Abstract: Disclosed herein is hardware for easing the process of changing the execution mode of a virtual machine and its associated resources. By adopting the hardware, it is possible to trigger a change in the execution mode in an automatic way, without software intervention, and without interfering with the execution of other virtual machines. In addition, in case an error has occurred for a virtual machine and it is detected, the hardware can be used to disable the resources associated with that virtual machine and generate notification of the completion this operation to other hardware, which will complete the reset of the virtual machine. By adopting the hardware, the execution mode change is simplified and offers configurability and flexibility for a system running multiple virtual machines.

Abstract: A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.

Abstract: A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

Abstract: A wireless unit includes a first motion sensitive device; communications circuitry for wirelessly communicating with a further wireless unit; and a processing device configured to compare at least one first motion vector received from the first motion sensitive device with at least one second motion vector received from a second motion sensitive device of the further wireless unit.

Abstract: An embodiment of a simulation tool includes a path determiner and a simulator. The path determiner is configured to identify a first communication path between first and second devices of a system, and the simulator is configured to simulate a routing of a first item from one of the first and second devices to the other of the first and second devices via the identified path. The path determiner may also be configured to identify the communication path before the simulator simulates the routing of the item, or to identify the communication path while the simulator is inactive.

Abstract: An integrated with a block including first and second oppositely doped semiconductor wells. There are standard cells placed next to one another, each standard cell including first transistors and a clock tree cell encircled by standard cells. The clock tree cell has a third semiconductor well with the same doping type as the doping of the first well and second transistors. The clock tree cell also has a semiconductor strip extending continuously around the third well and having the opposite doping type to the doping of the third well to electrically isolate the third well from the first well.

Abstract: A high side driver circuit includes a driver stage having an input, an output, a first power terminal and a second power terminal, a transistor having a first power terminal, a second power terminal, and a control terminal coupled to the output of the driver stage, and a switch coupled between the second power terminal of the driver stage and the second power terminal of the transistor.

Abstract: A back-side illuminated image sensor formed from a thinned semiconductor substrate, wherein: a transparent conductive electrode, insulated from the substrate by an insulating layer, extends over the entire rear surface of the substrate; and conductive regions, insulated from the substrate by an insulating coating, extend perpendicularly from the front surface of the substrate to the electrode.

Abstract: An SOI substrate has a first region isolated from a second region. An SiGe layer is deposited on top of the SOI substrate in the second region. The substrate is subjected to a thermal oxidation process which drives in Ge from the SiGe layer to form an SiGeOI structure in the second region and an overlying oxide layer. If the SOI substrate is exposed in the first region, the thermal oxidation process further produces an oxide layer overlying the first region. The oxide layer(s) is(are) removed to expose an Si channel layer in the first region and an SiGe channel layer in the second region. Transistor gate stacks are formed over each of the Si channel layer and SiGe channel layer. Raised source and drain regions are formed from the Si channel layer and SiGe channel layer adjacent the transistor gate stacks.

Abstract: An apparatus comprises a reference voltage bias generator configured to generate a first reference voltage and a second reference voltage. During a low supply mode, the first reference voltage is equal to a supply voltage potential and the second reference voltage is equal to a ground potential. During a high supply mode, the first reference voltage is equal to a first fraction times the supply voltage potential and the second reference voltage is equal to a second fraction times the supply voltage potential. The apparatus further includes a reference voltage booster coupled to the reference voltage bias generator, wherein the reference voltage booster is configured to generate the first reference voltage and the second reference voltage with increased drive capability.

Abstract: A semiconductor package is formed having a substrate juxtaposed on at least two sides of a semiconductor die. Both the substrate and the semiconductor die are affixed to a conductive layer that draws heat generated during use of the semiconductor package away from the semiconductor die and the substrate. There are also electrical contacts affixed to the substrate and the semiconductor die. The electrical contacts facilitate electrical connection between the semiconductor die, the substrate, and any external devices or components making use of the semiconductor die. The substrate, semiconductor die, and at least a portion of some of the electrical contacts are enclosed by an encapsulating layer insulating the components. Portions of the electrical contacts not enclosed by the encapsulating layer are affixed to an outside device, such as a printed circuit board.

Abstract: A method for controlling the power supply of an integrated circuit, the power supply comprising a power supply unit powered by a main voltage and possessing several transistor groups, comprising turning on in succession at least two transistor groups in order to deliver, as an output from each group, to at least one part of the integrated circuit, an elementary supply voltage derived from the main voltage, characterized in that the method comprises at least one elementary power phase for supplying power to said at least one part of the integrated circuit, wherein the phase comprises defining voltage thresholds respectively associated with the transistor groups, turning on a first transistor group, the first group delivering a first elementary supply voltage and turning on at least one second group when the first elementary supply voltage is higher than or equal to the voltage threshold associated with the second group.

Abstract: The method is for protecting the digital contents of a solid state memory including a microprocessor. A microprocessor inserts at least an interruption during a copy or a reading of the digital contents and proceeds with the copy or reading only subsequently to a verification of a PIN. In particular, the verification provides control that the PIN is inserted manually. Also, a solid state memory includes a microprocessor programmed for inserting at least an interruption in a copy or reading of digital contents of the memory, for verifying a PIN, and for proceeding with the copy or the reading, if the PIN is inserted correctly.

Abstract: Metal contacts are self-positioned on a wafer of semiconductor product. Respective placement areas for a metal contact are determined by a selective deposition of a growth material over a region of the substrate surface (for example, through epitaxial growth). The growth material is surrounded by an insulating material. The grown material is then removed to form a void in the insulating material which coincides with the desired location of the metal contact. This removal of the grown material exposes the region on the substrate surface. Conductive material is then deposited to fill the void and thus form the metal contact directly with the region of the substrate surface.

Abstract: An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

Abstract: A method and a circuit for detecting a radio-frequency signal, including at least one first MOS transistor with a channel of a first type, having its gate coupled to an input terminal capable of receiving said signal; a circuit for biasing the first transistor, capable of biasing it to a level lower than its threshold voltage; and a circuit for determining the average value of the current in the first transistor.

Abstract: A hybridization detecting device, wherein a probe cell has a body of semiconductor material forming a diaphragm, a first electrode on the diaphragm, a piezoelectric region on the first electrode, a second electrode on the piezoelectric region and a detection layer on the second electrode. The body accommodates a buried cavity downwardly delimiting the diaphragm.

Abstract: Both a chalcogenide select device and a chalcogenide memory element are formed within vias within dielectrics. As a result, the chalcogenides is effectively trapped within the vias and no glue or adhesion layer is needed. Moreover, delamination problems are avoided. A lance material is formed within the same via with the memory element. In one embodiment, the lance material is made thinner by virtue of the presence of a sidewall spacer; in another embodiment no sidewall spacer is utilized. A relatively small area of contact between the chalcogenide used to form a memory element and the lance material is achieved by providing a pin hole opening in a dielectric, which separates the chalcogenide and the lance material.

Abstract: A microfluidic device for nucleic acid analysis includes a monolithic semiconductor body (13), a microfluidic circuit (10), at least partially accommodated in the monolithic semiconductor body (13), and a micropump (11). The microfluidic circuit (10) includes a sample preparation channel (18) formed on the monolithic semiconductor body (13) and at least one microfluidic channel (20, 22) buried in the monolithic semiconductor body (13). The micropump (11), includes a plurality of sealed chambers (40) provided with respective openable sealing elements (41) and having a first pressure therein that is different from a second pressure in the microfluidic circuit (10). In addition, the micropump (11) and the microfluidic circuit (10) are configured so that opening the openable sealing elements (41) provides fluidic coupling between the respective chambers (40) and the microfluidic circuit (10). The openable sealing elements (41) are integrated in the monolithic semiconductor body (13).

Abstract: A bifunctional compound comprising a molecular unit (I) intercalating between nucleobases (B) of nucleic acids, an active molecular unit (AD) capable of emitting a detectable signal, and optionally a spacer unit, in which the active molecular unit (AD) is selected from amongst chemical entities having a structure such as to interact electronically with the intercalating molecular unit (I) in such a way that, during the reaction of oxidation, the reduction-oxidation potential (EI+/I) of the semicouple I+/I defined by the intercalating molecular unit (I) is lower than the reduction-oxidation potential (EB+/B) of the semicouple B+/B defined by the nucleobases (B), and in such a way that, during the reaction of reduction, the reduction-oxidation potential (EI/I?) of the semicouple I/I? defined by the intercalating molecular unit (I) is higher than the reduction-oxidation potential (EB/B?) of the semicouple B/B? defined by the nucleobases (B).