Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly.

Abstract: An interface converter module is provided for converting data signals from a first transmission medium to a second transmission medium. The module is housed within a metallized housing having a first end and a second end. A shielded electrical connector is mounted at the first end of the housing and is configured to mate to a corresponding connector associated with a first transmission medium. The second end of the housing comprises a media interface which includes an interface connector configured to connect to the second transmission medium. In another embodiment a printed circuit board is mounted within the housing and has mounted thereon electronic circuitry configured to convert data signals from a host device transmission medium to the second transmission medium. The printed circuit board includes contact fingers adhered at each end in order to form a host connector at the first end of the module and a media connector at the second end of the module.

Abstract: A coupling is provided having a one-piece body, with a first segment having a first chamber for receiving an optical connector and ferrule, a second segment having a second chamber for receiving an alignment sleeve that retains and interconnects the ferrules, a third segment substantially similar to the first segment and having a third chamber for receiving a second optical connector and ferrule, wherein said first, second and third chambers are aligned longitudinally across the one-piece body, and a resilient arm extends from the one-piece body to allow the coupling of the invention to be received by a coupling aperture.

Abstract: An optoelectronic transmitter is provided including a semiconductor laser as the active optical transmitting element. The transmitter includes first and second printed circuit boards, with the first printed circuit board having mounted thereon electronic components and circuitry for driving the optoelectronic transmitter. A transmitting optical sub-assembly (TOSA) is mounted to the second printed circuit board. The second printed circuit board has an array of solder pads disposed on the back surface thereof, and the first printed circuit board has a corresponding array of solder pads disposed along an outer edge of the board. Spacing of the solder pads is such that when the first printed circuit board is placed in perpendicular abutment against the outer edge of the first printed circuit board, the solder pads formed on the first printed circuit board are aligned adjacent to the solder pads disposed on the back of the second printed circuit board.