMART PACKAGING SOLUTIONS
  • Publication number: 20240070433
    Abstract: The invention relates to an antenna inlay for a smart card with a contactless communication interface or a dual contact and contactless communication interface. The antenna inlay does not have a layer of plastic material, and is essentially constituted by a metal sheet comprising conductive turns delimited by zones rendered non-conductive by anodization.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 29, 2024
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Sautet ALEXANDRE, Turelier MATHIEU, Richard DAMIEN
  • Patent number: 11822990
    Abstract: A contactless or hybrid contact and contactless chip card, includes a card body composed of a stack of layers and provided with a cavity into which an electronic module is inserted. The electronic module includes a microelectronic chip connected to an inductive or capacitive coupling means for coupling with, or a physical connection to, at least one antenna arranged in the card body. The card body comprises a metal plate forming a core and the periphery of which has at least one edge delimiting at least one recess in which the other layers of the chip card are positioned.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 21, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Guillaume Gerin, Stephan Danler-Baumgartner, Damien Richard
  • Patent number: 11681891
    Abstract: An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: June 20, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Kevin Fabrizio, Guillaume Gerin
  • Patent number: 11630978
    Abstract: The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 18, 2023
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Lea Vaccarello, Guillaume Gerin, Stephan Danler-Baumgartner
  • Publication number: 20220207317
    Abstract: An electronic module for a chip includes a first dielectric substrate provided on one of the faces thereof with a first microelectronic chip whose input/output terminals are connected to first connection pins which are arranged around the first microelectronic chip, and a second dielectric substrate which is placed directly opposite the first substrate and which is provided on one of the faces thereof with a second microelectronic chip whose input/output terminals are connected to second connection pins which are arranged around the second microelectronic chip. The first and second microelectronic chips are arranged on the faces of the substrates directed towards the interior of the electronic module. A dielectric shim has a calibrated thickness and separates the first and second dielectric substrates. The shim has through-holes or vacancies accommodating electrically conductive materials connecting some of the first connection pins to some of the second connection pins.
    Type: Application
    Filed: April 17, 2020
    Publication date: June 30, 2022
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Kevin FABRIZIO, Guillaume GERIN
  • Publication number: 20220172015
    Abstract: A contactless or hybrid contact and contactless chip card, includes a card body composed of a stack of layers and provided with a cavity into which an electronic module is inserted. The electronic module includes a microelectronic chip connected to an inductive or capacitive coupling means for coupling with, or a physical connection to, at least one antenna arranged in the card body. The card body comprises a metal plate forming a core and the periphery of which has at least one edge delimiting at least one recess in which the other layers of the chip card are positioned.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 2, 2022
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Guillaume GERIN, Stephan DANLER-BAUMGARTNER, Damien RICHARD
  • Publication number: 20220083830
    Abstract: The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.
    Type: Application
    Filed: December 6, 2019
    Publication date: March 17, 2022
    Applicant: Smart Packaging Solutions
    Inventors: Lea VACCARELLO, Guillaume GERIN, Stephan DANLER-BAUMGARTNER
  • Patent number: 11275912
    Abstract: A secured document, in the form of a booklet made up of at least one page that can be folded about a folding axis, includes a transponder provided with an electronic chip including memory for data storage and a transponder antenna. The secured document further includes two amplifier antennas, separate from the antenna of the transponder, arranged on pages of the booklet so that, in the open document position, one of the amplifier antennas amplifies the electromagnetic flux picked up by the antenna of the transponder to allow the document to communicate with a remote reader, and, in the closed document position, the amplifier antennas are configured so that the electromagnetic flux picked up by the antenna of the transponder is below a minimal threshold that allows the electronic chip to communicate with a remote reader.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: March 15, 2022
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin Mear, Stéphan Danler-Baumgartner
  • Patent number: 11250306
    Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: February 15, 2022
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Bernard Calvas, Guillaume Gerin, Kevin Fabrizio
  • Publication number: 20210182510
    Abstract: A secured document, in the form of a booklet made up of at least one page that can be folded about a folding axis, includes a transponder provided with an electronic chip including memory for data storage and a transponder antenna. The secured document further includes two amplifier antennas, separate from the antenna of the transponder, arranged on pages of the booklet so that, in the open document position, one of the amplifier antennas amplifies the electromagnetic flux picked up by the antenna of the transponder to allow the document to communicate with a remote reader, and, in the closed document position, the amplifier antennas are configured so that the electromagnetic flux picked up by the antenna of the transponder is below a minimal threshold that allows the electronic chip to communicate with a remote reader.
    Type: Application
    Filed: May 16, 2019
    Publication date: June 17, 2021
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin MEAR, Stéphan DANLER-BAUMGARTNER
  • Publication number: 20200394484
    Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.
    Type: Application
    Filed: November 20, 2018
    Publication date: December 17, 2020
    Applicant: Smart Packaging Solutions
    Inventors: Bernard CALVAS, Guillaume GERIN, Kevin FABRIZIO
  • Patent number: 10688821
    Abstract: The invention relates to an insert for a passport booklet data sheet, formed by a multilayer complex having at least a first layer and a second layer having a hinge that has a folding zone where the insert is intended to be sewn or stapled into a passport booklet, said second layer having, in combination, at least one layer of plastics material and at least one metal reinforcing layer that together form an extension which extends a certain distance beyond said folding zone of the hinge, so as to reinforce the resistance of said data sheet to being ripped out and torn with respect to the passport booklet, characterized in that said layer of plastics material and said metal reinforcing layer extend over the entire surface area of the insert.
    Type: Grant
    Filed: July 16, 2016
    Date of Patent: June 23, 2020
    Assignee: SMART PACKAGING SOLUTION (S.P.S.)
    Inventors: Olivier Brunet, Anne Ripert, Pascal-Daniel Michau
  • Patent number: 10679116
    Abstract: The invention relates to an antenna for a contactless smart card, arranged on an insert intended to be integrated in said smart card having a certain relative vertical or horizontal positioning tolerance T between the insert and the body of the card, said smart card being provided with an embossing area comprising lines of characters embossed in relief, at least one antenna coil being situated opposite the embossing area, wherein said coil comprises at least one pair of paths situated in the embossing area and connected in parallel, said paths being configured in such a way that at least one of same remains at least partially situated outside of the embossed character area whatever the relative position of the insert and the antenna of same allowed by the tolerance T.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: June 9, 2020
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin Mear, Haig Kambourian, Deborah Teboul
  • Patent number: 10586142
    Abstract: A contactless chip card intended to communicate with a chip card reader operating at a first resonant frequency includes a booster antenna provided with an inductive main antenna and with an inductive concentrator antenna, which antennae are connected in series or parallel with a capacitor. The inductances of the inductive main antenna and the inductive concentrator antenna and the capacitance of the capacitor are chosen on the one hand to obtain a second resonant frequency that is far enough from the frequency of the signal emitted by the reader to limit radiofrequency communication with the reader, and on the other hand so that the connection in parallel of a predetermined capacitance brings the resonant frequency of the card into the vicinity of said first resonant frequency of the signal emitted by said reader.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: March 10, 2020
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Stephan Danler-Baumgartner, Benjamin Mear, Deborah Teboul
  • Publication number: 20190102663
    Abstract: The invention relates to a contactless chip card intended to communicate with a chip card reader operating at a resonant frequency F0?. The chip card includes a booster antenna provided with an inductive main antenna U and with an inductive concentrator antenna L2, which antennae are connected in series or parallel with a capacitor C, wherein the inductances of L1 and L2 and the capacitance of C are chosen on the one hand to obtain a resonant frequency F0 that is far enough from the frequency of the signal emitted by the reader to limit radiofrequency communication with the reader, and on the other hand so that the connection in parallel of a predetermined capacitance Cd brings the resonant frequency of the card into the vicinity of said frequency F0? of the signal emitted by said reader.
    Type: Application
    Filed: March 9, 2017
    Publication date: April 4, 2019
    Applicant: Smart Packaging Solutions
    Inventors: Stephan Danler-Baumgartner, Benjamin Mear, Deborah Teboul
  • Patent number: 10198686
    Abstract: An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: February 5, 2019
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Cécile Carrier, Haig Kambourian, Benjamin Mear
  • Publication number: 20180304666
    Abstract: The invention relates to an insert for a passport booklet data sheet, formed by a multilayer complex having at least a first layer and a second layer having a hinge that has a folding zone where the insert is intended to be sewn or stapled into a passport booklet, said second layer having, in combination, at least one layer of plastics material and at least one metal reinforcing layer that together form an extension which extends a certain distance beyond said folding zone of the hinge, so as to reinforce the resistance of said data sheet to being ripped out and torn with respect to the passport booklet, characterized in that said layer of plastics material and said metal reinforcing layer extend over the entire surface area of the insert.
    Type: Application
    Filed: July 16, 2016
    Publication date: October 25, 2018
    Applicant: SMART PACKAGING SOLUTION (S.P.S.)
    Inventors: Olivier BRUNET, Anne RIPERT, Pascal-Daniel MICHAU
  • Publication number: 20180046893
    Abstract: The invention relates to an antenna for a contactless smart card, arranged on an insert intended to be integrated in said smart card having a certain relative vertical or horizontal positioning tolerance T between the insert and the body of the card, said smart card being provided with an embossing area comprising lines of characters embossed in relief, at least one antenna coil being situated opposite the embossing area, wherein said coil comprises at least one pair of paths situated in the embossing area and connected in parallel, said paths being configured in such a way that at least one of same remains at least partially situated outside of the embossed character area whatever the relative position of the insert and the antenna of same allowed by the tolerance T.
    Type: Application
    Filed: March 4, 2016
    Publication date: February 15, 2018
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin MEAR, Haig KAMBOURIAN, Deborah TEBOUL
  • Publication number: 20180018551
    Abstract: An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.
    Type: Application
    Filed: February 3, 2016
    Publication date: January 18, 2018
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Cécile CARRIER, Haig KAMBOURIAN, Benjamin MEAR
  • Patent number: D955392
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: June 21, 2022
    Assignee: SMART PACKAGING SOLUTIONS
    Inventor: Kevin Fabrizio