Abstract: A semiconductor die is attached on a die-attachment portion of a planar substrate. A planar electrically conductive clip in mounted onto the semiconductor die. The semiconductor die is sandwiched between the die-attachment portion and the electrically conductive clip. A distal portion of the electrically conductive clip extending away from the semiconductor die is spaced from an electrically conductive lead of the planar substrate by a gap. This gap is filled by a mass of gap-filling material transferred to an upper surface of the electrically conductive lead via Laser Induced Forward Transfer (LIFT) processing. A mass of the gap-filling material is sized and dimensioned to substantially fill the gap.

Abstract: An HS switching transistor is coupled between a high-side node and a switching node. An LS switching transistor is coupled between the switching node and a low-side node. An inductive load is coupled to the switching node in a way where one of the HS/LS switching transistors is freewheeling. In response to detection of a short circuit occurring at the switching node with the freewheeling switching transistor in the conductive state: an electrical signal at the switching node is sensed, a comparison is made between the sensed electrical signal and a threshold level, and a driving signal is provided to control freewheeling switching transistor to switch to the non-conductive state when the comparison indicates that the electrical signal has reached the threshold level.

Abstract: A MEMS optical device having an optically active portion and an actuation portion adjacent to each other. The MEMS optical device includes a body, a piezoelectric actuator, and a cap. The body is formed by a substrate, housing a cavity containing a fluid and by a deformable region fixed to the substrate, suspended over the cavity and forming a membrane. The piezoelectric actuator extends on the deformable region at the actuation portion and is protected by the cap, which is coupled to the body at the actuation portion and defines a chamber that houses the piezoelectric actuator.

Abstract: An electronic amplification-interface circuit includes a differential-current reading circuit having a first input terminal and a second input terminal. The differential-current reading circuit includes a continuous-time sigma-delta conversion circuit formed by an integrator-and-adder module generating an output signal that is coupled to an input of a multilevel-quantizer circuit configured to output a multilevel quantized signal. The integrator-and-adder module includes a differential current-integrator circuit configured to output a voltage proportional to an integral of a difference between currents received at the first and second input terminals. A digital-to-analog converter, driven by a respective reference current, receives and converts the multilevel quantized signal into a differential analog feedback signal. The integrator-and-adder module adds the differential analog feedback signal to the differential signal formed at the first and second input terminals.

Abstract: In an embodiment a timing system includes a master timing device including a master oscillator stage configured to receive a reference signal and to generate a first main clock signal frequency-locked with the reference signal, a master timing stage including a master counter configured to update value with a timing that depends on the first main clock signal, the master timing stage configured to generate a first local clock signal of a pulsed type, a timing of pulses of the first local clock signal being controllable by the master counter and a master synchronization stage configured to generate a synchronization signal synchronous with the first local clock signal, wherein the synchronization signal includes a corresponding pulse for each group of consecutive pulses of the first local clock signal formed by a number (N) of pulses, and a slave timing device including a slave oscillator stage configured to receive the reference signal and to generate a second main clock signal frequency-locked with the refer

Abstract: System for detecting a touch gesture of a user on a detection surface, comprising: a processing unit; and an accelerometer to detect a vibration at the detection surface and generate a vibration signal. The processing unit is configured to: acquire the vibration signal, detect, in the vibration signal, a signal characteristic which can be correlated to the touch gesture of the user, detect, in the vibration signal, a stationarity condition preceding and/or following the detected signal characteristic, and validate the touch gesture in the event that both the signal characteristic and the stationarity condition have been detected. An electrostatic charge sensor may also be used as a further parameter to validate the touch gesture.

Abstract: A synchronous rectifier driver circuit is configured to drive a synchronous rectifier FET and includes a first terminal configured to be connected to a source terminal of the synchronous rectifier FET. A second terminal is configured to be connected to a drain terminal of the synchronous rectifier FET, and a third terminal is configured to be connected to a gate terminal of the synchronous rectifier FET. The synchronous rectifier driver circuit is configured to measure the voltage between the second terminal and the first terminal, and detect a switch-on instant in which the measured voltage reaches a first threshold value and a switch-off instant in which the measured voltage reaches a second threshold value. The synchronous rectifier driver circuit generates a drive signal between the third terminal and the first terminal as a function of the measured voltage.

Abstract: The disclosure relates to a scan chain circuit comprising cascaded flip-flops having a functional input node and a test input node configured to be selectively coupled to logic circuitry at a clock edge time. A clock line is provided configured to distribute one or more clock signals to the flip-flops in the chain, wherein the flip-flops in the chain have active clock edges applied thereto at respective clock edge times. The chain of flip-flops comprise a set of flip-flops configured to receive an edge inversion signal and to selectively invert their active clock edges in response to the edge inversion signal being asserted.

Abstract: The present disclosure is directed to a device configured to detect whether the device is in a bag or being taken out of the bag. The device determines whether the device is in a bag or being taken out of the bag based on motion measurements generated by a motion sensor and electrostatic charge measurements generated by an electrostatic charge sensor. By using both distance measurements and motion measurements, the device is able to detect whether the device is in the bag or being taken out of the bag with high efficiency, accuracy, and robustness.

Abstract: A microelectromechanical device includes a support structure, a microelectromechanical system die, incorporating a microstructure and a connection structure between the microelectromechanical system die and the support structure. The connection structure includes a spacer structure, joined to the support structure, and a film applied to one face of the spacer structure opposite to the support structure. The spacer structure laterally delimits at least in part a cavity and the film extends on the cavity, at a distance from the support structure. The microelectromechanical system die is joined to the film on the cavity.

Abstract: A microelectromechanical gyroscope includes: the support structure; a sensing mass, coupled to the support structure with degrees of freedom along a driving direction and a sensing direction perpendicular to each other; and a calibration structure facing the sensing mass and separated from the sensing mass by a gap having an average width, the calibration structure being movable with respect to the sensing mass so that displacements of the calibration structure cause variations in the average width of the gap. A calibration actuator controls a relative position of the calibration structure with respect to the sensing mass and the average width of the gap.

Abstract: A semiconductor integrated circuit chip is arranged on a first surface of a substrate that includes electrically conductive lead formations in an array, wherein the electrically conductive lead formations are covered by a masking layer at a second surface opposite the first surface. The semiconductor integrated circuit chip is electrically coupled to electrically conductive lead formations and an insulating encapsulation is molded on the semiconductor integrated circuit chip. The masking layer is then selectively removed, for example, via laser ablation, from one or more of the electrically conductive lead formations. The electrically conductive lead formations that are left uncovered by the masking layer are then removed by an etching process applied to the second surface of the substrate. The selective removal of the unmasked electrically conductive lead formations serves to increase a creepage distance between those conductive lead formations that are left in place.

Abstract: A semiconductor chip or die is arranged on a first surface of a thermally conductive die pad of a substrate such as a leadframe. An encapsulation of insulating material in molded onto the die pad having the semiconductor die arranged on the first surface. At the second surface of the die pad, opposite the first surface, the encapsulation borders on the die pad at a borderline around the die pad. A recessed portion of the encapsulation is provided, for example, via laser ablation, at the borderline around the die pad. Thermally conductive material such as metal material is filled in the recessed portion of the encapsulation around the die pad. The surface area of the thermally conductive die pad is augmented by the filling of thermally conductive material in the recessed portion of the encapsulation thus improving thermal performance of the device.

Abstract: A semiconductor die is attached on a die mounting surface of a substrate. An insulating encapsulation of laser direct structuring (LDS) material is molded onto the substrate and the semiconductor die. The insulating encapsulation of LDS material has a front surface including a first portion and a second portion separated by gaps therebetween. Laser direct structuring processing is applied to the first portion of the front surface to structure in the encapsulation of LDS material electrically conductive formations including electrically conductive lines over the front surface and to the second portion of the front surface of the encapsulation of LDS material to form thereon a reinforcing warp-countering structure. The separation gaps are left exempt from laser direct structuring processing and the reinforcing warp-countering structure is electrically insulated from the electrically conductive lines by LDS material left exempt from laser direct structuring processing at the separation gaps.

Abstract: A device including microelectromechanical systems (MEMS) sensors are used in dead reckoning in conditions where Global Positioning System (GPS) signals or Global Navigation Satellite System (GNSS) signals are lost. The device is capable of tracking the location of the device after the GPS/GNSS signals are lost by using MEMS sensors such as accelerometers and gyroscopes. By calculating a misalignment angle between a forward axis of a sensor frame of the device and a forward axis of a vehicle frame using the data received from the MEMS sensors, the device can accurately calculate the location of a user or the vehicle of the device even without the GPS/GNSS signals. Accordingly, a device capable of tracking the location of the user riding in the vehicle in GPS/GNSS signals absent environment can be provided.

Abstract: A button device includes a fixed support structure; a movable structure, laterally surrounded by the support structure and configured to deform at least in part under the action of an external force; and a fluid-tight protection cap. The movable structure includes a piston element, deformable elements having piezoelectric transducers arranged thereon, and anchor elements that couple the piston element to the deformable elements. When an external force acts on the piston element, the anchor elements transfer this force to the deformable elements and to the piezoelectric transducers, so as to sense the extent of this force.

Abstract: A sensor circuit for a power FET monitors current flowing through the FET and includes a regulator circuit regulating a first current flowing through a sense resistance, so voltage drop at the sense resistance corresponds to voltage drop between terminals of the FET. A measurement circuit provides a second current corresponding (or being proportional) to the first current. A first switch selectively applies the second current to a resistor based on a first control signal, and a low pass filter generates a low-pass filtered signal by filtering voltage at the resistor. A voltage follower generates a replica of the low-pass filtered signal, and a second switch selectively applies the replica to the resistor. When the FET is closed, a control circuit closes the first switch and opens the second electronic switch. When the FET is opened, the control circuit opens the first electronic switch and closes the second electronic switch.

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

Abstract: A device includes signal processing circuits, a RAM, and RAM management circuitry. The signal processing circuits produce output data signals as a function of current and past values of sensor data signals. The RAM is organized into a set of RAM sections storing sensor data signal values. The RAM management circuitry has a buffer accessible by the plurality of signal processing circuits, and manages storage and retrieval of data in the RAM sections independently of one another by executing sets of memory operations. A set of memory operations includes a read operation, during which past values of sensor data signals are read from a section of the RAM and stored in the buffer, and a write operation, during which current values of sensor data signals are written into the section of the RAM read during the read operation.

Abstract: The MEMS gyroscope has a mobile mass carried by a supporting structure to move in a driving direction and in a first sensing direction, perpendicular to each other. A driving structure governs movement of the mobile mass in the driving direction at a driving frequency. A movement sensing structure is coupled to the mobile mass and detects the movement of the mobile mass in the sensing direction. A quadrature-injection structure is coupled to the mobile mass and causes a first and a second movement of the mobile mass in the sensing direction in a first calibration half-period and, respectively, a second calibration half-period. The movement-sensing structure supplies a sensing signal having an amplitude switching between a first and a second value that depend upon the movement of the mobile mass as a result of an external angular velocity and of the first and second quadrature movements.