Abstract: A product merchandizer system for installation on a shelf includes a pusher assembly that pushes products with which the product merchandizer system is stocked toward a front end of the shelf and at least one partition configured to project upwardly from the shelf. A horizontal bar is supported above a rear end of the shelf. The pusher assembly has a rear end configured to be clipped to the horizontal bar and a front end configured to rest on the shelf. The partition also has a rear end configured to be clipped to the horizontal bar and a front end configured to rest on the shelf at the front end of the shelf.

Abstract: A passively damped mechanical system is disclosed, for example for use in aerospace applications where vibration can adversely affect navigational and operational instruments. In one example, the passively damped mechanical system includes an end fitting of a strut used to connect a structural element to a payload. The end fitting may include outer and inner cylindrical hubs, with a space between the outer and inner cylindrical hub at least partially filled with a viscoelastic material. In a further example, the passively damped mechanical system includes legs used to connect a structural element to a bracket configured to support a payload. Each leg may include a hollow interior having a lattice structure to add strength and a viscoelastic material to provide passive damping.

Abstract: An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver, a transmitter, or a transceiver. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

Abstract: An image processing method and apparatus are provided. The method includes: acquiring a to-be-processed image; determining a weather type corresponding to the to-be-processed image; according to the weather type, acquiring an environment noise feature in the to-be-processed image corresponding to the weather type; and obtaining a non-noise image feature of the to-be-processed image according to the environment noise feature, and according to the environment noise feature, the non-noise image feature and the to-be-processed image, generating a denoised image corresponding to the to-be-processed image.

Abstract: Examples described herein include methods and computing systems which may include examples of calculating risk scores for certain natural disasters perils based on machine learning model outputs. For example, a machine learning model may weight each of the pixels of a map in accordance with the set of weights associated with a structure, to calculate a risk score for a particular natural disaster peril associated with that structure. A plurality of risk selections may be provided to a user computing device for selection by a user, with those risk selections being associated with that risk score. Advantageously, the computing system facilitates the interaction of datasets with different measurement parameters in a machine learning model. In normalizing datasets before providing the datasets to input nodes of a machine learning model, a computing system may efficiently provide hazard and vulnerability outputs of the machine learning model.

Abstract: An intelligent drawing-model checking method includes: acquiring a first drawing model and a second drawing model, determining an alignment base point according to the first drawing model and the second drawing model, and aligning the first drawing model and the second drawing model into a same reference coordinate system using the alignment base point; determining axis vectors in the first drawing model and the second drawing model according to a standard axis net, calculating a cosine value between the axis vectors, and rotationally aligning at least one of the first drawing model and the second drawing model according to the cosine value; and displaying lines and points in the first drawing model after the rotational alignment in a first color, displaying lines and points in the second drawing model after the rotational alignment in a second color, and checking the drawing models by color mixing distinguishing.

Abstract: A semiconductor wafer with a diameter of at least 100 mm for forming semiconductor components, having a substrate with a top and a bottom. The substrate is formed of silicon at the top. Multiple spots having oxygen are formed integrally with the top of the substrate. The spots have oxygen cover at least 0.005% and at most 35% of the top of the substrate. A full-area semiconductor buffer layer sequence integrally covers the top of the substrate and the spots having oxygen. The semiconductor buffer layer sequence has at least one group III nitride layer.

Abstract: A protection of space solar cells in an arrangement in the form of a string that extends in an X direction. In each case two space solar cells directly neighboring in the X direction are electrically connected to one another in series via a metallic connector of a first type. The string has a first end and a second end opposite from the first end, and a protection arrangement is provided directly at one of the two ends along a y direction. The protection arrangement includes a first string protection diode arrangement, a metal strip, and a second string protection diode arrangement provided in the Y direction. The protection arrangement is electrically connected to one of the two ends of the string via two spaced-apart metal strips, and each string protection diode arrangement includes multiple unhoused string protection diodes.

Abstract: A thrust generator is provided for producing thrust to move a spacecraft. The thrust generator includes a housing having a first end and an opposing second end. The first end is associated with a mount for coupling to the spacecraft. The housing further defines a central axis extending through the first end and the second end. The second end defines an annular propulsion outlet. At least one nozzle is positioned proximate the second end. The thrust generator is selectively operable in a first mode in which the thrust generator uses propellant to electrostatically generate thrust via the annular propulsion outlet, and a second mode in which the thrust generator uses propellant to gas-dynamically generate thrust via the at least one nozzle.

Abstract: This application relates to a leak detector device (100) for detecting an internal leak in a fluid path. The leak detector comprises a housing (110) with a flow passage (120) extending through the housing (110), one or more pairs of temperature sensors (130, 140) for detecting a temperature difference between an outside of the housing (110) and the flow passage (120), one temperature sensor of each pair being arranged towards an outer surface of the housing (110) and the other temperature sensor of the pair being arranged towards an innersurface of the housing (110) that faces the flow passage (120), and an array of electrically conductive wires (150, 160) that extend across the flow passage (120). The array of electrically conductive wires (150, 160) comprises one or more positive polarity wires and one or more negative polarity wires. The application further relates to a corresponding method of leak detection.

Abstract: Powder-based additive manufacturing processes for producing integral parts with multiple metallic materials are disclosed. The integral parts are printed as single pieces by joining different metallic materials together during printing. A combination of different powder-based additive manufacturing processes or the same process can be used to produce the integral part.

Abstract: An intelligent drawing-model checking method includes: acquiring a first drawing model and a second drawing model, determining an alignment base point according to the first drawing model and the second drawing model, and aligning the first drawing model and the second drawing model into a same reference coordinate system using the alignment base point; determining axis vectors in the first drawing model and the second drawing model according to a standard axis net, calculating a cosine value between the axis vectors, and rotationally aligning at least one of the first drawing model and the second drawing model according to the cosine value; and displaying lines and points in the first drawing model after the rotational alignment in a first color, displaying lines and points in the second drawing model after the rotational alignment in a second color, and checking the drawing models by color mixing distinguishing.

Abstract: A method for producing a semiconductor wafer comprising silicon and comprising a III-N layer, which has an upper layer region with a top side and a lower layer region with a bottom side. The semiconductor wafer having a total thickness of at least 1.2 mm, and the semiconductor wafer being divided along the total thickness into the upper and lower layer regions. The upper layer region having a peripheral marginal region, and the lower layer region having a second maximum diameter. A connecting region is formed between the upper layer region and the lower layer region. The connecting region having a third diameter, and the third diameter being smaller than the first maximum diameter, comprising producing a nitride layer comprising a III-N layer formed on the upper layer region, and generating a peripheral, edge-filleted or beveled marginal region at the upper layer region.

Abstract: A III-N silicon semiconductor wafer having an upper layer region and a lower layer region, wherein the upper layer region has a nitride layer with a formed III-N layer, and the lower layer region includes a silicon layer. The semiconductor wafer has a total thickness of at least 1.2 mm and is disk-shaped, and the semiconductor wafer is divided along a total thickness into the upper layer region and the lower layer region. The upper layer region has a circumferential edge region, and the upper layer region has a first maximum diameter of at least 145 mm, and the upper layer region has a thickness greater than 30 ?m and less than 950 ?m. The lower layer region has a second maximum diameter, and a connection region is formed between the upper layer region and the lower layer region, wherein the connection region has a third diameter.

Abstract: A radiational cooling film providing a variable wavelength which determines a solar heat shielding rate according to the internal temperature of a facility and changes a wavelength conversion section of the film exposed to sunlight to radiate a necessary wavelength according to the growth stage of plants, and a wavelength conversion device and system using the same are provided. The radiational cooling film providing a variable wavelength includes a base layer including a first region and a second region on one surface, a heat barrier layer disposed on a part of the other surface of the base layer, the first region being provided with the heat barrier layer, and the second region being not provided with the heat barrier layer, and a wavelength conversion layer including a plurality of wavelength conversion sections separated from each other in each of the first region and the second region.

Abstract: This application relates to a method of performing wireless communications between a hub station and a plurality of user terminals. The method comprises transmitting radio signals to subsets of user terminals among the plurality of user terminals with sets of active beams, wherein the active beams have beam centers that are determined based on locations of the user terminals. The method further comprises, for each of a plurality of radio resource blocks: selecting a subset of user terminals among the plurality of user terminals; for each user terminal among the subset of user terminals, determining a beam center based on a location of the respective user terminal; and transmitting, using the respective radio resource block, radio signals to the user terminals among the selected subset of user terminals, in beams corresponding to the determined beam centers.

Abstract: A digital model of a structure may be aligned with a device view of the structure using a location marker. In embodiments, the location marker may be an optical marker, a radio beacon, or one or more objects that can be recognized to a unique pattern. Device orientation information is used in conjunction with the location marker to align the digital model, so that the device can overlay one or more AR objects or other information on a view of the structure with relative precision. Other embodiments may be described and/or claimed.

Abstract: The invention involves an method, which includes providing a plurality of game cards, each having a grid of tiles formed in a plurality of rows and a plurality of columns. Each tile corresponds to a defined result chosen from a plurality of defined results. The method includes selecting a tile from each of the plurality of game cards, and comparing the defined result of the selected tile to a selected one of the plurality of defined results. The selected one of the plurality of defined results is selected in response to an occurrence.

Abstract: In some embodiments, a phased array antenna system includes a carrier having a first side and a second side opposite the first side; a first antenna element and a second antenna element coupled to the first side of the carrier, the second antenna element spaced apart from the first antenna element by a space and a signal conditioning module including a support structure having a first side and a second side opposite the first side, one or more signal conditioning elements coupled to the first side of the support structure, and a plurality of coupling elements coupled to the second side of the support structure, wherein at least one of the plurality of coupling elements electrically couples the signal conditioning module to the first antenna element; and at least another of the plurality of coupling elements electrically couples the signal conditioning module to the carrier.