Abstract: A band-gap reference voltage generator for generating a stable band-gap reference voltage including a chopped band-gap circuit, a first sample and hold circuit coupled to the chopped band-gap circuit, a second sample and hold circuit coupled to the chopped band-gap circuit, and an output circuit coupled to the first and second sample and hold circuits for generating the stable band-gap reference voltage.

Abstract: A method for protecting a calculation on an elliptic curve, by an electronic circuit, wherein a point of an elliptic curve is multiplied by a digital quantity, comprising the steps of: initializing a first variable with a value which is a function of a random quantity; initializing at least a second variable with a value which is a function of the digital quantity; at least for a bit at 1 of the digital quantity, the first variable is updated by: a) subtracting a multiple of the random quantity; and b) adding the content of the second variable; and once all the bits of the digital quantity have been processed, subtracting from the first variable the product of the point to by the random quantity to provide the result.

Abstract: An electronic package includes at least one heat-transfer element interposed between a front side of an integrated-circuit chip and a back side of a heat-transfer plate. An encapsulation block has a portion lying between the front side of the integrated-circuit chip and the back side of the heat-transfer plate. The portion embeds the heat-transfer element. Another heat transfer element is interposed between a front side of a electrical-connection support plate and a rim portion of the heat-transfer plate.

Abstract: An integrated thermoelectric generator includes a semiconductor. A set of thermocouples are electrically connected in series and thermally connected in parallel. The set of thermocouples include parallel semiconductor regions. Each semiconductor region has one type of conductivity from among two opposite types of conductivity. The semiconductor regions are electrically connected in series so as to form a chain of regions having, alternatingly, one and the other of the two types of conductivity.

Abstract: A method for protecting a calculation, by an electronic circuit, of a modular exponentiation of a digital quantity, wherein: a first variable is initialized with a random quantity; at least one second variable is initialized with a value which is a function of the digital quantity; at least for a bit at 1 of an exponent of the modular exponentiation, the first variable is updated by: a) the quotient of its content and a power of the random quantity; and b) the product of its content by that of the second variable; and once all the exponent bits have been processed, the content of the first variable is divided by the random quantity to provide the result of the modular exponentiation.

Abstract: A phase-locked loop double-point modulator may include a frequency divider having a ratio which can be changed by a first modulation signal, and an oscillator, a frequency of which can be changed by a second modulation signal correlated to the first modulation signal. A calibration circuit may be configured, in a calibration mode, to match the gains of the first and second modulation signals based on frequency measurements of the oscillator for two different calibration values of the second modulation signal. The phase-locked double-point modulator may also include an attenuator having a constant ratio greater than 1 and placed in the path of the second modulation signal, and a selector switch configured to be controlled by the calibration circuit to reduce the ratio of the attenuator in the calibration mode.

Abstract: An embodiment of an integrated circuit includes first and second semiconductor layers and a contact region disposed in the second layer. The first semiconductor layer is of a first conductivity, and the second semiconductor layer is disposed over the first layer and has a surface. The contact region is contiguous with the surface, contacts the first layer, includes a first inner conductive portion, and includes an outer conductive portion of the first conductivity. The contact region may extend deeper than conventional contact regions, because where the inner conductive portion is formed from a trench, doping the outer conductive portion via the trench may allow one to implant the dopants more deeply than conventional techniques allow.

Abstract: The disclosure relates to a countermeasure method in an electronic microcircuit, comprising successive process phases executed by a circuit of the microcircuit, and adjusting a power supply voltage between power supply and ground terminals of the circuit, as a function of a random value generated for the process phase, at each process phase executed by the circuit.

Abstract: A method for protecting a calculation, by an electronic circuit, of a modular exponentiation of a digital quantity, wherein: a first variable is initialized with a random quantity increased by once unit; a second variable is initialized with the product of the digital quantity by the random quantity; a third variable is initialized with the digital quantity; iteratively for all the bits at 1 of an exponent of the modular exponentiation, the first variable is updated by: a) multiplying its content by that of the third variable; and b) subtracting thereto the content of the second variable increased by the random quantity; and once all the bits of the exponent have been processed, the content of the first variable is decreased by the random quantity to provide the result of the modular exponentiation.

Abstract: The invention concerns a conducting layer having a thickness of between 1 and 5 atoms, an insulated gate being formed over a part of the conducting layer.

Abstract: An electronic integrated device may include a signal generation stage arranged to generate a first signal representative of an under voltage lockout logic signal. The signal generation stage may include a voltage divider block arranged to provide an internal reference voltage signal to a bandgap core group based upon a reference signal. The bandgap core group may generate the first signal based upon the internal reference voltage signal. The bandgap core group may further include a first generation module arranged to generate a output regulated reference voltage signal based upon the internal reference voltage signal, and a second generation module arranged to generate the first signal based upon the internal reference voltage signal and a driving signal obtained by a preliminary processing of the internal reference voltage signal by a bandgap core module included within the band gap core group.

Abstract: An embodiment of a microelectromechanical device having a first structural element, a second structural element, which is mobile with respect to the first structural element, and an elastic supporting structure, which extends between the first and second structural elements to enable a relative movement between the first and second structural elements. The microelectromechanical device moreover possesses an anti-stiction structure, which includes at least one flexible element, which is fixed only with respect to the first structural element and, in a condition of rest, is set at a first distance from the second structural element. The anti-stiction structure is designed to generate a repulsive force between the first and second structural elements in the case of relative movement by an amount greater than the first distance.

Abstract: A method of improving voice quality in a packet based network. The method includes receiving an incoming call from a first endpoint and matching capabilities between the first endpoint and the second endpoint. The method also includes completing the incoming call if the capabilities match and tracking the packet loss associated with the network. The method also includes negotiating the voice quality based on the tracking and the capabilities. Also described is a devices and system for a similar method.

Abstract: An imaging optical module is designed to be placed in front of an optical image sensor of a semiconductor component. The module includes at least one element which has a refractive index that varies between its optical axis and its periphery, over at least an annular part and/or over its central part. The element may be a tablet in front of the semiconductor sensor or a lens in front of the semiconductor sensor. The direction of variation in refractive index may be oppositely oriented with respect to the table and lens.

Abstract: An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.

Abstract: The present invention relates to an integrated electronic circuit including elements enabling to implement a logic function and means for attenuating the sensitivity of said elements to external disturbances, said attenuation means being disconnectable during phases of intentional modification of the state of said elements.

Abstract: A microprocessor includes a central processing unit, at least one call stack, a stack pointer, an address bus, and a data bus. The microprocessor further includes a hardware monitor configured to supply protection codes, insert the protection codes in the stack or let the central processing unit insert them, and then generate an error signal in response to an attempt to modify a protection code present in the stack.

Abstract: An electronic package includes a substrate wafer having front and rear faces and a through passage having a front window and a blind cavity communicating laterally with the front window. A receiving integrated circuit chip is mounted on the rear face and includes an optical sensor situated opposite the blind cavity. A transparent encapsulant extends above the optical sensor and at least partially fills the through passage. An emitting integrated circuit chip, embedded in the transparent encapsulant, includes an optical emitter of luminous radiation. The emitting integrated circuit chip may be mounted to the front face or within the through passage to the receiving integrated circuit chip. The substrate wafer may further include a second through passage. The receiving integrated circuit chip further includes a second optical sensor situated opposite the second through passage. A cover plate is mounted to the front face at the second through passage.

Abstract: Microsensors that include an integrated thermal energy source and an integrated temperature sensor are capable of providing localized heating and temperature control of individual sensing regions within the microsensor. Localized temperature control allows analyte detection to be carried out at the same temperatures or substantially the same temperatures at which the sensor is calibrated. By carrying out the sensing near the calibration temperature, more accurate results can be obtained. In addition, the temperature of the sensing region can be controlled so that chemical reactions involving the analyte in the sensing region occur near their peak reaction rate. Carrying out the sensing near the peak reaction rate improves the sensitivity of the sensor which is important as sensor dimensions decrease and the magnitude of the generated signals decreases.

Abstract: An integrated circuit including a substrate of a semiconductor material and first metal portions of a first metallization level or of a first via level defining pixels of an image. The pixels are distributed in first pixels, for each of which the first metal portion is connected to the substrate, and in second pixels, for each of which the first metal portion is separated from the substrate by at least one insulating portion.