Abstract: The invention relates to a method for serial data transmission, comprising the steps consisting in computing the running disparity (RD) of a bit stream that is being transmitted; when the running disparity reaches a threshold (T), computing a point disparity on a subsequent frame (S) of the stream; if the point disparity has the same sign as the threshold, inverting the states of the bits of the frame in the transmitted bit stream; and inserting into the transmitted bit stream a polarity bit having a state signalling the inversion.

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.

Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

Abstract: A video and/or audio decoder provided with a first terminal for supplying an analog audio and/or video signal, including: a first circuit capable of supplying a digital signal which is an image of said analog signal; a digital-to-analog converter capable of receiving as an input said digital signal; an amplifier coupling a second output terminal of the digital-to-analog converter to the first terminal; and a second circuit capable of comparing a signal representative of the voltage or current level on the first terminal with a reference signal, and of deducing therefrom whether the first terminal is connected or not to an analog input terminal of a video signal display and/or audio signal playing device.

Abstract: A voltage source wherein at least one first switch couples a first node of the voltage source to a node of application of at least one potential of a power supply voltage, and at least one first capacitive element couples the first node or a second node of the voltage source to a control node of the first switch.

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.

Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

Abstract: A method of controlling a current flowing through a load including the steps of: applying a first transfer function representative of the load to a first voltage to obtain a second voltage; applying the second voltage to a first terminal of a circuit for generating the current; sampling a third voltage between first and second terminals of the load; comparing the third voltage with the second voltage; and determining the current to be supplied to the load according to the result of the comparison.

Abstract: An analog video signal supply circuit includes a processing circuit that supplies first and second digital video signals. First and second digital-to-analog converters convert digital signals to analog signals. A control circuit controls operation in a first configuration where the first digital video signal is applied to an input of the first digital-to-analog converter and the second digital video signal to an input of the second digital-to-analog converter. The control circuit further controls operation in a second configuration where the first digital video signal is simultaneously applied to the inputs of the first and second digital-to-analog converters.

Abstract: A video and/or audio decoder provided with a first terminal for supplying an analog audio and/or video signal, including: a first circuit capable of supplying a digital signal which is an image of said analog signal; a digital-to-analog converter capable of receiving as an input said digital signal; an amplifier coupling a second output terminal of the digital-to-analog converter to the first terminal; and a second circuit capable of comparing a signal representative of the voltage or current level on the first terminal with a reference signal, and of deducing therefrom whether the first terminal is connected or not to an analog input terminal of a video signal display and/or audio signal playing device.

Abstract: A CMOS image sensor including: an array of M×N pixels, the pixels of a same column being connected to a same output track, each pixel including a photodiode, a sense node, a transfer transistor, a reset transistor, and a read circuit; and a test circuit including an assembly of N elementary reference cells respectively connected to the N output tracks of the sensor, each cell including a resistor, a sense node, a transfer transistor, a reset transistor, and a read circuit, the N resistors being series-connected between first and second nodes of application of a reference voltage.

Abstract: A diode control device include a first terminal for receiving a first power supply voltage and a second terminal for receiving a second power supply voltage. A circuit of the diode control device applies a regulated voltage on the anode of the diode in response to a control voltage. The control voltage is equal to a preset voltage when a reference voltage is less than or equal to zero. Conversely, when the reference voltage is greater than zero, the control voltage is equal to the sum of the present voltage and a difference between cathode voltage of the diode and the reference voltage.

Abstract: A diode control device include a first terminal for receiving a first power supply voltage and a second terminal for receiving a second power supply voltage. A circuit of the diode control device applies a regulated voltage on the anode of the diode in response to a control voltage. The control voltage is equal to a preset voltage when a reference voltage is less than or equal to zero. Conversely, when the reference voltage is greater than zero, the control voltage is equal to the sum of the present voltage and a difference between cathode voltage of the diode and the reference voltage.

Abstract: A circuit may include an audio amplifier (314) configured to amplify an input signal (SAUDIO) to generate an output signal (SOUT+, SOUT?) suitable for driving a loud speaker (316). A first circuit (318) may be configured to generate a first analog signal (SI) based on a current level drawn by the loud speaker (316), and a second circuit (320) may be configured to generate a second analog signal (SV) based on a voltage supplied across the loud speaker (316). A third circuit (322, 312) may be configured to generate a third analog signal (RESIDUE) based on the difference between the first and second analog signals, and modify the input signal (SAUDIO) based on the third analog signal.

Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.

Abstract: A signal generation circuit includes a voltage controlled oscillator configured to generate a differential oscillator signal having an amplitude. A passive mixer has first differential inputs coupled to the voltage controlled oscillator to receive the oscillator signal. The passive mixer also includes second differential inputs. A filter circuit is coupled between the voltage controlled oscillator and the second differential inputs of the passive mixer. The filter circuit is configured to filter the differential oscillator signal as a function of the amplitude of the differential oscillator signal to thereby generate a filtered differential oscillator signal and to provide the filtered differential oscillator signal to the second differential inputs of the passive mixer.