Abstract: In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow.

Abstract: An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member.

Abstract: A method of fabricating a soft, resilient backing pad adapted for attachment to a pressure plate for planarizing work pieces wherein the outer exposed surface of the pad has been abraded by means of dry abrasive particles fixed on a surface of a spherical convex lapping wheel.

Abstract: In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow.

Abstract: In a polishing machine for polishing parts between a table and an upper polishing head, the upper polishing head includes push rods to clear the workpieces after a polishing operation. A push ring engages the push rods as a polishing head is being raised, holding the workpieces in position on the table.

Abstract: An apparatus for detecting the presence of a workpiece on a polishing pad of a chemical mechanical polishing (CMP) machine employs an optical interrogation signal that is applied during the CMP process. An optical probe assembly produces a light signal that communicates with the polishing pad; portions of the light signal reflect from the polishing pad in a scattered manner. A light receptor receives reflected light associated with the interrogation signal, and the characteristics of the received light are analyzed and processed by a processor used by the apparatus. By analyzing the scattered light signals, the apparatus distinguishes the reflective characteristics of the polishing pad from the reflective characteristics of the workpiece. Thus, the apparatus is capable of detecting a lost or broken workpiece in a fast and effective manner.

Abstract: The present invention relates generally to abrasive stone pads for use in processing workpiece surfaces. The abrasive stones generally are produced by combining a phenolic resin mixture with a diluent and then injecting microballoon structures into the resin/diluent mixture to create a porous solution. The diluent is initially ball milled with an abrasive in a tumbler to eliminate the agglomerates and is then added to a resin monomer. A suitable catalyst is added to the mixture to create a chemical reaction, further increasing the porocity of the substance. The mixture is poured into molds and with through a filter or frit plate to remove excess resin and diluent. Finally, the mixture is cured, creating abrasive stones having a uniform surface and bulk structure with a uniform hardness, suitable for workpiece grinding.

Abstract: A retainer ring for retaining a thin workpiece during machining thereof, the retaining ring being of a design which facilitates distribution of an abrasive slurry used in the machining operation.

Abstract: Polishing of wafers, such as wafers of semiconductive material is carried out by mounting the wafer to a carrier, and pressing the wafer against a polishing pad carrying a polishing media. An antenna is placed beneath the polishing pad and electrical energization is applied between the carrier assembly and the antenna. The electrical energization preferably includes a direct current bias, but may also include ratio frequency carrier injection signal. The noise associated with ionic disassociation is monitored to assess ongoing polishing activity, on a real time basis.

Abstract: In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow.

Abstract: A rotating polishing wheel having secured to its top surface a polishing pad and a vertically movable carrier element for carrying a workpiece to be polished into contact with the polishing pad and exerting a desired pressure on the workpiece. Operatively attached to the carrier is a conditioning element movable with the carrier and having on its bottom surface cutting means disposed in a circular configuration for conditioning the polishing pad by contact therewith.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract: A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.

Abstract: Frictional articles useful for power transmission such as frictional drive belts and as non-slip friction surfaces comprised of a matrix of fibers impregnated with a cured and set polyurethane resin.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract: A machine for simultaneously finishing two sides of a workpiece simultaneously, the machine having a base, an upper polishing plate, a lower polishing plate, a carrier holding one or more workpieces between the upper and lower polishing plates, a motor attached to a spindle having a first axis, which is fixedly attached to a spindle cam having a second axis such that when the spindle rotates about the first axis, the second axis of the spindle cam moves in a circular non-rotational manner circumscribing a circle having a radius defining a critical radius. The movement of the circular spindle cam causes the lower polishing plate to move in a circular non-rotational manner. The lower polishing plate is connected to one or more eccentric cams by one or more lower polishing plate linkages. The circular non-rotational movement of the lower polishing plate is transferred to the upper polishing plate by one or more eccentric cams via lower polishing plate linkages, and one or more upper polishing plate linkages.

Abstract: An automated free abrasive apparatus for machining substantially similar workpieces on one side. In the apparatus a plurality of substantially similar workpieces are oriented and arranged in a lay flat configuration. Thereafter transport elements transfer the oriented laid flat workpieces to an indexing table which is movable vertically and horizontally to transport the workpieces to a machining area wherein the workpieces are machined. The orientation and machining or lapping of the workpieces is accomplished automatically without the need for an operator feeding each workpiece into the machining operation.

Abstract: A disc finishing machine comprising an annular upper platen, lower platen, a center driving ring, a plurality of a clamping guide rollers, a plurality of stationary guide rollers, a clamping guide roller, and stationary guide roller perpendicularly attached to one of a plurality of a roller stanchions. The polishing machine capable of imparting a circumferential pattern on a plurality of disc-shaped work pieces.

Abstract: A grinding apparatus comprises first and second grinding wheels for grinding the arms of E-cores, or any other desired item, having two different lengths, in a single grinding operation.