Abstract: A simple technique for introducing a hybrid alignment or a homeotropic (vertical) alignment into liquid crystal films, which, by their nature, tend to have a horizontal alignment of liquid crystal molecules. The technique does not require special alignment films. A liquid crystal composition for forming a liquid crystal film contains a polymerizable liquid crystal compound and a hydrolysate of an alkoxysilane compound. The hydrolysate of the alkoxysilane compound contains a siloxane oligomer of which degree of polymerization is from 2 to 25. Furthermore, the alkoxysilane compound is a trialkoxysilane compound having a functional group. This liquid crystal film composition can be produced by hydrolyzing an alkoxysilane compound to obtain a hydrolysate and then uniformly mixing the hydrolysate with a polymerizable liquid crystal compound.

Abstract: The invention ensures fluidity of an anisotropic conductive adhesive film during electrical connection of the connection terminals of circuit boards to the connection portions of electronic devices using the anisotropic conductive adhesive film, in such a manner that the conductive particles are effectively confined, that the pressure required for compression bonding is not increased, and that the temporary bonding of the circuit boards to the electronic devices is effected at sufficient strength.

Abstract: A novel electroluminescence polymer offers stable EL characteristics: it forms little aggregates and is less susceptible to morphological changes during and after film formation. The EL polymer comprises a binaphthyl derivative structural unit represented by the following formula (1a) and an aryl structural unit represented by the following formula (1b): wherein Ar is an aryl structural unit that can form an electroluminescent ?-conjugated polymer; R1, R2, R3, and R4 are each independently a different functional group; the double bonds of the binaphthyl structural unit indicated by dashed lines and solid lines are each an unsaturated double bond or a saturated single bond; m and p are each independently an integer of 0 to 2; n and o are each independently an integer of 0 to 8; x is the molar fraction of the binaphthyl derivative structural units; and y is the molar fraction of the aryl structural units.

Abstract: The disclosure relates to methods and solutions for precisely and rapidly etching a polyimide resin layer. Etching solutions of the present invention include 3–65% by weight of a diol containing 3 to 6 carbon atoms or a triol containing 4 to 6 carbon atoms, 10–55 % by weight of an alkali compound and water in an amount of 0.75–3.0 times the amount of the alkali compound, and can be used at 65° C. or more to rapidly etch a polyimide resin layer having an imidation degree of 50–98 % without unfavorably affecting the working atmosphere. Even if the resin layer is completely imidated after etching, the etching pattern of the resulting resin layer is not deformed with a decreased contamination by impurity ions as compared with those obtained using conventional etching solutions.

Abstract: Provided are an ester group-containing poly(imide-azomethine)copolymer having low linear thermal expansion coefficient; a production method thereof; an ester group-containing poly(amide acid-azomethine)copolymer to serve as the precursor of the poly(imide-azomethine)copolymer; a positive photosensitive composition including the poly(amide acid-azomethine)copolymer and a photosensitizer; a method for forming a fine pattern of an ester group-containing poly(imide-azomethine)copolymer from the composition; and a method for forming a fine pattern of an ester group-containing poly(imide-azomethine)copolymer by etching a photosensitizer-free, ester group-containing poly(imide-azomethine)copolymer in an alkaline solution.

Abstract: When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4.

Abstract: Compositions for protective films include inorganic microparticles dispersed in an acrylic radical-based binder resin. Binder resins are formed from binder monomers including base components, scratch-resistant components and diluent components. Diluent components include diluent monomers having principal chain structures including a functional group having a cyclic structure or a branched carbon chain structure.

Abstract: A thermal transfer protective sheet, a print, and a print with a window member are provided. The thermal transfer protective sheet includes a release layer and a topcoat layer having adhesiveness to an object to be transferred, which are stacked in this order on a base material, wherein the release layer and the topcoat layer are cold-peeled and transferred to the surface of the object to be transferred by the fusion thermal transfer recording method. The release layer comprises a first resin consisting of a thermoplastic resin and a second resin incompatible with the first resin in a mixed state. The first resin is an acrylic resin, and the second resin is a thermoplastic resin having a glass transition point of 50° C. or less. The mixing ratio of the first resin to the second resin is 80:20 or more and 99:1 or less in a weight ratio.

Abstract: When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4.

Abstract: In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. After a first electroless plating layer and a first conductive material are sequentially grown on a surface of the first base film, a first coating conductive layer composed of the first electroless plating layer, the first conductive material and the first surface conductive layer, is etched to have a reduced thickness. Then, the first coating conductive layer is patterned to form a first wiring layer. In this manner, a desired pattern width can be obtained even in the case where the first coating conductive layer is patterned by isotropic etching such as wet etching.

Abstract: A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.

Abstract: A liquid absorbing sheet includes a liquid absorbing resin layer that can effectively absorb nonaqueous electrolyte solutions used in nonaqueous electrolyte secondary cells that make nonaqueous electrolyte battery packs (in particular, lithium ion-based nonaqueous secondary battery packs). The liquid absorbing resin layer is obtained by irradiating UV-rays onto a monomer composition to polymerize the monomer composition, the monomer composition containing: a monofunctional monomer component containing a monofunctional monomer capable of forming a homopolymer that is soluble in a nonaqueous solvent used in a nonaqueous electrolyte secondary battery; and a polyfunctional monomer component.

Abstract: An insulating sheet is manufactured by attaching a buffer layer and a resin film using an adhesive layer that is not adhesive at a normal ambient temperature. Since there is no need to use a release liner when manufacturing the insulating sheet, there is no release of a silicone component. Accordingly, when installing a hard disk printed wiring board, the printed wiring board and electronic circuits inside the hard disk will not be damaged by the released silicone.

Abstract: Protective devices for preventing overcurrent and overvoltage are disclosed. The devices includes a base substrate, a pair of electrodes formed on the base substrate, and a low-melting metal element connected between the pair of electrodes to interrupt the current flowing between the electrodes by fusion. An insulating cover plate is positioned and fixed in contact with the pair of electrodes serving as a spacer member.

Abstract: A liquid absorbing sheet has a liquid-absorbing resin layer that can effectively absorb the nonaqueous electrolyte solution used in nonaqueous electrolyte secondary cells that make nonaqueous electrolyte battery packs (in particular, lithium ion-based nonaqueous secondary battery packs). The liquid-absorbing resin layer is obtained by irradiating a particular monomer composition with UV rays or other energy rays to polymerize the monomer composition. The monomer composition contains a monofunctional monomer component (A) having a polyethylene glycol acrylate monomer and an amide bond-containing acrylic monomer; and a polyfunctional monomer component (B).

Abstract: A secondary battery of the present invention a heat-sensitive element which varies in resistance value due to change of temperature is not placed on a path through which a charge or discharge current flows into or out of a storage battery. Accordingly, when a main switch element generates heat due to an overcurrent, a change in resistance value of the heat-sensitive element resulting from the heat will allow an auxiliary switch to be turned ON, thereby causing first and second auxiliary fuses to be blown. The charge or discharge current causes no power consumption at the heat-sensitive element, thereby providing high efficiency. The heat-sensitive element can be reduced in current capacity for use and it is suitable for compact design.

Abstract: A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 ?m are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1+t2) which is the sum of a thickness t1 of a wiring circuit and a height t2 of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 ?m, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2.

Abstract: A protective element has a heat-generating member and a low-melting metal member on a substrate, in which the low-melting metal member is blown out by the heat generated by the heat-generating member, wherein at least two strips of low-melting metal member are provided as the low-melting metal member, for example, between the pair of electrodes that pass current to the low-melting metal member, so that the lateral cross section of at least part of the low-melting metal member is substantially divided into at least two independent cross sections. This protective element has a shorter and more consistent operating time. It is preferable here to provide at least two strips of low-melting metal member between the pair of electrodes that pass current to the low-melting metal member. It is also preferable to provide one strip of low-melting metal member having a slit in its center, between the pair of electrodes that pass current to the low-melting metal member.

Abstract: A flexible wiring board are formed by growing metal bumps using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps can be formed with good precision because laser beam is not used to form opening in a polyimide film. After metal bumps have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to exposed the tops of metal bumps.

Abstract: A method of adhesion inhibiting generation of bubbles is provided. Heating, evacuation and centrifugal degassing are performed on an adhesive 37 disposed in an adhesive container 30 to semi-harden the adhesive 37, then a semi-hardened adhesive is discharged as disposed in the adhesive container 30 to mount a chip. Removal of bubbles is efficiently performed since semi-hardening and degassing are simultaneously performed. Further, no defective product is produced even if a working process is stopped since no process for semi-hardening a discharged adhesive exists.