Patents Assigned to STMicroelectronics R&D Ltd.
  • Publication number: 20100180129
    Abstract: An arrangement of arithmetic logic units carries out an operation on at least one operand, wherein the operation is determined by operation codes received by the arithmetic logic units. The operation codes and at least one operand are received on a first clock cycle. The result of the operation is output from at least one arithmetic logic unit to at least one further arithmetic logic unit. A result of the plurality of arithmetic logic units is then output on a next clock cycle.
    Type: Application
    Filed: December 18, 2009
    Publication date: July 15, 2010
    Applicant: STMicroelectronics R&D Ltd.
    Inventor: David Smith
  • Publication number: 20090213783
    Abstract: There is disclosed a method of helping mobile stations such as voice over IP devices to roam between wireless access points, by each access point transmitting the MAC address of a spanning tree algorithm root switch of the local network domain. This MAC address is used by mobile stations to detect if two access points are in a common network domain.
    Type: Application
    Filed: November 14, 2005
    Publication date: August 27, 2009
    Applicant: STMicroelectronics R&D Ltd.
    Inventor: Michael John Vidion Moreton
  • Patent number: 7326968
    Abstract: A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: February 5, 2008
    Assignees: STMicroelectronics S.A., STMicroelectronics R&D Ltd.
    Inventors: Rémi Brechignac, Jean-Luc Diot, Kevin Channon, Eric Chistison
  • Publication number: 20070228558
    Abstract: A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.
    Type: Application
    Filed: March 19, 2007
    Publication date: October 4, 2007
    Applicants: STMicroelectronics S.A., STMicroelectronics R&D Ltd.
    Inventors: Remi Brechignac, Jean-Luc Diot, Kevin Channon, Eric Chistison