Patents Assigned to SMART PACKAGING SOLUTIONS
  • Publication number: 20180018551
    Abstract: An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.
    Type: Application
    Filed: February 3, 2016
    Publication date: January 18, 2018
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Cécile CARRIER, Haig KAMBOURIAN, Benjamin MEAR
  • Publication number: 20170077590
    Abstract: An electronic module for a smartcard has a dual, contact and contactless, communication interface. The module includes an electrically insulating substrate on which are produced electrical contact pads enabling operation via contact with corresponding contacts of a smartcard reader, and contact pads for connection to corresponding pads of an antenna located on the body of the smartcard and enabling a contactless operation with a remote smartcard reader. The substrate is coated with a single electrically conductive layer, especially one made of metal, located on the lower face of the electronic module, and the upper face of the electronic module, which face is intended to be flush with the external face of the smartcard, is produced by said electrically insulating substrate, the latter being provided with windows leaving exposed all or some of said electrical contact pads.
    Type: Application
    Filed: March 3, 2015
    Publication date: March 16, 2017
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Bernard CALVAS, Didier LIVRATI
  • Patent number: 9514403
    Abstract: The invention concerns a smart card comprising a card body provided with a cavity in which an electronic module incorporating a microelectronic chip is inserted, and at least one security marking designed to authenticate a component of the smart card. A first security marking is disposed on the microelectronic module, and a second security marking is disposed on the card body. The two security markings are linked by a visual identity or matching relationship indicating that the microelectronic module and the card body are original components assembled when the smart card was manufactured.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: December 6, 2016
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Philippe Lauri, Philippe Patrice, Ivan Peytavin
  • Patent number: 9256821
    Abstract: A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: February 9, 2016
    Assignee: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Anne Ripert, Pierre Volpe, Yves-Pierre Cuenot, Guillaume Henaut
  • Publication number: 20150356400
    Abstract: The invention concerns a smart card comprising a card body provided with a cavity in which an electronic module incorporating a microelectronic chip is inserted, and at least one security marking designed to authenticate a component of the smart card. A first security marking is disposed on the microelectronic module, and a second security marking is disposed on the card body. The two security markings are linked by a visual identity or matching relationship indicating that the microelectronic module and the card body are original components assembled when the smart card was manufactured.
    Type: Application
    Filed: November 15, 2013
    Publication date: December 10, 2015
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Philippe LAURI, Philippe PATRICE, Ivan PEYTAVIN
  • Publication number: 20150269476
    Abstract: An electronic module with a dual contact and contactless communication interface, has, on a first face, an electric contact terminal for contact with corresponding contacts of a smart card reader, and, on a second face, an antenna with a coil and a microelectronic chip coated with insulating resin and provided with a contactless communication interface. The antenna has a proximal connection pad and a distal connection pad to be connected to the corresponding terminals of the contactless communication interface of the chip. The proximal connection pad and distal connection pad of the antenna are arranged inside the encapsulation area by an insulating resin, in such a way as to produce a conductive bridge between each proximal connection pad or distal connection pad and the corresponding terminal of the chip, directly via connection wires between said connection pads and the corresponding terminals of the chip, without using vias.
    Type: Application
    Filed: October 14, 2013
    Publication date: September 24, 2015
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Bernard Calvas, Halim Bousmaha
  • Patent number: 9014755
    Abstract: A communication interface between a smart card to be connected to a smart card connector of a communication mobile substrate, and a wireless communication network, is disclosed. An antenna is offset and/or can be offset outside the structure of the communication mobile substrate, so that the smart card can communicate directly with a contactless communication network without using the communication mobile substrate.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: April 21, 2015
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Publication number: 20140103118
    Abstract: A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.
    Type: Application
    Filed: April 4, 2012
    Publication date: April 17, 2014
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Anne Ripert, Pierre Volpe, Yves-Pierre Cuenot, Guillaume Henaut
  • Patent number: 8644880
    Abstract: A contactless smart card imbedded in a communication mobile substrate connected to a wireless communication network, and a contactless smart card reader in the vicinity of the communication mobile substrate for radiofrequency communication with the contactless smart card, are disclosed. On one hand, a first antenna is provided on the contactless smart card imbedded in the communication mobile substrate and, on the other hand, a second antenna is attached to the communication mobile substrate and connected by inductive coupling to the first antenna, so that the contactless smart card can directly communicate by radiofrequency with the contactless smart card reader without using the wireless communication network.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: February 4, 2014
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Patent number: 8344958
    Abstract: The invention relates to a secured document in the form of a booklet of at least one sheet which may be folded about a folding axis, the document having a transponder with an electronic chip provided with a memory for storing data and a transponder antenna. The document also includes a foldable amplifier antenna, distinct from the transponder antenna and arranged on the document such that, when the same is open, the amplifier antenna amplifies the electromagnetic flux received by the transponder antenna to permit communication of the document with a remote reader and, in the closed position of the document, the amplifier antenna reduces the electromagnetic flux received by the transponder antenna beneath a minimum threshold permitting communication of the electronic chip with a remote reader.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: January 1, 2013
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Olivier Artigue, Cécile Sicot
  • Patent number: 8317108
    Abstract: The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: November 27, 2012
    Assignee: Smart Packaging Solutions (SPS)
    Inventor: Philippe Patrice
  • Patent number: 8272572
    Abstract: The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: September 25, 2012
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Didier Elbaz, Thomas Battmann
  • Patent number: 7992790
    Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: August 9, 2011
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Olivier Brunet, Jean-Francois Salvo, Ivan Peytavin
  • Publication number: 20110163167
    Abstract: The invention relates to a contactless smart card that comprises a card body and an electronic module provided with an electronic chip connected to the terminals of an antenna, the electronic module being arranged in a recess formed in the card body, wherein the exposed surface of the electronic module comprises at least one graphic security element capable of protecting said electronic module and the contactless card against attempts at fraud.
    Type: Application
    Filed: June 21, 2009
    Publication date: July 7, 2011
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Olivier Artigue, Stéphane Semori, Deborah Teboul, Cécile Sicot
  • Publication number: 20100288842
    Abstract: The invention relates to an insert for a multilayer chip card, including an intermediate sheet and, on either side of the intermediate sheet, at least one outer sheet having a face in close contact with the corresponding face of the intermediate sheet, the intermediate sheet including at least one recess prior to the lamination of the insert. The insert having at least one of the outer sheets is made from a fluent material, such that, when the intermediate sheet is being laminated with the outer sheets, part of the material of the outer sheets moves into the recess in the intermediate sheet, thereby forming a visual and/or tactile defect on the surface of the insert, indicating whether of not the insert and/or the chip card is authentic.
    Type: Application
    Filed: June 19, 2008
    Publication date: November 18, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Didier Elbaz, Thomas Battmann
  • Publication number: 20100283690
    Abstract: The invention relates to a secured document in the form of a booklet of at least one sheet which may be folded about a folding axis, the document having a transponder with an electronic chip provided with a memory for storing data and a transponder antenna. The document also includes a foldable amplifier antenna, distinct from the transponder antenna and arranged on the document such that, when the same is open, the amplifier antenna amplifies the electromagnetic flux received by the transponder antenna to permit communication of the document with a remote reader and, in the closed position of the document, the amplifier antenna reduces the electromagnetic flux received by the transponder antenna beneath a minimum threshold permitting communication of the electronic chip with a remote reader.
    Type: Application
    Filed: July 15, 2008
    Publication date: November 11, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Olivier Artigue, Cécile Sicot
  • Publication number: 20100176205
    Abstract: The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).
    Type: Application
    Filed: March 28, 2008
    Publication date: July 15, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Philippe Patrice
  • Publication number: 20100022273
    Abstract: A contactless smart card imbedded in a communication mobile substrate connected to a wireless communication network, and a contactless smart card reader in the vicinity of the communication mobile substrate for radiofrequency communication with the contactless smart card, are disclosed. On one hand, a first antenna is provided on the contactless smart card imbedded in the communication mobile substrate and, on the other hand, a second antenna is attached to the communication mobile substrate and connected by inductive coupling to the first antenna, so that the contactless smart card can directly communicate by radiofrequency with the contactless smart card reader without using the wireless communication network.
    Type: Application
    Filed: December 20, 2007
    Publication date: January 28, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Philippe Patrice
  • Publication number: 20100016020
    Abstract: A communication interface between a smart card to be connected to a smart card connector of a communication mobile substrate, and a wireless communication network, is disclosed. An antenna is offset and/or can be offset outside the structure of the communication mobile substrate, so that the smart card can communicate directly with a contactless communication network without using the communication mobile substrate.
    Type: Application
    Filed: December 20, 2007
    Publication date: January 21, 2010
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Philippe Patrice
  • Patent number: D730360
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: May 26, 2015
    Assignee: SMART PACKAGING SOLUTIONS (SPS)
    Inventor: Halim Bousmaha