Abstract: The aim of the invention is to attain a uniform and homogeneous treatment of substrates in a device comprising at least one process container which is arranged in a gas atmosphere and which contains a treatment fluid. Said process container also comprises at least two openings which are located underneath a treatment fluid surface and through which the substrates are linearly guided. In addition, an overflow for the treatment fluid is provided.

Abstract: A device for the treatment of substrates has a fluid container and two substrate transport devices positionable above the fluid container. Each substrate transport device is a hood for receiving multiple substrates. Each substrate transport device has at least one substrate support device having a first position for locking the substrates and a second position for releasing the substrates. The substrate transport devices are rigidly connected to one another and linearly movable for alternatingly positioning one of the substrate transport devices above the fluid container.

Abstract: A method and apparatus for treating substrates in a fluid container with at least one fluid and ultrasound provided. Each of two oppositely disposed walls of the fluid container are provided with at least two ultrasound radiation areas that can be respectively individually activated. The ultrasound radiation areas of one of the container walls is activated in a chronological relationship to the ultrasound radiation areas of the other container wall in such a way that oppositely disposed ultrasound radiation areas of the container walls are not activated simultaneously.

Abstract: In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.

Abstract: A processing tank has at least one fluid distribution device for introducing a treatment fluid. The fluid distribution device has at least one porous hollow rod, at least one porous plate, at least one capillary plate, or at least one single-ply or multi-ply fabric.

Abstract: An apparatus and method for processing substrates are provided. The apparatus includes a first processing unit and a second processing unit. A substrate holder is vertically displaceable over the first processing unit, and is guided outside the first and second processing units. In a raised position of the substrate holder relative to the first processing unit, the second processing unit is movable between the substrate holder and the first processing unit.

Abstract: A method of cleaning substrates is provided. Prior to, during or prior to and during a cleaning process, fluid is applied to a substrate surface to form a fluid film thereon. Ice crystals are introduced into the fluid film on the substrate surface. The ice crystals have a temperature that is lower than the temperature of the fluid such that the fluid changes the ice crystals into a gaseous state to form a pulse generated in the fluid film. The depth of penetration of the ice crystals into the fluid film is controlled such that the ice crystals do not strike the substrate surface. The substrate surface is cleaned with the pulse.

Abstract: In a method for treating substrates, the substrates are lowered for treatment into a treatment fluid contained in a treatment device. The substrates are then lifted by a first receiving device at least partially out of the treatment fluid and transferred to a second receiving device for completely lifting the substrates out of the treatment fluid. The second receiving device is completely dry at the time of transfer. The drops forming at the lowest point of the substrates are drained during lifting by a drop draining element. The device for performing the method has a lifting device with a first and second receiving device and a drop draining device for draining the drops forming at the lowest point of the substrates during lifting of the substrates from the treatment fluid.

Abstract: An apparatus for discharging a liquid from a container is provided. A mobile unit is disposed in the container in such a way as to be movable therein in a contact-free manner for reducing the volume of the container. A bellows connects the mobile unit in a liquid-tight manner to an inner wall of the container. An interior chamber of the bellows that faces away from the container, together with a housing, form a space that is closed off against the exterior. A spindle, as a drive apparatus, is disposed in this space. The spindle is connected to the mobile unit in the interior chamber of the bellows.

Abstract: A device for the treatment of substrates (2) has a container having a bottom and being filled with a treatment fluid. The treatment fluid streams in from below through the bottom of the container. At least two inlet tubes are provided for the treatment fluid underneath the container bottom. Each of the at least two inlet tubes is provided with projecting comb-like distribution channels. The at least two inlet tubes and the distribution channels are arranged in a common plane. The distribution channels of one of the at least two inlet tubes are respectively positioned between two of the distribution channels of the other one of the two inlet tubes.

Abstract: In a device for the wet treatment of substrates (3) in a container (1), containing a treatment fluid (2), whereby the substrates (3) are introduced into the container (1) with a substrate carrier (5), an optimal alignment and centering of the substrates (3) will result within the container (1) upon lifting from the container (1) with the aid of a substrate receiving device (4) provided within the container (1).

Abstract: A method and apparatus for handling substrates in a fluid container are provided. Even large substrates receive a particularly reliable support by means of at least one support strip that can be placed upon the upper edge portion of the substrates, and in particular in such a way that the support strip does not come into contact with treatment fluid in the tank.

Abstract: A device for the treatment of substrates has a container having walls and being filled with a treatment fluid. At least one substrate carrier is mounted in the container so as to move the substrates vertically in a reciprocating manner without a substrate support. Substrate side walls are provided between the substrates and the container walls. These substrate side walls extend parallel to the substrates and are vertically movable in a reciprocating manner with the substrates.

Abstract: A device for the treatment of substrates has a fluid container filled with a treatment fluid and at least one substrate receiving device. A lifting device is provided for lifting and lowering the at least one substrate receiving device out of and into the treatment fluid. The lifting device is arranged laterally at the container and has parts that are positioned above the container and the treatment fluid. A vapor suction device with a suction channel is provided for exhaustion of vapors in an area in which parts of the at least one lifting device are located above the treatment fluid. In the area above the treatment fluid, a plate is provided having an opening to which the suction channel is connected.

Abstract: A treatment apparatus for treating substrates includes a fluid container and a device for moving in a reciprocating manner the substrates within the fluid container during treatment to thereby make accessible areas of the substrates that would otherwise be obstructed by parts of the device.

Abstract: A fluid heater has a fluid pipe through which a fluid flows. A radiant heating element is enclosed in a quartz mantle. The fluid pipe is concentrically arranged about the quartz mantle. A first temperature sensor is positioned at a section of the outer circumference of the fluid pipe opposite the heating element.

Abstract: An apparatus for processing substrates is provided. The apparatus includes a receptacle for containing processing fluid, and at least one substrate support. Components of the receptacle and/or substrate support that come into contact with processing fluid have a protective layer. Guide or support members for the substrates are fused to the protective layer.

Abstract: A device for the treatment of substrates has a container filled with a treatment fluid and at least one receiving device for lifting substrates or at least one substrate carrier out of the treatment fluid. The receiving device has a fluid suction device with suction openings and the suction openings are connected to a vacuum source. The suction openings are provided for removal of residual fluid from the substrates or the at least one substrate carrier after lifting of the substrates or the substrate carrier from the fluid. The suction openings are arranged in the vicinity of lower areas of the substrates or the substrate carrier, wherein the lower areas are located adjacent to the receiving device.

Abstract: An apparatus for the processing of substrates in a fluid tank is provided. The fluid tank has at least one fluid inlet opening and at least one overflow opening in the upper region of at least one side wall of the fluid tank. Optimum adaptation to fluid circulation rates is provided by at least one slide having a variable position relative to the overflow opening for varying the opening area thereof. This opening area is smaller during introduction of gas than during a preceding rinsing process.

Abstract: In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.