Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

Abstract: An anisotropic conductive adhesive film contains a first insulating adhesive layer, a second insulating adhesive layer whose modulus of elasticity after curing is less than the modulus of elasticity of the cured first insulating adhesive layer, and electrically conductive particles which are dispersed in at least either the first insulating adhesive layer or the second insulating adhesive layer.

Abstract: An IC card 10A has a mica capacitor 5, an antenna coil 2 and an IC chip 3 formed on an insulating substrate 1, where the mica capacitor is composed of a mica film 6 and electrodes 7a and 7b formed on both sides of the mica film 6. terminal of the electrode 7b on one side of the mica capacitor 5 is formed on the other side of the mica capacitor 5, and this terminal and a terminal of the electrode 7a on the other side are connected on the insulating substrate 1 with the use of an anisotropic conductive adhesive 4. Thus, an IC card can be manufactured at low cost, in which the resonance frequency is stabilized and the antenna characteristics are improved.

Abstract: A process for manufacturing a flexible wiring board with easy handling at reduced production costs comprises the steps of forming a first wiring pattern and a guide pattern around the outer periphery of the first wiring pattern on a copper foil, and forming an insulating film on the first wiring pattern and guide pattern.

Abstract: The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.

Abstract: The present invention aims to provide a bonding material with excellent adhesion, electric connection and insulation properties, which can be used to bond the sides of a pair of members to be connected having a plurality of electrodes without causing short circuit between adjacent electrodes even under the application of high voltage or high current across opposite electrodes on the members to be connected, by bonding members to be connected with the bonding material of the present invention without causing short circuit between adjacent electrodes, even under the application of high voltage across opposite electrodes, because the bonding material of the present invention contains metal ion scavenger particles containing a bismuth-based ion exchanger and a vinyl triazine compound and having an average particle diameter smaller than that of conductive particles.

Abstract: An anisotropic conductive adhesive film contains a first insulating adhesive layer, a second insulating adhesive layer whose modulus of elasticity after curing is less than the modulus of elasticity of the cured first insulating adhesive layer, and electrically conductive particles which are dispersed in at least either the first insulating adhesive layer or the second insulating adhesive layer.

Abstract: A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm2 or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.

Abstract: An adhesive prepared by blending a hardening resin serving as the main component with an urethane resin having a polycarbonate structure. The addition of the urethane resin with the polycarbonate structure makes it possible to give an adhesive which has a high solvent resistance and a good low temperature impact resistance and achieves good adhesion between vinyl chloride and a steel plate. This urethane resin can be obtained by reacting a polyol with an isocyanate compound. It is advantageous to use the urethane resin in an amount of 5 to 35% by weight.

Abstract: A technique for improving the adhesive force between a biodegradable base film and a rubbery adhesive layer. An adhesive tape is obtained by rubbing the surface of a biodegradable film 9 by a means of rubbing 7 and then applying solution of ingredients of adhesive layer thereonto, thus forming an adhesive layer. The adhesion force between the base film and the adhesive layer is improved by the rubbing treatment. When the solution of ingredients of adhesive layer is an aqueous system, it is also possible that solution of ingredients of primer layer containing an organic compound as a solvent is applied onto the rubbed surface to thereby form a primer layer followed by the formation of the adhesive layer. The adhesive layer may contain fillers, coloring agents, age resistors, etc. so long as the biodegradability is not deteriorated thereby. It is preferable that a separate film to be bonded to the surface of the adhesive layer is also a biodegradable one.

Abstract: A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.

Abstract: A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of surface of the metal wiring, is adhered to another flexible wiring board piece having a metal projection on which a metal coating is formed. One of or both of the metal coatings on the metal wiring and the metal projection is composed of a soft metal coating a surface of which has a Vickers' hardness of 80 kgf/mm2 or lower. The metal coating of the metal wiring contacts with the metal coating of said metal projection and ultrasonic wave is applied thereto to connect the metal wiring with the metal projection.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: Insulating adhesives or adhesive films which ensure both of sufficient repairability and continuity reliability and connection methods with the use of the same are provided.

Abstract: A process for producing a semiconductor device comprises mounting of a semiconductor element on a circuit board via a thermosetting resin-based adhesive by means of a thermocompression process, wherein the thermocompression process is carried out under a first set of conditions (pressure=P1 and temperature=T1) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure=P2 and temperature=T2) designed to bring about curing of the thermosetting resin, provided that pressure P2 of the second set of conditions is set to a lower level than the pressure P1 of the first set of conditions.

Abstract: The information recording tag includes an IC module in which an IC chip and a resonance circuit which is composed of a film capacitor and of an antenna coil are packaged on a substrate, and an adhesive that is applied to the IC module in order to adhere said IC module to an adherend S. The adhesive force between the adhesive and the adherend S is greater than the adhesive force between the insulation film of the film capacitor and the film type electrodes. The information recording tag, that is affixed to a prescribed adherend and used, can be destroyed if an attempt is made to remove it from its adherend after the information recording tag has been affixed to an adherend, in order to prevent improper usage of the information recording tag.

Abstract: A bump formation etching mask is formed on the bump formation side of a metal foil having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit and the height t2 of the bumps to be formed on a wiring circuit. The bumps are formed by half-etching the metal foil from the bump formation etching mask side down to a depth corresponding to a predetermined bump height t2. A metal thin film layer formed of a different metal from the metal foil is formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations, such as plating pretreatments.

Abstract: An anisotropically electroconductive connecting material, which is disposed between a connection terminal on a first substrate and a connection terminal on a second substrate and joins the substrates together by thermocompression bonding while maintaining electroconductive connection therebetween, includes electroconductive particles dispersed in an insulating adhesive, wherein the modulus of elasticity of the electroconductive particles at the compression bonding temperature is 200% or less of the modulus of elasticity of the first substrate at the compression bonding temperature.

Abstract: A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.

Abstract: A novel adhesive cures quickly at a lower temperature and ensures reliable connection of objects the adhesive connects with each other. The adhesive includes a metal chelate, a silane coupling agent and a thermosetting resin. The silane coupling agent in the adhesive is hydrolyzed at its alkoxy groups to form silanol groups, which in turn react with the metal chelate to produce cations in the adhesive. The resulting cations cause the epoxy resin as a thermosetting resin, to undergo cationic polymerization. The adhesive of the present invention cures at a lower temperature by taking advantage of the cationic polymerization.