Abstract: The MEMS gyroscope is formed by a substrate, a first mass and a second mass, wherein the first and the second masses are suspended over the substrate and extend, at rest, in a plane of extension defining a first direction and a second direction transverse to the first direction. The MEMS gyroscope further has a drive structure coupled to the first mass and configured, in use, to cause a movement of the first mass in the first direction, and an elastic coupling structure, which extends between the first mass and the second mass and is configured to couple the movement of the first mass in the first direction with a movement of the second mass in the second direction. The elastic coupling structure has a first portion having a first stiffness and a second portion having a second stiffness greater than the first stiffness.

Abstract: The present disclosure is directed to self-tests for electrostatic charge variation sensors. The self-tests ensure an electrostatic charge variation sensor is functioning properly. The self-tests may be performed while an electrostatic charge variation sensor is active and without interruption to the application employing the electrostatic charge variation sensor.

Abstract: A closed-loop microelectromechanical accelerometer includes a substrate of semiconductor material, an out-of-plane sensing mass and feedback electrodes. The out-of-plane sensing mass, of semiconductor material, has a first side facing the supporting body and a second side opposite to the first side. The out-of-plane sensing mass is also connected to the supporting body to oscillate around a non-barycentric fulcrum axis parallel to the first side and to the second side and perpendicular to an out-of-plane sensing axis. The feedback electrodes are capacitively coupled to the sensing mass and are configured to apply opposite electrostatic forces to the sensing mass.

Abstract: In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.

Abstract: A boost DC-DC converter includes a switching network, coupled to an inductor, controlled by a PWM driving signal. A control loop receives a voltage output and provides the PWM driving signal. The control loop generates an error signal as a function of a difference between voltage output voltage and a reference, with the PWM driving signal generated based on the error signal. A low pass filter circuit within the control loop receives the PWM driving signal and provides at least one filtered signal. An adder node of the control loop receives the at least one filtered signal from the low pass filter circuit for addition to the at least one filtered signal. The PWM driving signal is generated as a function of a sum of the filtered signal and the error signal.

Abstract: A MEMS device is provided that includes a semiconductor substrate including a main surface extending perpendicular to a first direction and a side surface extending on a plane parallel to the first direction and to a second direction that is perpendicular to the first direction. At least one cantilevered member protrudes from the side surface of the semiconductor substrate along a third direction that is perpendicular to the first and second directions. The at least one cantilevered member includes a body portion that includes a piezoelectric material. The body portion has a length along the third direction, a height along the first direction and a width along the second direction, and the height is greater than the width. The at least one cantilevered member is configured to vibrate by lateral bending along a direction perpendicular to the first direction.

Abstract: Process for manufacturing a MEMS device, including: forming a dielectric region which coats part of a semiconductive substrate of a first semiconductive wafer; forming a region which is permeable to gases and coats the dielectric region; coupling the first semiconductive wafer to a second semiconductive wafer so as to form a first chamber, which houses a first movable mass and has a pressure equal to a first value, and a second chamber, which houses a second movable mass and has a pressure equal to the first value, the permeable region facing the second chamber; selectively removing a portion of the semiconductor substrate and an underlying portion of the dielectric region, so as to expose a part of the permeable region, so as to allow gas exchanges through the permeable region; placing the first and the second semiconductive wafers in an environment with a pressure equal to a second value, so that the pressure in the second chamber becomes equal to the second value; and subsequently forming, on the exposed p

Abstract: In at least one embodiment, a Geiger-mode avalanche photodiode, including a semiconductor body, is provided. The semiconductor body includes a semiconductive structure and a front epitaxial layer on the semiconductive structure. The front epitaxial layer has a first conductivity type. An anode region having a second conductivity type that is different from the first conductivity type extends into the front epitaxial layer. The photodiode further includes a plurality of gettering regions in the semiconductive structure.

Abstract: A method of processing a data stream includes taking a first number of samples of the data stream using a sampling clock over a first observation window and storing a stored data stream including the first number of samples in a data buffer. A length of the first observation window is determined by a reference clock. A measured number of cycles of the sampling clock are determined from the first number of samples. An error between an expected number of cycles of the sampling clock and the measured number of cycles of the sampling clock in the observation window is measured. The stored data stream corresponding to the first observation window is updated to contain a second number of samples by correcting the first number of samples with the error.

Abstract: A PLL has a tunable resonator including an inductance and variable capacitance coupled between first and second nodes, and capacitances coupleable between the nodes. A control node is coupled to the variable capacitance and receives a control signal for tuning the resonator. A biasing circuit biases the resonator to generate an output. A PFD circuit senses timing offset of the output with respect to a reference and asserts first or second digital signals dependent on the sign of the timing offset. A charge pump generates the control signal based on the first and second digital signals. A timer asserts a timing signal in response to a pulse sensed in a reset signal and de-asserts the timing signal after a time interval. A calibrator couples selected capacitances between the first and second nodes as a function of the second digital signal, in response to assertion of the timing signal.

Abstract: A classification device receives sensor data from a set of sensors and generates, using a context classifier having a set of classifier model parameters, a set of raw predictions based on the received sensor data. Temporal filtering and heuristic filtering are applied to the raw predictions, producing filtered predictions. A prediction error is generated from the filtered predictions, and model parameters of the set of classifier model parameters are updated based on said prediction error. The classification device may be a wearable device.

Abstract: In response to a request to store new data at a memory location of a bitwise programmable non-volatile memory, data stored at the memory location of the bitwise programmable memory is sensed. The bits of the sensed data are compared with bits of the new data. An indication of a cost difference is determined between a first burst of bitwise programming operations associated with programming bits of the new data which are different from bits of the sensed data, and a second burst of bitwise programming operations associated with programming bits of a complementary inversion of the new data which are different from bits of the sensed data. One of the first burst of bitwise programming operations or the second burst of bitwise programming operations is executed based on the generated indication of the cost difference.

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

Abstract: A back end of line (BEOL) structure for an integrated circuit chip includes a last metal structure providing a bonding pad. A passivation structure over the bonding pad includes a first opening extending exposing an upper surface of the bonding pad. A conformal nitride layer extends over the passivation structure and is placed in contact with the upper surface of the bonding pad. An insulator material layer covers the conformal nitride layer and includes a second opening that extends through both the insulator material layer and the conformal nitride layer. A foot portion of the conformal nitride layer on the upper surface of the bonding pad is self-aligned with the second opening.

Abstract: In a DC-DC converter, a duty-cycle control signal is generated in response to comparing the switching stage output voltage and a reference voltage signal. A first circuit compares the duty-cycle control signal and a ramp to produce a PWM signal. A second circuit compares the duty-cycle control signal and a skip threshold to produce a skip control signal which halts switching operation of the switching stage. A count is made of number of periods of the skip control signal during a monitoring time window and the number of periods of a clock signal during a period of the skip control signal is counted. When the counted number of skip control signal periods is within a first range and the counted number of clock signal periods is within a second range, a common detection signal is asserted to trigger varying a value of the skip threshold signal.

Abstract: Disclosed herein is a microelectromechanical device that features a fixed structure defining a cavity, a tiltable structure elastically suspended within the cavity, and a piezoelectrically driven actuation structure that rotates the tiltable structure about a first rotation axis. The actuation structure includes driving arms with piezoelectric material, elastically coupled to the tiltable structure by decoupling elastic elements that are stiff to out-of-plane movements but compliant to torsional movements. The tiltable structure is elastically coupled to the fixed structure at the first rotation axis using elastic suspension elements, while the fixed structure forms a frame surrounding the cavity with supporting elements. A lever mechanism is coupled between a supporting element and a driving arm.

Abstract: A method to operate a DC-DC power converter in a low power burst mode, the method including sampling an output voltage of the DC-DC power converter with a sampling frequency to determine when to initiate a burst for the low power burst mode; and adapting the sampling frequency based on the output voltage.

Abstract: A time series of face images of a human during a human activity are captured. A first artificial neural network (ANN) processing pipeline processes the captured time series of face images to provide a first attention level indicator signal. An electrophysiological signal indicative of the level of attention of the human during the activity is also captured. A second ANN processing pipeline processes the sensed electrophysiological signal to providing a second attention level indicator signal. A risk indicator signal is then generated based on at least one of the first attention level indicator and second attention level indicator. A user circuit is then triggered as a result of the risk indicator reaching or failing to reach at least one attention level threshold.

Abstract: An integrated circuit includes sensing circuitry and processing circuitry. The processing circuitry processes received sensor-session requests and received sensor-service requests. Processing a received sensor-service request includes determining a type of the received sensor-service request. In response to determining the received sensor-service request is of a first type, results information is generated in response to the received sensor-service request of the first type based on sensor data generated by the sensing circuitry. In response to determining the received sensor-service request is of a second type, remote-server processing based on the received sensor-service request of the second type is initiated, and a response to the received sensor-service request of the second type is generated based on a received response to the initiated remote-server processing.

Abstract: In an embodiment the method a includes performing, by an integrated circuit (IC) card hosted in a local equipment, authentication with a contactless subscriber device when the subscriber device is within a communication range of a contactless interface of the local equipment, receiving, by the IC card, an identifier (SID) identifying a software module from the subscriber device, the software module configured to enable a subscription profile for a mobile network operator, performing a checking operation at the IC card whether the SID matches a software module identifier stored in the IC card and selectively performing one of downloading the software module to the IC card, enabling the software module at the IC card or disabling the software module at the IC card as a result of performing the checking operation.