Abstract: A method of manufacturing a microstructure. While pressing a first pattern of a first mold against a first transferred resin layer obtained by applying a first photocurable resin composition on a transparent base having a light shielding pattern, a first cured resin layer with the first pattern transferred thereto is formed by irradiating the first transferred resin layer with an activation energy line through the first mold; While pressing a second pattern of a second mold against a second transferred resin layer obtained by applying a second photocurable resin composition on the first cured resin layer, a second cured resin layer is formed having a level difference shape including a lower level area and a higher level area by irradiating the second transferred resin layer with an activation energy line using the light shielding pattern as a mask to cure the second transferred resin layer in a partial region.

Abstract: A step-and-repeat imprinting apparatus that is capable of restraining failures and mold breakage during imprinting. A step-and-repeat imprinting apparatus is provided that includes: a stage to place a stage base; a positioning mechanism configured to be relatively movable to the stage and to keep a flexible base to face the stage base; and a pressurizing mechanism to press, while deflecting the flexible base, the flexible base toward the stage base, wherein one of the stage base and the flexible base has a convex and concave pattern, and another of the stage base and the flexible base includes a transferred resin layer to have the convex and concave pattern transferred thereto, and the apparatus is so configured that the pressurizing mechanism presses, while deflecting, the flexible base toward the stage base, thereby transferring the convex and concave pattern to the transferred resin layer.

Abstract: A step-and-repeat imprinting mold is provided that is capable of restraining deformation of an end of a convex and concave pattern formed in a cured resin layer when the mold is removed. According to embodiments of the present invention, a step-and-repeat imprinting mold includes: a transparent base; a transparent resin layer formed thereon and having a pattern region formed with a convex and concave pattern; and a light shielding member provided between the transparent base and the transparent resin layer so as to overlap the pattern region in part of the pattern region.

Abstract: Means of solution: Optical protrusions 23 of nano-size for restricting reflection of light and protection columns 24 for preventing crushing of the optical protrusions 23 are provided on a surface of a film substrate 22. The protection columns 24 have a frustum shape. When a ratio of a projection area in which all of lateral surfaces of a single protection column 24 are projected on a surface of the film substrate 22 from a direction that is perpendicular to the surface of the film substrate 22 to a divided area on the surface of the film substrate 22 with respect to the single protection column 24 is defined to be a lateral surface projection occupying area rate, the lateral surface projection occupying area rate of the antireflection film is not more than 0.25% and not less than 0.01%.

Abstract: A resin mold includes a resin layer having a depressions and protrusions pattern formed in the surface thereof, and a release layer including a mold release agent and formed of uniform thickness on at least the depressions and protrusions pattern of the aforementioned resin layer. The aforementioned resin layer has a solvent soluble resin, and an additive that has bleeding ability with respect to the solvent soluble resin, has a substituent group capable of coupling with the aforementioned mold release agent, and has a substituent group having compatibility with the aforementioned solvent soluble resin. The aforementioned additive is localized in the vicinity of the aforementioned resin layer surface. The group of the additive capable of coupling with the mold release agent condenses with the aforementioned mold release agent so that the aforementioned resin layer and release layer are bonded together.

Abstract: A method of manufacturing a structure for suppressing in-mask curing corrosion while minimizing influence on shape stability of a fine pattern to be transferred to a resin layer. A method of manufacturing a structure is provided including: lamination forming, forming a lamination including, on a transparent substrate, a resin layer of an imprinting photo curable resin composition containing a photopolymerizable monomer and 0.1 parts or more respectively of a photo initiator and a polymerization inhibitor based on 100 parts of the monomer; covering, pressing a fine pattern of a mold on the resin layer and covering the lamination with a shading mask to cause a part of a region where the mold is pressed on to be exposed; curing the resin layer in the exposed region by radiating curing light to the resin layer; and repeating steps by moving the mold to an uncured area.

Abstract: An imprinting photo curable resin composition is provided that is excellent in both transferability in imprinting and solvent resistance of the pattern transferred to a structure. According to the present invention, an imprinting photo curable resin composition is provided that at least includes a photopolymerizable (meth)acrylic monomer (A) and a photo initiator (B), wherein the (meth)acrylic monomer (A) is composed at ratios of: (a-1) from 60 to 97 mass % of a trifunctional (meth)acrylate compound; (a-2) from 3 to 40 mass % of a tetrafunctional or higher functional (meth)acrylate compound; and (a-3) from 0 to 37 mass % of a bifunctional or lower functional (meth)acrylate compound (where a sum from (a-1) to (a-3) is 100 mass %).

Abstract: The laminate of an embodiment is a laminate including an antireflection film and a protection film bonded onto the antireflection film, wherein the surface of the antireflection film includes a plurality of protrusions; the protection film includes a supporting film and an adhesive layer; the adhesive layer includes an adhesive agent, a copolymer, and a carboxyl group-containing monomer; the weight average molecular weight of the copolymer is 1000000 or more and 2000000 or less; the copolymer includes the (meth)acrylic acid alkyl ester with the alkyl group having 4 or less carbon atoms in the largest weight proportion among the monomer components; the acid number of the copolymer is 16 mg KOH/g or more and 120 mg KOH/g or less; and the mixing amount of the epoxy cross-linking agent in relation to 100 parts by weight of the copolymer is 1.5 parts by weight or more.

Abstract: Disclosed is a resin mold for nanoimprinting, which has a resin layer having fine depressions and protrusions formed on the surface, wherein the resin layer is formed from 1 to 49 parts by weight of a silicone-based macromonomer and/or a fluorine-based macromonomer and 99 to 51 parts by weight of at least one polymerizable monomer selected from the group consisting of a (meth)acrylic monomer, a styrene-based monomer, an epoxy-based monomer, an olefin-based monomer and a polycarbonate-based resin-forming monomer. The silicone-based macromonomer and/or the fluorine-based macromonomer has a molecular weight of 600 to 10000 and has, at an end of molecule, a reactive group copolymerizable with the polymerizable monomer, and when the reactive group is copolymerized with the polymerizable group, silicone-based units or fluorine-based units that constitute the macromonomer form side chains on a trunk polymer formed from the polymerizable monomer and the macromonomer.

Abstract: Provided is a resin mold for imprinting which is free from transfer defects, has excellent releasability from a resin subjected to imprinting, and does not cause any defect by imprinting. The resin mold for imprinting includes a resin layer having a recessed and projected pattern surface, an inorganic material layer formed with a uniform thickness on at least the recessed and projected pattern surface of the resin layer, and a release agent layer formed with a uniform thickness on at least the recessed and projected pattern surface of the inorganic material layer.

Abstract: A conductive polymer composition which can be homogeneously dissolved in a solvent and can form a smooth film. The conductive polymer composition is a conductive polymer composition comprising a polymer compound (A) and a ?-conjugated polymer (?), wherein the polymer compound (A) is a polymer compound obtained by polymerizing 10 to 50% by mol of a monomer (a-1) having a sulfonic acid group or a sulfonate group, 10 to 90% by mol of a monomer (a-2) having chelating ability and 0 to 70% by mol of other monomer (a-3), and the ?-conjugated polymer (?) is a ?-conjugated polymer obtained by polymerizing at least one monomer selected from monomers represented by the following formulas (I) to (III).

Abstract: A method for manufacturing an imprint mold which can prevent accumulation of the transferring resin onto the transferring roll is provided. A method for manufacturing an imprint mold, including: a resin coating step to coat a photo-curing resin composition or a thermosetting resin composition onto a pattern transferring mold having a fine concave-convex pattern; and a transferring step to transfer the resin composition throughout the entire circumference of a cylindrical transferring roll and cure the resin composition so that a reverse pattern of the concave-convex pattern is formed throughout the entire circumference of the cylindrical transferring roll, is provided.

Abstract: An imprint method including the steps of: an exposing step to irradiate a photo curing resin, coated on a large-area substrate, with a curing light while the light-transmitting imprint mold is pressed against the photo curing resin, an amount of the curing light applied onto the photo curing resin in a light shielding region provided with the light shielding member made less than an amount of the curing light applied onto the photo curing resin in a light transmitting region of the mold so that a portion of the photo curing resin in the light shielding region is semi-cured by the use of the light shielding member provided so as to reproduce the concave-convex pattern of the transparent substrate.

Abstract: A method for manufacturing an imprint mold which can prevent accumulation of the transferring resin at the joining portion of the film mold is provided. A method for manufacturing an imprint mold, including a winding step to wind a resin film mold onto a cylindrical transferring roll, the resin film mold being provided with a reverse pattern of a desired fine concave-convex pattern and the resin film mold being wound onto the transferring roll so that a gap without the reverse pattern is provided at a butting portion of both ends of the resin film mold; a resin filling step to fill a resin composition into the gap; and a pattern forming step to form a pattern substantially the same as the reverse pattern onto the resin composition, is provided.

Abstract: Provided is a photocurable resin composition for producing an imprinting mold which has superior releasability from a transfer target resin and is flexible. The photocurable resin composition does not undergo curing shrinkage when subjected to photo-imprinting as a transfer target of photo-imprinting; and is capable of producing by photo-imprinting an imprinting mold which has high surface hardness and in which the occurrence of yellowing is suppressed even when irradiated with e.g., ultraviolet ray. The photocurable resin composition for imprinting includes a (meth)acrylic monomer (A), a silicon-containing monomer (B) and a photoinitiator (C), wherein the photoinitiator includes a combination of an alkylphenone-based photoinitiator (C1) and an acylphosphine oxide-based photoinitiator (C2).

Abstract: A pressure-sensitive adhesive composition for an optical member is obtained by blending 100 parts by weight of an acrylic polymer, which contains 80 to 98.7 parts by weight of (a) a monomer constituted of an alkyl acrylate monomer having an alkyl group of 1 to 12 carbon atoms and/or an aromatic ring-containing acrylic monomer, 0.2 to 1.5 parts by weight of (b) an amide group-containing acrylic monomer and 1 to 5 parts by weight of (c) a hydroxyl group-containing acrylic monomer, with 0.12 to 1 part by weight of (d) an isocyanate-based curing agent having an isocyanurate skeleton as a curing agent, and is characterized by substantially containing no metal chelate-based curing agent. Accordingly, a pressure-sensitive adhesive composition, which has excellent heat resistance and wet heat resistance and whose aging time can be particularly shortened, is provided.

Abstract: The purpose is to provide a technique which enables various kinds of conductive polymer composition to be dissolved in an organic solvent and to be used to form a conductive membrane on a target portion easily. Provided is a composite conductive polymer composition, a method of manufacturing the same, and a solution obtained by dissolving the composition in an aromatic solvent, ester-based solvent or ketone-based solvent.

Abstract: Provided is a photocurable resin composition in which curing shrinkage in photo-imprinting is suppressed, and capable of producing by photo-imprinting a structure which has high surface hardness and in which the occurrence of yellowing is suppressed even when irradiated with e.g., ultraviolet ray. The photocurable resin composition includes a (meth)acrylic monomer (A) and a photoinitiator (B), wherein the photoinitiator (B) has a combination of an alkylphenone-based photoinitiator (B1) and an acylphosphine oxide-based photoinitiator (B2), wherein a blending weight ratio (B1:B2) of the alkylphenone-based photoinitiator (B1) to the acylphosphine oxide-based photoinitiator (B2) is in the range of 1:99 to 90:10.

Abstract: The purpose is to provide a technique which enables various kinds of conductive polymer composition to be dissolved in an organic solvent and to be used to form a conductive membrane on a target portion easily. Provided is a composite conductive polymer composition, a method of manufacturing the same, and a solution obtained by dissolving the composition in a alcohol-based, glycol-based, or ether-based solvent.

Abstract: On a surface of a film base material (22), an antireflection structure configured by nano-sized optical projections (23) to suppress reflection of light and protective pillars (24) to prevent the optical projections (23) from being flattened out are arranged. The protective pillar (24) has a truncated cone shape. When a diameter of the protective pillar (24) at a proximal end thereof, a height of the protective pillar (24), and an angle between a side surface of the protective pillar (24) and a central axis of the protective pillar (24) on a section passing through the central axis of the protective pillar (24) are given by D, H, and ?, respectively, these values satisfy a relationship: D>2H×tan(2?).