Patents Assigned to STMicroelectronics (Malta) Ltd.
-
Publication number: 20150364455Abstract: A stack of chips is formed by a first integrated-circuit chip and a second integrated-circuit chip. The chips have opposing faces which are separated from each other by an interposed spacer. The spacer is fastened by adhesion to only one of the opposing faces. The opposing faces are fastened to each other by a local adhesive which is separate from spacer.Type: ApplicationFiled: May 28, 2015Publication date: December 17, 2015Applicants: STMICROELECTRONICS (GRENOBLE 2) SAS, STMICROELECTRONICS (MALTA) LTD, STMICROELECTRONICS S.R.L.Inventors: Angelo Crobu, Kenneth Fonk, Romain Coffy
-
Publication number: 20150235929Abstract: An electronic device includes an integrated circuit chip mounted to a heat slug. The heat slug has a peripheral region having first thickness along a first direction, the peripheral region surrounding a recess region (having a second, smaller, thickness along the first direction) that defines a chip mounting surface along a second direction perpendicular to the first direction. The recess region defines side borders and a nook extends into the heat slug along the side borders. An insulating body embeds the integrated circuit one chip and heat slug. Material of the insulating body fills the nook.Type: ApplicationFiled: February 6, 2015Publication date: August 20, 2015Applicants: STMICROELECTRONICS (MALTA) LTD, STMICROELECTRONICS S.R.L., STMICROELECTRONICS PTE LTDInventors: Roseanne Duca, Valter Motta, Xueren Zhang, Kim-Yong Goh
-
Publication number: 20140353775Abstract: A wafer-level packaging, comprising: a first semiconductor body integrating a MEMS structure; a second semiconductor body, including a surface electrical-contact region and an ASIC coupled to the MEMS structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second body, and the electrical-contact region; at least one first conductive through via, which extends through the first coating layer in an area corresponding, and electrically coupled, to the first electrical-contact region; an electrical-contact pad, which extends over the first coating layer, electrically coupled to the first conductive through via; a third semiconductor body, integrating an electronic circuit, glued on the first coating layer; a second coating layer, made of resin, which englobes and protects the third body; at least one second conductive through via, which extends completely through the second coating layer in an area corresponding, and electrically couplType: ApplicationFiled: May 27, 2014Publication date: December 4, 2014Applicants: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Kevin Formosa, Luca Maggi
-
Patent number: 8837754Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.Type: GrantFiled: February 22, 2012Date of Patent: September 16, 2014Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Kevin Formosa, Mark Anthony Azzopardi, Mario Francesco Cortese, Mark Shaw, Alex Gritti, Luca Maggi, Filippo David
-
Patent number: 8742562Abstract: An embodiment of a method for manufacturing an electronic device realized on a semiconductor substrate and protected against electro static discharge by the provision of supporting means for the electronic device to keep it far from contacts with possible sources of an ESD event during the manufacturing phases. The supporting means are associated with said electronic device in all the manufacturing stages for instance when assembling the device, when picking and placing it in trays a first time, during the burning-in testing phases, when picking and placing it in trays a second time, or when picking and placing it in a scanner. In an embodiment, the supporting means are protective notches associated with the back side of the semiconductor substrate and provided at each edge corner of the semiconductor substrate.Type: GrantFiled: July 30, 2009Date of Patent: June 3, 2014Assignee: STMicroelectronics (Malta) LtdInventor: Anthony Mario Mifsud
-
Publication number: 20140091443Abstract: A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.Type: ApplicationFiled: September 19, 2013Publication date: April 3, 2014Applicants: STMicroelectronics Pte Ltd, STMicroelectronics (Malta) LtdInventors: Roseanne Duca, Kim-Yong Goh, Xueren Zhang, Kevin Formosa
-
Patent number: 8633583Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.Type: GrantFiled: July 16, 2007Date of Patent: January 21, 2014Assignees: STMicroelectrics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Federico Giovanni Ziglioli, Giovanni Graziosi, Mark Andrew Shaw, Mario Francesco Cortese, Conrad Max Cachia
-
Patent number: 8618676Abstract: A method of assembly of a semiconductor package includes treating the electrical contacts thereof by the application on the electrical contacts of a chemical composition comprising at least one ionic polar surfactant. A semiconductor package has a coating on the electrical contacts thereof, the coating comprising at least one ionic polar surfactant. A device includes a semiconductor package with electrical contacts on a circuit board, the electrical contacts having a coating that includes an ionic surfactant.Type: GrantFiled: October 30, 2008Date of Patent: December 31, 2013Assignee: STMicroelectronics (Malta) Ltd.Inventors: Robert Caruana, Adrian-Michael Borg, Joseph Gauci
-
Patent number: 8546895Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: GrantFiled: October 17, 2011Date of Patent: October 1, 2013Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
-
Publication number: 20120153771Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.Type: ApplicationFiled: February 22, 2012Publication date: June 21, 2012Applicants: STMICROELECTRONICS (MALTA) LTD., STMICROELECTRONICS S.R.L.Inventors: Kevin Formosa, Mark Anthony Azzopardi, Mario Francesco Cortese, Mark Shaw, Alex Gritti, Luca Maggi, Filippo David
-
Publication number: 20120032285Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: ApplicationFiled: October 17, 2011Publication date: February 9, 2012Applicants: STMICROELECTRONICS (MALTA) LTD., STMICROELECTRONICS S.R.L.Inventors: Mario CORTESE, Mark Anthony AZZOPARDI, Edward MYERS, Chantal COMBI, Lorenzo BALDO
-
Patent number: 8043881Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: GrantFiled: December 15, 2010Date of Patent: October 25, 2011Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
-
Publication number: 20110081739Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: ApplicationFiled: December 15, 2010Publication date: April 7, 2011Applicants: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Mario CORTESE, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
-
Patent number: 7875942Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: GrantFiled: January 4, 2008Date of Patent: January 25, 2011Assignees: STMicroelectronics, S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
-
Publication number: 20100109150Abstract: A method of assembly of a semiconductor package includes treating the electrical contacts thereof by the application on the electrical contacts of a chemical composition comprising at least one ionic polar surfactant. A semiconductor package has a coating on the electrical contacts thereof, the coating comprising at least one ionic polar surfactant. A device includes a semiconductor package with electrical contacts on a circuit board, the electrical contacts having a coating that includes an ionic surfactant.Type: ApplicationFiled: October 30, 2008Publication date: May 6, 2010Applicant: STMICROELECTRONICS (MALTA) LTD.Inventors: Robert Caruana, Adrian-Michael Borg, Joseph Gauci
-
Publication number: 20100025838Abstract: An embodiment of a method for manufacturing an electronic device realized on a semiconductor substrate and protected against electro static discharge by the provision of supporting means for the electronic device to keep it far from contacts with possible sources of an ESD event during the manufacturing phases. The supporting means are associated with said electronic device in all the manufacturing stages for instance when assembling the device, when picking and placing it in trays a first time, during the burning-in testing phases, when picking and placing it in trays a second time, or when picking and placing it in a scanner. In an embodiment, the supporting means are protective notches associated with the back side of the semiconductor substrate and provided at each edge corner of the semiconductor substrate.Type: ApplicationFiled: July 30, 2009Publication date: February 4, 2010Applicant: STMICROELECTRONICS (MALTA) LTDInventor: Anthony Mario Mifsud
-
Publication number: 20080179697Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: ApplicationFiled: January 4, 2008Publication date: July 31, 2008Applicants: STMicroelectronics S.r.I., STMicroelectronics (Malta) Ltd.Inventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo