Patents Assigned to STMicroelectronics (Grenoble) SAS
  • Patent number: 12218596
    Abstract: In an embodiment a control device includes a first input configured to receive a measurement signal representative of an output voltage of a switching circuit of a voltage regulator, a state determination block coupled to the first input and configured to generate a signal of actual operating condition of the voltage regulator and a driving signals generation module configured to generate at least one switching command signal for the switching circuit from an error signal representative of a difference between the output voltage and a nominal voltage, wherein the driving signals generation module includes an error-compensation circuit having a transfer function and configured to generate a control signal from the error signal and the actual operating condition signal, the control signal being a function of the actual operating condition.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics S.r.l.
    Inventors: Ivan Floriani, Elena Brigo
  • Patent number: 12216020
    Abstract: A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics S.r.l.
    Inventors: Marco Piazza, Antonio Canciamilla, Piero Orlandi, Luca Maggi
  • Patent number: 12216213
    Abstract: In accordance with an embodiment, a system includes a phase-locked loop (PLL) configured to provide a first local oscillator (LO) signal and a voltage-controlled oscillator (VCO) signal; a first quadrature demodulator configured to downconvert global navigation satellite system signals to produce a first intermediate frequency (IF) signal; a first signal processing chain configured to pass the first IF signal; a second signal processing chain comprising a first frequency divider configured to produce a second LO signal based on the first LO signal, and a second quadrature demodulator configured to convert the first IF signal to a second IF signal using the second LO signal; and a third signal processing chain comprising a second frequency divider configured to produce a third LO signal based on the VCO signal, and a third quadrature demodulator configured to convert the first IF signal to a third IF signal using the third LO signal.
    Type: Grant
    Filed: May 4, 2023
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics S.r.l.
    Inventor: Gaetano Rivela
  • Patent number: 12216488
    Abstract: A system including an asynchronous finite state machine that transitions from a first state to a second state in response to receiving a virtual-clock event signal. The system further includes a trigger circuit that asserts a trigger signal when a first-state asynchronous event signal is asserted while the asynchronous finite state machine is in the first state. The system further including a virtual clock-pulse circuit configured to generate the virtual-clock event signal after receiving the trigger signal.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics S.r.l.
    Inventor: Domenico Tripodi
  • Patent number: 12218594
    Abstract: A control circuit and method, wherein an error signal is generated representative of a difference between an output voltage of a switching circuit and a nominal signal; a single control signal is generated, representative of an average error of the error signal; the single control signal is compared with a first periodic reference signal and a second periodic reference signal; a first pulse width modulated signal is generated by a Buck modulator; and a second pulse width modulated signal is generated by a Boost modulator. The maximum value of the first periodic reference signal and the minimum value of the second periodic reference signal are higher and lower, respectively, than the single control signal in a transient control mode between a Buck control mode and a Boost control mode.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics S.r.l.
    Inventors: Manuela La Rosa, Giovanni Sicurella
  • Patent number: 12218163
    Abstract: An image acquisition device includes an array of color filters and an array of microlenses over the array of color filters. At least one layer made from an inorganic dielectric material is formed between the array of color filters and the array of microlenses.
    Type: Grant
    Filed: February 29, 2024
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Mickael Fourel, Laurent-Luc Chapelon
  • Patent number: 12218590
    Abstract: An integrated circuit device includes: a Buck converter; and a control circuit for the Buck converter, which includes: a comparator configured to compare a feedback voltage of the Buck converter with a reference voltage that increases from a first voltage to a second voltage; a pulse-width modulator configured to generate a pulse-width modulated (PWM) signal having a timing-varying pulse width proportional to the reference voltage; an AND gate configured to generate a first control signal by performing a logic AND operation on an output of the comparator and the PWM signal; a pulse generator configured to generate a second control signal by generating a pulse in response to a rising edge in the output of the comparator; and a selection circuit configured to, based on an output voltage of the Buck converter, select the first control signal or the second control signal as a control signal for the Buck converter.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics International N.V.
    Inventor: Antonino Torres
  • Patent number: 12218231
    Abstract: An HEMT transistor includes a semiconductor body having a semiconductive heterostructure. A gate region, of conductive material, is arranged above and in contact with the semiconductor body. A first insulating layer extends over the semiconductor body, laterally to the conductive gate region. A second insulating layer extends over the first insulating layer and the gate region. A first field plate region, of conductive material, extends between the first and the second insulating layers, laterally spaced from the conductive gate region along a first direction. A second field plate region, of conductive material, extends over the second insulating layer, and the second field plate region overlies and is vertically aligned with the first field plate region.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 4, 2025
    Assignee: STMicroelectronics S.r.l.
    Inventors: Ferdinando Iucolano, Alessandro Chini
  • Publication number: 20250040204
    Abstract: Electronic device, comprising: a semiconductor body having a surface, an electrical conductivity P and a first doping value; at least one gate region on the surface; one or more source regions, having a second electrical conductivity N, extending in the semiconductor body at the surface and at a first side of the gate region; and at least one body contact region, of P+ type, extending in the semiconductor body at the surface and at the first side of the gate region 22. The first gate region has the shape of a stripe with main extension along a first direction. The first body contact region has a tapered shape along said first direction. The one or more source regions are adjacent to, and at least partially surround, the first body contact region.
    Type: Application
    Filed: July 16, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventors: Giuseppe Pio PISA, Riccardo DEPETRO
  • Publication number: 20250040244
    Abstract: A semiconductor electronic device is formed in a die having a substrate of semiconductor material of a first conductivity type. The device has a first electronic component based on heterostructure, which has a body structure of semiconductor material that extending, in the die, on the substrate, and an epitaxial multilayer extending in contact with the body structure and having a heterostructure. The body structure of the first electronic component has a first doped region of semiconductor material that extends between the heterostructure and the substrate and has a second conductivity type different from the first conductivity type.
    Type: Application
    Filed: July 17, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventor: Riccardo DEPETRO
  • Publication number: 20250040163
    Abstract: For manufacturing a semiconductor electronic device a wafer is provided which has a substrate layer of semiconductor material having a first portion and a second portion distinct from the first portion. An epitaxial region of a single semiconductor material is grown on the first portion of the substrate layer. An epitaxial multilayer having a heterostructure is grown on the second portion of the substrate layer. A first electronic component based on the single semiconductor material is formed from the epitaxial region and a second electronic component based on heterostructure is formed from the heterostructure. Forming a first electronic component comprises forming a plurality of doped regions in the epitaxial region, after the step of growing an epitaxial multilayer.
    Type: Application
    Filed: July 17, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventor: Riccardo DEPETRO
  • Publication number: 20250040164
    Abstract: A method for manufacturing an ohmic contact for a HEMT device, comprising the steps of: forming a photoresist layer, on a semiconductor body comprising a heterostructure; forming, in the photoresist layer, an opening, through which a surface region of the semiconductor body is exposed at said heterostructure; etching the surface region of the semiconductor body using the photoresist layer as etching mask to form a trench in the heterostructure; depositing one or more metal layers in said trench and on the photoresist layer; and carrying out a process of lift-off of the photoresist layer.
    Type: Application
    Filed: October 9, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics S.r.l.
    Inventors: Ferdinando IUCOLANO, Cristina TRINGALI
  • Publication number: 20250038670
    Abstract: A DC-DC converter includes a primary-side control-circuit having an oscillator driving a transformer in response to assertion of a PWM-signal to transmit power from the primary to the secondary and ceasing in response to deassertion of the PWM-signal, and a receiver demodulator circuit receiving/demodulating a feedback signal sent from the secondary to the primary by comparing an instantaneous value of an envelope indicative of voltages at the primary-coil to an average-value of the envelope to produce a reset-signal. A PWM circuit asserts the PWM-signal in response to a set-signal and deasserts the PWM-signal in response to assertion of the reset-signal. A secondary-side control-circuit rectifies the received power, asserts an intermediate feedback-signal if feedback indicative of the output voltage is greater than a reference-voltage, and connects a capacitance between the secondary and ground in response to assertion of the intermediate feedback-signal to modulate and send the feedback to the primary.
    Type: Application
    Filed: July 25, 2023
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventors: Stefano PERROTTA, Salvatore Giuseppe PRIVITERA, Francesco PULVIRENTI
  • Publication number: 20250036408
    Abstract: A computer system is provided including a memory configured to store a computer program product, a processor configured to execute said computer program product, and a memory circuit. The computer program product includes at least one instruction to duplicate in the memory circuit a return address defined upon function call, and at least one instruction to compare a value of the return address stored in a call stack at the value of the return address duplicated in the memory circuit and to permit a function return branching only if these two values are identical.
    Type: Application
    Filed: March 22, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventor: Frederic RUELLE
  • Publication number: 20250040165
    Abstract: A MOS transistor including a substrate, a conductive having lateral walls, drain and source regions, and spacers having an upper surface such that the spacers are buried in the substrate and are position between the conductive gate and the drain and source regions is provided. The spacers are each cuboid-shaped and have a width that is constant along the spacers height and independent from a height of the conductive gate. A device including the MOS transistor and a method of manufacture for producing a right-hand portion and a left-hand portion of a MOS transistor is also provided.
    Type: Application
    Filed: October 9, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics (Rousset) SAS
    Inventors: Arnaud REGNIER, Dann MORILLON, Franck JULIEN, Marjorie HESSE
  • Publication number: 20250036428
    Abstract: Content is generated for a programmable computing device based on user-selected configuration information. The user-selected configuration information includes a user-selected versatile component. User-selectable versatile component configuration options for the user-selected versatile component are presented and versatile component configuration option selections for the user-selected versatile component are received. Settings for an instance of the user-selected versatile component are generated based on the received component configuration option selections. A configuration store is generated or updated based on the settings for the user-selected versatile component. Content for the programmable computing device is generated based on the configuration store.
    Type: Application
    Filed: July 24, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventors: Frederic RUELLE, Yohann MARTINIAULT, Bechir JABRI, Maher MASTOURI, Laurent MEUNIER, Emmanuel GRANDIN, Maxime DORTEL
  • Publication number: 20250038391
    Abstract: Provided is a coupler including a first assembly of an input unit element, an intermediate unit element, and an output unit element. Each unit element includes a first coil and a second coil arranged in a cross having a general “H” shape. A first input terminal and a second input terminal of the intermediate unit element are coupled to a first output terminal and to a second output terminal of the input unit element, a first output terminal and a second output terminal of the intermediate unit element are coupled to a first input terminal and to a second input terminal of the output unit element, and the input unit element is spatially positioned between the intermediate unit element and the output unit element.
    Type: Application
    Filed: July 26, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventor: Vincent KNOPIK
  • Publication number: 20250039577
    Abstract: A pixel includes a photosensitive circuit, a sense node, a first transistor and a first capacitor. A first electrode of the first capacitor is connected to a control terminal of the first transistor. A second electrode of the first capacitor is to a node of application of a first control signal.
    Type: Application
    Filed: October 11, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventors: Frederic LALANNE, Pierre MALINGE
  • Publication number: 20250040173
    Abstract: An HEMT device, comprising: a semiconductor body including a heterojunction structure; a dielectric layer on the semiconductor body; a gate electrode; a drain electrode, facing a first side of the gate electrode; and a source electrode, facing a second side opposite to the first side of the gate electrode; an auxiliary channel layer, which extends over the heterojunction structure between the gate electrode and the drain electrode, in electrical contact with the drain electrode and at a distance from the gate electrode, and forming an additional conductive path for charge carriers that flow between the source electrode and the drain electrode.
    Type: Application
    Filed: October 10, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics S.r.l.
    Inventors: Ferdinando IUCOLANO, Alessandro Chini
  • Publication number: 20250037998
    Abstract: To manufacture a semiconductor electronic device a wafer is provided that has a substrate layer of semiconductor material having a first portion and a second portion distinct from the first portion. An epitaxial region of a single semiconductor material is grown on the first portion of the substrate layer. An epitaxial multilayer having a heterostructure is grown on the second portion of the substrate layer. A first electronic component based upon the single semiconductor material is formed starting from the epitaxial region and a second electronic component based upon a heterostructure is formed starting from the heterostructure. To grow an epitaxial multilayer, a growth mask is formed on the substrate layer; an opening is made in the growth mask, thereby exposing the second portion of the substrate layer; and the epitaxial multilayer is grown on the second portion of the substrate layer.
    Type: Application
    Filed: July 17, 2024
    Publication date: January 30, 2025
    Applicant: STMicroelectronics International N.V.
    Inventor: Riccardo DEPETRO