Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region.

Abstract: MT ferrule. A polymer fiber optic MT ferrule includes hermaphroditic L-shaped halves having multiple fibers mounted in V-grooves formed within surfaces of ferrule halves. Ferrule halves include holed walls perpendicular to the major surface of the V-grooves for providing alignment of the ferrule to guide pins of an MT receptacle having an alignment assembly and an alignment member mounted within the alignment assembly to provide for precision alignment.

Abstract: A shared communications device includes a multi-port jack housing having portions defining a plurality of recesses extending inwardly from the front for receiving respective mating plugs. Signal connectors are preferably positioned within each of the recesses and define respective communications ports. A circuit board is positioned within the multi-port jack housing and preferably extends adjacent the back. The shared communications device preferably includes at least one shared communications processor mounted on the circuit board and connected to the plurality of communications ports for processing inbound and outbound communications signals so that the signals are shared among the communications ports. A shared communications processor preferably communicates with two or more of the communications ports. In embodiments including a plurality of shared communications processors, a communications repeater bus is provided on the circuit board interconnecting the shared communications processors.

Abstract: An optoelectronic transceiver is provided having an adaptable logic level signal detect output. The preferred embodiments are configured to generate various logic level signal detected signals directly for use by the transceiver host device. A first embodiment generates the SD output based on the actual optical power received over the optical transfer medium. When the received optical power exceeds a predetermined threshold, the monitor voltage exceeds the reference voltage, and the signal detected output is set. The output stage of the circuit can be configured such that in the true state, meaning a signal has been detected, a TTL level signal, a CMOS signal, or a high voltage or high current signal is set to true. The high voltage and high current configurations may be set to any value required under the specific requirements of the application. In a second embodiment an AC signal detecting circuit generates the SD output.

Abstract: A communications device includes a multi-port jack housing having portions defining a plurality of recesses extending inwardly from the front for receiving respective mating plugs. Signal connectors are preferably positioned within each of the recesses and define respective communications ports. A circuit board is positioned within the multi-port jack housing and preferably extends adjacent the back. The communications device preferably includes at least one communications processor mounted on the circuit board and connected to the plurality of communications ports for processing inbound and outbound communications signals. A communications processor preferably communicates with two or more of the communications ports. In embodiments including a plurality of communications processors, a communications bus is provided on the circuit board interconnecting the communications processors. The signal connectors may be electrical and/or optical, and may be compatibility with an RJ-45 jack.

Abstract: A device which retains a polymer mounting block between a metallic cover and a metallic base. The mounting block includes two mounting halves. The mounting halves being hermaphroditic such that a pair of the mounting halves of the mounting block being substantially identical can be assembled in opposite transverse relation to form the mounting block. The mounting half of the mounting block includes a member and two latch arms attached to the member. The member includes a transmitter mounting provision and a receiver mounting provision. The transmitter mounting provision receives a transmitter sub-assembly, and the receiver mounting provision receives a receiver sub-assembly. The transmitter mounting provision and the receiver mounting provision straddle the second latch arm, and the first latch arm and the second latch arm straddle one of the transmitter mounting provision and the receiver mounting provision.

Abstract: A tool for inserting and removing a plug insert for the termination device includes a body, a plunger, a pin, and a spring. The body has a main aperture formed through the length of the body. The main aperture has a spring seat formed therein. The body also has a pin travel aperture formed through a diameter of the body and substantially perpendicular to the main aperture. The plunger has a large diameter region and a small diameter region. The large diameter region having a spring seat formed thereon. A portion of both the small diameter region and the large diameter region are slidable provided in the main aperture of the body. The spring is provided in the main aperture of the body. The spring surrounds a portion of the small diameter region of the plunger.

Abstract: A module is provided for attaching to a flexible shielded cable including individual conductors. The module includes a die cast housing, a printed circuit board mounted within the die cast metal housing, a metal D-shell ribbon style host connector associated with the die cast metal housing, first and second apertures formed in the die cast metal housing, first and second guide tabs formed on the printed circuit board and arranged to protrude through the first and second apertures, and insulation displacement contact (IDC) connector header mounted within the die cast metal housing, and an insulation displacement contact (IDC) cover insert affixed to the die cast metal housing so as to engage individual conductors and forces the conductors onto the knife contacts of the IDC connector header when the two are brought together. The die cast metal housing having a base member and a cover. The module is hot pluggable.

Abstract: A bus bar assembly having a high-speed switching device, a bus bar, and a heat sink. The switching device is integrated into a cavity on the top surface of the bus bar, and the heat sink is mechanically coupled to the bottom surface of the bus bar. The bus bar may include capacitors that are positioned upside down on the top surface of the bus bar to more effectively communicate heat from the capacitor to the bus bar and then the heat sink. The heat sink may be formed from a pair of parallel plates that oppose each another to form a cooling channel, wherein a coolant, such as gas or water, may be passed through. An interior surface of one of the plates may incorporate a cooling structure such as grooves or fins.

Abstract: An optical package is provided including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The ferrule receiving bore includes a longitudinal slot extending generally parallel to the axis of the bore providing radial flexibility to the outer wall. Additionally, a split sleeve is provided for accepting a fiber optic connector ferrule. The split sleeve being insertable and expandable in a ferrule receiving bore of an optical package housing. The split sleeve being retained in the ferrule receiving bore with an adhesive.

Abstract: An apparatus for injection molding of a fiber optic ferrule including the use of adjustable core and receiver members to precisely locate a core pin and also a projecting wire member in a mold where the core pin defines an interior passage in the molded ferrule and the projecting wire forms a small diameter longitudinal hole in the ferrule communicating with an outer end of the interior passage so that the interior passage and small diameter hole are precisely located relative to the body of the molded ferrule.

Abstract: A method and apparatus for injection molding of a fiber optic ferrule including the use of adjustable core and receiver members adjustable from the exterior of the mold to precisely locate a projecting wire member in a mold where a score pin defines an interior passage in the molded ferrule and the projecting wire forms a small diameter longitudinal hole in the ferrule communicating with an outer end of the interior passage so that the interior passage and small diameter hole are precisely located relative to the body of the molded ferrule.

Abstract: A massive parallel (MP) connector is provided which includes a fiber optic connector having a polymer female having multiple fibers mounted in V-grooves of the ferrule and beveled edges of the ferrule providing for alignment of the ferrule when the MP fiber optic connector is mated to a receptacle having an alignment assembly and an alignment member mounted within the alignment assembly to provide for precision alignment. A receptacle assembly is provided having a first receptacle half for receiving a fiber optic connector having a first form factor and a second receptacle half for receiving a fiber optic connector having a second form factor.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a circuit board having an optical subassembly mounted thereon. The module housing may be pluggable via a retention member received within the receptacle. The module and receptacle assembly may include grounding means such as a ground clip mounted within a gap provided between the module and a connector port of the receptacle to limit electromagnetic emissions.

Abstract: A hermaphroditic fiber optic termination device including a plug insert removably insertable into a front of a housing. The housing having locking holes. The plug insert formed so as to receive ferrules surrounding terminal ends of the optical fibers. The plug insert having spring latches, where each spring latches has a nub. The nub feature being designed so as to spring into the locking holes of the housing.

Abstract: The invention relates to an interface module, such as a Giga-Bit Interface Converter module, provided to mate within a host device chassis where, at the rear of the mounting slot, a first connector engages a host socket of the host device. According to the invention, the first connector include sequential mating contact traces on a contact beam of a substrate such that when the module is inserted into the corresponding host socket, certain contacts are connected in a pre-defined sequence such that a first set of contacts electrically engages prior to a second set of contacts which electrically engages prior to a third set of contacts. In further accord with the present invention, the first set of contacts includes grounding contacts, the second set includes contacts for powering the substrate and the third set includes signal contacts.

Abstract: An interface is provided, the interface having at least two form factors—one for interfacing to a connector on a fiber channel drive and one or more other form factors for interfacing to one or more other styles of connectors. The first form factor is on a first part of the printed circuit board and the others are on a second part of the printed circuit board. Further, the first part of the printed circuit board is on one side of the printed circuit board and the other part of the printed circuit board is on an opposite side. Further, one or more non-SCA connectors are mounted on a front side of a substrate for receiving one or more non-SCA style connectors and an SCA2 receptacle is mounted on the back side of the substrate for interfacing the non-SCA connector an SCA connector on a fiber channel cable. Further, the non-SCA2 connector can include a DB9 receptacle, a high speed serial data connector (HSSDC), or RJ-45. Further, the fiber channel drive can receive a media interface adapter (MIA).

Abstract: An optoelectronic transmitter module is provided for transmitting optical data signals from a host device. The module is housed within a grounded chassis of the host device and provides a reduced effective aperture therethrough. The module components include electronic circuitry mounted within the module configured to convert electrical data signals to an optical output signal. A conductive housing encloses the electronic circuitry. The module housing includes a first connector end adapted to receive a fiber optic connector. When the module is installed within the host device chassis, the connector end engages the host chassis to form a conductive barrier around the first end of the housing. A conductive transmitting optical subassembly (TOSA) is disposed within the connector end of the housing, forming a continuous conductive barrier therewith. The TOSA includes first and second ends with a narrow passage extending therebetween.

Abstract: A solderable metallized plastic contact includes an element made of a polymer where an electrically conductive material covers a surface of the element so as to form an electrically conductive region on the element. The electrically conductive material is electroplated to the surface of the element. The electrically conductive material in the electrically conductive region is solderable. The electrically conductive material in the electrically conductive region does not delaminate from the surface of the element. Additionally, a method of manufacturing a solderable metallized plastic contact is also disclosed.

Abstract: An interface converter module is provided for converting data signals from a first transmission medium to a second transmission medium. The module includes a metallized housing having a first end and a second end. A shielded electrical connector is mounted at the first end of the housing and configured to mate to a corresponding host connector associated with a first transmission medium. The housing includes a flexible metallic shielded cable extending from the second end. The remote end of the shielded cable comprises the media interface which includes an interface connector configured to the connect flexible shielded cable to the second transmission medium. A printed circuit board is mounted within the housing and has mounted thereon electronic circuitry configured to convert data signals from a host device transmission medium to the second transmission medium.