Patents Assigned to STMicroelectronics S.r.l.
  • Patent number: 11843369
    Abstract: An integrated device includes at least one MOS transistor having a plurality of cells. In each of one or more of the cells a disabling structure is provided. The disabling structure is configured to be in a non-conductive condition when the MOS transistor is switched on in response to a control voltage comprised between a threshold voltage of the MOS transistor and an intervention voltage of the disabling structure, or to be in a conductive condition otherwise. A system comprising at least one integrated device as above is also proposed. Moreover, a corresponding process for manufacturing this integrated device is proposed.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: December 12, 2023
    Assignee: STMicroelectronics S.r.l.
    Inventor: Davide Giuseppe Patti
  • Patent number: 11841229
    Abstract: A driving circuit for a microelectromechanical system (MEMS) gyroscope operating based on the Coriolis effect is provided. The driving circuit supplies drive signals to a mobile mass of the MEMS gyroscope to cause a driving movement of the mobile mass to oscillate at an oscillation frequency. The driving circuit includes an input stage, which receives at least one electrical quantity representing the driving movement and generates a drive signal based on the electrical quantity; a measurement stage, which measures an oscillation amplitude of the driving movement based on the drive signal; and a control stage, which generates the drive signals based on a feedback control of the oscillation amplitude. The measurement stage performs a measurement of a time interval during which the drive signal has a given relationship with an amplitude threshold, and measures the oscillation amplitude as a function of the time interval.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: December 12, 2023
    Assignee: STMicroelectronics S.r.l.
    Inventor: Stefano Facchinetti
  • Patent number: 11841497
    Abstract: Disclosed herein is a control system for a projection system, including a first subtractor receiving an input drive signal and a feedback signal and generating a first difference signal therefrom, the feedback signal being indicative of position of a quasi static micromirror of the projection system. A type-2 compensator receives the first difference signal and generates therefrom a first output signal. A derivative based controller receives the feedback signal and generates therefrom a second output signal. A second subtractor receives the first and second output signals and generates a second difference signal therefrom. The second difference signal serves to control a mirror driver of the projection system. A higher order resonance equalization circuit receives a pre-output signal from an analog front end of the projection system that is indicative of position of the quasi static micromirror, and generates the feedback signal therefrom.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: December 12, 2023
    Assignees: Politecnico Di Milano, STMicroelectronics S.r.l.
    Inventors: Paolo Frigerio, Giacomo Langfelder, Luca Molinari, Giuseppe Maiocchi, Andrea Barbieri
  • Patent number: 11842954
    Abstract: A plastic material substrate has a die mounting location for a semiconductor die. Metallic traces are formed on selected areas of the plastic material substrate, wherein the metallic traces provide electrically-conductive paths for coupling to the semiconductor die. The semiconductor die is attached onto the die mounting location. The semiconductor die attached onto the die mounting location is electrically bonded to selected ones of the metallic traces formed on the plastic material substrate. A package material is molded onto the semiconductor die attached onto the die mounting location.
    Type: Grant
    Filed: August 15, 2022
    Date of Patent: December 12, 2023
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Alberto Pintus, Pierangelo Magni
  • Patent number: 11842948
    Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: December 12, 2023
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Cristina Somma, Fulvio Vittorio Fontana
  • Publication number: 20230396407
    Abstract: A sensor includes detection circuitry and control circuitry coupled to the detection circuitry. The detection circuitry generates a detection signal indicative of a detected physical quantity. The control circuitry, in operation receives the detection signal and a frequency-indication signal, and generates a trigger signal based on the frequency-indication signal and a set of local reference signals. The sensor generates a digital output signal and a locking signal based on the trigger signal and the detection signal. The generating the digital output signal includes outputting a sample of the digital output signal based on the trigger signal. The locking signal is temporally aligned with the digital output signal.
    Type: Application
    Filed: August 21, 2023
    Publication date: December 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Matteo QUARTIROLI, Paolo ROSINGANA
  • Publication number: 20230393198
    Abstract: A first circuit is coupled to a second circuit via a communication link. The first circuit generates a first validation signal, a second validation signal, and control signals, and transmits the first and second validation signals to the second circuit via the communication link. The second circuit validates the control signals based on the first and second binary validation signals. The validating includes: verifying that when the first validation signal has a first value, the second validation signal has a second value different from the first value; verifying that when the second validation signal has the first value, the first validation signal has the second value; verifying detection of a transition edge of the first validation signal within a threshold number of clock cycles; and verifying detection of a transition edge of the second validation signal within the threshold number of clock cycles.
    Type: Application
    Filed: May 26, 2023
    Publication date: December 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Diego ALAGNA, Alessandro CANNONE
  • Patent number: 11834054
    Abstract: A system includes inertial sensors and a GPS. The system generates a first estimated vehicle velocity based on motion data and positioning data, generates a second estimated vehicle velocity based on the processed motion data and the first estimated vehicle velocity, and generates fused datasets indicative of position, velocity and attitude of a vehicle based on the processed motion data, the positioning data and the second estimated vehicle velocity. The generating the second estimated vehicle velocity includes: filtering the motion data, transforming the filtered motion data in a frequency domain based on the first estimated vehicle velocity, generating spectral power density signals, generating an estimated wheel angular frequency and an estimated wheel size based on the spectral power density signals, and generating the second estimated vehicle velocity as a function of the estimated wheel angular frequency and the estimated wheel size.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: December 5, 2023
    Assignees: STMICROELECTRONICS S.r.l., STMICROELECTRONICS, INC., STMicroelectronics (Grand Ouest) SAS
    Inventors: Nicola Matteo Palella, Leonardo Colombo, Andrea Donadel, Roberto Mura, Mahaveer Jain, Joƫlle Philippe
  • Patent number: 11836346
    Abstract: A memory array arranged as a plurality of memory cells. The memory cells are configured to operate at a determined voltage. A memory management circuitry coupled to the plurality of memory cells tags a first set of the plurality of memory cells as low-voltage cells and tags a second set of the plurality of memory cells as high-voltage cells. A power source provides a low voltage to the first set of memory cells and provides a high voltage to the second set of memory cells based on the tags.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: December 5, 2023
    Assignees: STMICROELECTRONICS S.r.l., STMicroelectronics International N.V.
    Inventors: Nitin Chawla, Giuseppe Desoli, Anuj Grover, Thomas Boesch, Surinder Pal Singh, Manuj Ayodhyawasi
  • Patent number: 11837558
    Abstract: A process for manufacturing a strained semiconductor device envisages: providing a die of semiconductor material, in which elementary components of the semiconductor device have been integrated by means of initial front-end steps; and coupling, using the die-attach technique, the die to a support, at a coupling temperature. The aforesaid coupling step envisages selecting the value of the coupling temperature at a value higher than an operating temperature of use of the semiconductor device, and moreover selecting the material of the support so that it is different from the material of the die in order to determine, at the operating temperature, a coupling stress that is a function of the different values of the coefficients of thermal expansion of the materials of the die and of the support and of the temperature difference between the coupling temperature and the operating temperature.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: December 5, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Santo Alessandro Smerzi, Michele Calabretta, Alessandro Sitta, Crocifisso Marco Antonio Renna, Giuseppe D'Arrigo
  • Patent number: 11835541
    Abstract: A MEMS accelerometric sensor includes a bearing structure and a suspended region that is made of semiconductor material, mobile with respect to the bearing structure. At least one modulation electrode is fixed to the bearing structure and is biased with an electrical modulation signal including at least one periodic component having a first frequency. At least one variable capacitor is formed by the suspended region and by the modulation electrode in such a way that the suspended region is subjected to an electrostatic force that depends upon the electrical modulation signal. A sensing assembly generates, when the accelerometric sensor is subjected to an acceleration, an electrical sensing signal indicating the position of the suspended region with respect to the bearing structure and includes a frequency-modulated component that is a function of the acceleration and of the first frequency.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: December 5, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Alessandro Tocchio, Gabriele Gattere
  • Patent number: 11837953
    Abstract: First and second circuit branches are coupled between an input node and ground. Each circuit branch includes a series coupling first-fourth transistors in a current flow path with an output node. A first capacitor is coupled between a first capacitor node and a second capacitor node intermediate the first transistor and the second transistor in the first circuit branch. A second capacitor is coupled between a third capacitor node and a fourth capacitor node intermediate the first transistor and the second transistor in the second circuit branch. An inter-branch circuit block between the first and second branches includes a first inter-branch transistor coupled between the first capacitor node in the first circuit branch and the fourth capacitor node in the second circuit branch and a second inter-branch transistor coupled between the third capacitor node in the second circuit branch and the second capacitor node in the first circuit branch.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: December 5, 2023
    Assignee: STMicroelectronics S.r.l.
    Inventors: Alessandro Dago, Alessandro Gasparini, Osvaldo Enrico Zambetti, Salvatore Levantino, Massimo Antonio Ghioni
  • Patent number: 11836608
    Abstract: Techniques and systems are provided for implementing a convolutional neural network. One or more convolution accelerators are provided that each include a feature line buffer memory, a kernel buffer memory, and a plurality of multiply-accumulate (MAC) circuits arranged to multiply and accumulate data. In a first operational mode the convolutional accelerator stores feature data in the feature line buffer memory and stores kernel data in the kernel data buffer memory. In a second mode of operation, the convolutional accelerator stores kernel decompression tables in the feature line buffer memory.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: December 5, 2023
    Assignees: STMICROELECTRONICS S.r.l., STMicroelectronics International N.V.
    Inventors: Thomas Boesch, Giuseppe Desoli, Surinder Pal Singh, Carmine Cappetta
  • Patent number: 11839159
    Abstract: A transducer includes a supporting body and a suspended structure mechanically coupled to the supporting body. The suspended structure has a first and a second surface opposite to one another along an axis, and is configured to oscillate in an oscillation direction having at least one component parallel to the axis. A first piezoelectric transducer is disposed on the first surface of the suspended structure, and a second piezoelectric transducer is disposed on the second surface of the suspended structure.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: December 5, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Luca Seghizzi, Federico Vercesi, Claudia Pedrini
  • Publication number: 20230389426
    Abstract: MEMS thermoelectric generator comprising: a thermoelectric cell including one or more thermoelectric elements partially extending on a cavity of the thermoelectric cell; a thermoplastic layer extending on the thermoelectric cell and having a top surface and a bottom surface opposite to each other along a first axis, the bottom surface facing the thermoelectric cell and the thermoplastic layer being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink configured to exchange heat with the thermoelectric cell interposed, along the first axis, between the heat sink and the thermoplastic layer; and a thermal via of metal material, extending through the thermoplastic layer from the top surface to the bottom surface so that it is superimposed, along the first axis, on the cavity, wherein the thermoelectric cell may exchange heat with a thermal source through the thermal via.
    Type: Application
    Filed: May 16, 2023
    Publication date: November 30, 2023
    Applicant: STMicroelectronics S.r.l.
    Inventors: Paolo FERRARI, Flavio Francesco VILLA, Marco DEL SARTO
  • Publication number: 20230384343
    Abstract: The present disclosure is directed to a device and method for lid angle detection that is accurate even if the device is activated in an upright position. While the device is in a sleep state, first and second sensor units measure acceleration and angular velocity, and calculate orientations of respective lid components based on the acceleration and angular velocity measurements. Upon the device exiting the sleep state, a processor estimates the lid angle using the calculated orientations, sets the estimated lid angle as an initial lid angle, and updates the initial lid angle using, for example, two accelerometers; two accelerometers and two gyroscopes; two accelerometers and two magnetometers; or two accelerometers, two gyroscopes, and two magnetometers.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Federico RIZZARDINI, Lorenzo BRACCO
  • Publication number: 20230386980
    Abstract: A semiconductor die is attached on a die-attachment portion of a substrate such as a leadframe. The semiconductor die has a front surface opposite the substrate and one or more contact pads at the front surface having an outer surface finishing of a first electrically conductive material such as NiPd or Al. An encapsulation of laser direct structuring, LDS material is molded onto the semiconductor die attached on the substrate. Laser beam energy is applied to selected locations of the front surface of the encapsulation of LDS material to activate the LDS material at the selected locations and structure therein electrically conductive formations comprising one or more vias towards the contact pad. The vias comprise a second electrically conductive material that is different from the first electrically conductive material of the outer surface finishing of the contact pad.
    Type: Application
    Filed: May 26, 2023
    Publication date: November 30, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Michele DERAI, Guendalina CATALANO
  • Publication number: 20230389450
    Abstract: Phase-change memory cells and methods of manufacturing and operating phase-change memory cells are provided. In at least one embodiment, a phase-change memory cell includes a heater and a stack. The stack includes at least one germanium layer or a nitrogen doped germanium layer, and at least one layer of a first alloy including germanium, antimony, and tellurium. A resistive layer is located between the heater and the stack.
    Type: Application
    Filed: April 21, 2023
    Publication date: November 30, 2023
    Applicants: STMICROELECTRONICS S.r.l., COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Paolo Giuseppe CAPPELLETTI, Gabriele NAVARRO
  • Publication number: 20230384837
    Abstract: The present disclosure is directed to a device and method for lid angle detection that is accurate even if the device is activated in an upright position. While the device is in a sleep state, first and second sensor units measure acceleration and angular velocity, and calculate orientations of respective lid components based on the acceleration and angular velocity measurements. Upon the device exiting the sleep state, a processor estimates the lid angle using the calculated orientations, sets the estimated lid angle as an initial lid angle, and updates the initial lid angle using, for example, two accelerometers; two accelerometers and two gyroscopes; two accelerometers and two magnetometers; or two accelerometers, two gyroscopes, and two magnetometers.
    Type: Application
    Filed: March 14, 2023
    Publication date: November 30, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Federico RIZZARDINI, Lorenzo BRACCO
  • Publication number: 20230381816
    Abstract: Micromachined pressure transducer including: a fixed body of semiconductor material, which laterally delimits a main cavity; a transduction structure, which is suspended on the main cavity and includes at least a pair of deformable structures and a movable region, which is formed by semiconductor material and is mechanically coupled to the fixed body through the deformable structures. Each deformable structure includes: a support structure of semiconductor material, which includes a first and a second beam, each of which has ends fixed respectively to the fixed body and to the movable region, the first beam being superimposed, at a distance, on the second beam; and at least one piezoelectric transduction structure, mechanically coupled to the first beam. The piezoelectric transduction structures are electrically controllable so that they cause corresponding deformations of the respective support structures and a consequent translation of the movable region along a translation direction.
    Type: Application
    Filed: May 19, 2023
    Publication date: November 30, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Domenico GIUSTI, Fabio QUAGLIA, Marco FERRERA