Abstract: A disc finishing method using a machine comprising an annular upper platen, lower platen, a center driving ring, a plurality of a clamping guide rollers, a plurality of stationary guide rollers, a clamping guide roller, and stationary guide roller perpendicularly attached to one of a plurality of a roller stanchions. The polishing machine capable of imparting a circumferential pattern on a plurality of disc-shaped work pieces.

Abstract: A grinding apparatus comprises first and second grinding wheels for grinding the arms of E-cores, or any other desired item, having two different lengths, in a single grinding operation.

Abstract: A measuring bar for determining flatness and deviations therefrom comprises a rigid bar, and a plurality of support feet projecting from the bar. The support feet have free ends which occupy a common, flat plane, the free ends of each of the support feet defining a transverse supporting surface of essentially 0.005 to 0.025 inch across. Measuring devices are carried on the bar for measuring the spacing from the flat plane of at least one point on a target surface against which the support feet free ends rest, the measured point being spaced from the support feet.

Abstract: A control valve assembly for controlling the flow of abrasive slurry from a supply pump, directing a selected amount of abrasive slurry to the lapping wheel of an associated lapping machine, and recirculating the remainder of the supply of abrasive slurry to the supply pump.

Abstract: The disclosure teaches an improved manner of firmly holding a thin brittle wafer, such as a 0.01" thick silicon disc 3" in diameter, so as to allow the wafer to be brought into abrading contact with a moving lap wheel. The fixturing provides a pedestal ground flat and a pad of resilient but firm cellular material bonded on the pedestal and ground flat also. The pedestal and pad are each sized only slightly larger than the wafer to be lapped. A guide ring surrounds the pedestal and pad, leaving only a slight clearance gap therebetween, and further projects away from the pad a distance less than the thickness of the wafer as it will be after lapping. A special liquid is applied as a thin uniform film over the face of the pad, and the wafer is biased against the pad face with a uniform force sufficient to squeeze the film to near zero thickness and into the open cells or pores of the pad.

Abstract: This disclosure teaches structure for mounting a pressure plate relative to its supporting shaft in such a manner that axial forces are transmitted between the shaft and pressure plate while yet providing that the plate can freely rotate and swivel relative to the shaft even at varying angles of tilt. The mounting structure includes a pair of angular contact bearings arranged in back to back relationship, the inner races thereof being confined on the shaft and the outer races thereof being confined within a housing block. The housing block is nonrotatably keyed to the pressure plate and a single ball bearing is mounted between the pressure plate and bearing block in axial alignment with the shaft and with the pressure plate.

Abstract: The regulator assembly comprises body member carried by a support and defining a cavity for detaining a pool of abrasive slurry. An overflow device is associated with the body member for establishing the upper level of a pool of abrasive slurry in the cavity. At least one flow-restrictive conduit component is secured at one end to the body member, communicates with the cavity at the lower end of the pool of abrasive slurry, and presents an outer end from which abrasive slurry is discharged. One of the above-indicated elements is movable whereby to selectively adjust the vertical distance between the plane of the upper level of the pool of abrasive slurry and the plane of the outer end of the conduit component.

Abstract: The regulator assembly comprises body member carried by a support and defining a cavity for detaining a pool of abrasive slurry. An overflow device is associated with the body member for establishing the upper level of a pool of abrasive slurry in the cavity. At least one flow-restrictive conduit component is secured at one end to the body member, communicates with the cavity at the lower end of the pool of abrasive slurry, and presents an outer end from which abrasive slurry is discharged. One of the above-indicated elements is movable whereby to selectively adjust the vertical distance between the plane of the upper level of the pool of abrasive slurry and the plane of the outer end of the conduit component.

Abstract: The regulator assembly comprises body means carried by a support and defining a cavity for detaining a pool of abrasive slurry. Overflow means is associated with the body means for establishing the upper level of a pool of abrasive slurry in the cavity. At least one flow-restrictive conduit means is secured at one end to the body means, communicates with the cavity at the lower end of the pool of abrasive slurry, and presents an outer end from which abrasive slurry is discharged. One of the above-indicated means is movable whereby to selectively adjust the vertical distance between the plane of the upper level of the pool of abrasive slurry and the plane of the outer end of the conduit means.