Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: A film package adaptable for winding a long adhesive film at multiple stages in such a diameter that adhesive cannot be squeezed out and a reel member that can be applied includes a reel member assembly formed of a plurality of reel members connected to each other. A reel member 50A includes a winding spool 52A around which a given film can be wound and a plurality of flanges 51 A mounted on the winding spool 52A and each having a guide groove 53A for passing the film from winding spool 52A on one side to winding spool 52A on the other side of the flange 51A.

Abstract: A protective element with improved spherical segmentation performance during the melting of a low-melting metal member, has a heat-generating member and a low-melting metal member on a substrate, in which the low-melting metal member is heated and blown out by the heat generated by the heat-generating member. There is a region in which the low-melting metal member is suspended over the underlying base (such as an insulating layer), and when S (?m2) is the surface area of a lateral cross section of the low-melting metal member 4 between a pair of low-melting metal member electrodes 3a and 3b or 3b and 3c sandwiching the region, and H (?m) is the height at which the suspended region is suspended, then the relationship H/S?5×10?5 is satisfied. It is preferable here that the upper surfaces of both of the pair of low-melting metal member electrodes protrude beyond the upper surface of the underlying insulating layer.

Abstract: The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The resin film is adapted to form an opening when the bump is forced into the resin film and an ultrasonic wave is applied to the bump. The bump is left in the opening to electrically connect the top of the bump to the first wiring layer.

Abstract: A reel member assembly is formed of a plurality of reel members connected to each other. Each reel member includes a winding spool around which a given film can be wound and a flange mounted on the winding spool and having a guide groove for passing the film. The winding spools are axially connectable to each other. Each reel member includes a plurality of flanges mounted on the winding spool.

Abstract: A target containing an indium oxide and a tin oxide is used and sputtered particles from the target are transported by a forced gas flow of a sputter gas onto an organic substrate and deposited on the organic substrate while applying a DC bias voltage or an RF bias voltage to the organic substrate. The organic substrate is close to the target so that it is positively acted on by plasma. Thus, an ITO transparent conductive film having a resistivity of 10?3 ohm.cm or less is formed on the organic substrate. The formed ITO transparent conductive film has a ratio of 1:1 or more and 4:1 or less between the peak intensity the (222) plane and the peak intensity of the (400) plane of the indium tin oxide in X-ray diffraction.

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Abstract: Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position. First and second adhesive tapes are stuck over the holes, respectively. In the bottoms of the first and second holes, adhesive layers of the first and second adhesive tapes are exposed. Therefore, the main tape is stuck on a core at its winding initiating position and on the roll itself at its winding terminating position. Information may be printed on a surface of the first adhesive tape.

Abstract: Protective devices for preventing overcurrent and overvoltage are disclosed. The devices includes a base substrate, a pair of electrodes formed on the base substrate, and a low-melting metal element connected between the pair of electrodes to interrupt the current flowing between the electrodes by fusion. An insulating cover plate is positioned and fixed in contact with the pair of electrodes serving as a spacer member.

Abstract: The flexible wiring board included in a board piece is exposed at both ends of the board piece, and connected to heterogeneous pieces via connecting flexible wiring boards to form a composite wiring board. Such a board piece is more convenient than storing the composite wiring board because various components can be individually stored and handled.

Abstract: A secondary battery of the present invention a heat-sensitive element which varies in resistance value due to change of temperature is not placed on a path through which a charge or discharge current flows into or out of a storage battery. Accordingly, when a main switch element generates heat due to an overcurrent, a change in resistance value of the heat-sensitive element resulting from the heat will allow an auxiliary switch to be turned ON, thereby causing first and second auxiliary fuses to be blown. The charge or discharge current causes no power consumption at the heat-sensitive element, thereby providing high efficiency. The heat-sensitive element can be reduced in current capacity for use and it is suitable for compact design.

Abstract: A secondary battery device 1 including multiple protective circuits U1-U3 connected in parallel and each having two fuses fa, fb connected in series, wherein a terminal tc of each heater h is connected to a switch element 4 via rectifier element D1-D3. Even if a potential difference is generated between terminals tc, no residual current flows because any one of the rectifier elements D1-D3 is reverse-biased.

Abstract: A novel perfluoropolyether derivative, which has at least one ester bond and is useful as a lubricant with a decomposition temperature of 300° C. or more, is obtained by an esterification reaction between a perfluoropolyether diol having hydroxyl groups at both ends thereof and represented by the formula (1) and a perfluoropolyether dicarboxylic acid having carboxyl groups at both ends thereof and represented by the formula (2): HOCH2—R—CH2OH??(1) HOOC—R?-COOH??(2) wherein each of R and R? is a perfluoroether group.

Abstract: An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21. If the resist film 24 is formed after a flexible resin coating 22 is formed on the rigid resin coating 21, the flexible resin coating 22 can serve as an adhesive layer.

Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.

Abstract: The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.

Abstract: In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. After a first electroless plating layer and a first conductive material are sequentially grown on a surface of the first base film, a first coating conductive layer composed of the first electroless plating layer, the first conductive material and the first surface conductive layer, is etched to have a reduced thickness. Then, the first coating conductive layer is patterned to form a first wiring layer. In this manner, a desired pattern width can be obtained even in the case where the first coating conductive layer is patterned by isotropic etching such as wet etching.

Abstract: A novel adhesive cures quickly at a lower temperature and ensures reliable connection of objects the adhesive connects with each other. The adhesive includes a metal chelate, a silane coupling agent and a thermosetting resin. The silane coupling agent in the adhesive is hydrolyzed at its alkoxy groups to form silanol groups, which in turn react with the metal chelate to produce cations in the adhesive. The resulting cations cause the epoxy resin as a thermosetting resin, to undergo cationic polymerization. The adhesive of the present invention cures at a lower temperature by taking advantage of the cationic polymerization.

Abstract: Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position. First and second adhesive tapes are stuck over the holes, respectively. In the bottoms of the first and second holes, adhesive layers of the first and second adhesive tapes are exposed. Therefore, the main tape is stuck on a core at its winding initiating position and on the roll itself at its winding terminating position. Information may be printed on a surface of the first adhesive tape.