Abstract: System, method, and circuitry for generating a linker model for use by a toolchain associated with a programmable computing device. One or more regions in the memory resources available to the programmable computing devices is defined for used by an application executing on the programmable computing device. One or more sections is defined for those regions for use by the application. Resource boundaries are generated for the application based on the defined regions and the defined sections. A user is enabled to modify the defined regions or the defined sections or the generated resource boundaries. A linker model is then generated based on the available memory resources, the defined regions, the defined sections, and the generated resource boundaries. This linker model is then utilized to generate a linker script for the programmable computing device based the linker syntax compatible with a toolchain linker for the programmable computing device.

Abstract: The present description concerns an integrated circuit including, between first and second terminals having a first voltage applied therebetween, a load configured to execute instructions, a circuit for delivering a digital signal having at least two bits from a binary signal and a current output digital-to-analog converter controlled by the digital signal and coupled between the first and second terminals in parallel with the load.

Abstract: An integrated circuit includes at least a first standard cell framed by two second standard cells. The three cells are disposed adjacent to each other, and each standard cell includes at least one NMOS transistor and at least one least one PMOS transistor located in and on a silicon-on-insulator substrate. The at least one PMOS transistor of the first standard cell has a channel including silicon and germanium. The at least one PMOS transistor of each second standard cell has a silicon channel and a threshold voltage different in absolute value from the threshold voltage of said at least one PMOS transistor of the first cell.

Abstract: The method of determination of a depth map of a scene comprises generation of a distance map of the scene obtained by time of flight measurements, acquisition of two images of the scene from two different viewpoints, and stereoscopic processing of the two images taking into account the distance map. The generation of the distance map includes generation of distance histograms acquisition zone by acquisition zone of the scene, and the stereoscopic processing includes, for each region of the depth map corresponding to an acquisition zone, elementary processing taking into account the corresponding histogram.

Abstract: According to one aspect, provision is made of a system-on-chip comprising a master device, a slave device, a clock configured to clock the operation of the slave device, a clock controller configured to activate or deactivate the clock and/or a power-on controller configured to power on/off the slave device, a control system configured to detect that the clock is deactivated and/or that the slave device is powered off when the master device emits an access request to the slave device, the master device being configured for activating the clock when the control system detects that this clock is deactivated and/or powering on the slave device when the control system detects that the slave device is powered off, then emitting a new access request to the slave device.

Abstract: The present description describes an image sensor including an array of pixels arranged inside and on top of a region of a semiconductor substrate electrically insulated from the rest of the substrate by insulating trenches crossing the substrate, each pixel including a photoconversion area and at least two assemblies, each including a memory area and a transfer gate coupling the memory area to the photoconversion area, and a circuit configured to apply, for each pixel and at least during each integration phase, a bias voltage different from ground to a portion of the substrate having the pixel arranged inside and on top of it.

Abstract: An integrated circuit includes at least a first standard cell framed by two second standard cells. The three cells are disposed adjacent to each other, and each standard cell includes at least one NMOS transistor and at least one least one PMOS transistor located in and on a silicon-on-insulator substrate. The at least one PMOS transistor of the first standard cell has a channel including silicon and germanium. The at least one PMOS transistor of each second standard cell has a silicon channel and a threshold voltage different in absolute value from the threshold voltage of said at least one PMOS transistor of the first cell.