Abstract: A security pocket has a front, transparent panel and a back panel, capable of being printed upon. Three sides of the perimeter of the two panels is permanently bonded, leaving a top opening into the pocket. The back panel includes a closure flap, which carries a permanent, pressure sensitive adhesive and, a tear strip. The front panel includes a removable strip, coextensive with the closure flap, which includes a layer of silicone release material facing the adhesive material. After the pocket is filled, the removable strip is removed and the closure flap is folded over and permanently sealed to the front panel. The transparent panel is a plastic film having significant antistatic properties which enables the flat, empty, two ply pocket to be fed through a sheet fed non-impact printer, without formation of excess static electricity.

Abstract: A multi-part, partially pre-printed form useful as an airbill has address information printed thereon by a non-impact printer. The form includes top and bottom transparent plastic sheets affixed together by an adhesive having three panels defined by perforation cuts through the top sheet and die cuts through the bottom sheet. The adhesive facing side of one of the sheets is preprinted with information appearing on each panel. In addition, a background opaque color is printed over the information on two outer panels, leaving the center panel transparent. The information pre-printed on the opaque panels having is in a mirror image format relative to the information pre-printed on the transparent panel. The address is printed on the outward side of the bottom sheet such that the address printed on the transparent panel is a mirror image relative to the information on outer panels. A four part form is also disclosed.

Abstract: A mailing form, including an upper sheet of material adhesively fastened to a lower sheet, is configured for the printing of information on a single side during passage of the form through a non-impact printer. At a first end of the form, the upper and lower sheets are fastened together permanently, forming a pocket to be used as a return envelope. The portion of the upper sheet which extends away from this pocket is divided into an inner flap, on which information is printed, and an outer flap, which is temporarily fastened to the lower sheet in order to protect an adhesive pattern during the printing process. After the printing process, the outer flap is removed and discarded, the inner flap is folded along lines provided for folding, and the lower sheet is folded on itself to enclose the inner flap. As the adhesive pattern holds the lower sheet shut in this position, address and return address information printed on the inner flap is visible through apertures in the lower sheet, which forms an envelope.

Abstract: A process is provided for producing booklets, such as bank check booklets, having variable printed information. A paper stock for the booklets, perforated for separation into panels, is coated with a catalyst along certain surfaces. After passage through a non-impact printer, such as a laser printer, the panels are separated and stacked in such a way that the surfaces coated with a catalyst extend along an edge of each panel, with these edges being aligned in a common direction. When the coated edges of each stack of panels are subsequently pressed against an adhesive layer coated on a binding cover, the catalyst begins the process of hardening the adhesive in the layer.

Abstract: A form for creating a postcard having printing on both sides includes a front sheet and a back sheet, which are laminated using a pressure sensitive adhesive on a back surface of the front sheet. A fold line extends across the front sheet, while a tear line underlying the fold line extends across the back sheet. A gap in the adhesive preferably extends along the fold line. On one side of the fold line opposite to the direction of the gap, the inner surface of the back sheet has a release coating restricting the adhesion of the adhesive layer. After printing on the front surface of the front sheet, the section of the back sheet having this release coating is removed and discarded, and the front sheet is folded along the fold line, thereby providing a document having printing on both sides and a thickness sufficient for a postcard.

Abstract: A fine-pitch pin grid array for mounting an IC chip having a number of signal, ground and power contact pads thereon comprises a square as-fired ceramic substrate having a corresponding number of signal, ground and power metal filled vias located on the side portions of the surface thereof. Deposited on the surface of the substrate is a thin-film metallization which includes a corresponding number of signal, ground and power bonding pads located on the sides of the central portion thereof and further includes conductive traces which provide for connecting each signal metal filled via to a signal bonding pad. Deposited over the thin-film metallization is a multilayer circuit which includes a first dielectric layer having a low dielectric constant, a ground metal layer, a second dielectric layer having a high dielectric constant, and a power metal layer. The ground metal layer is used to commonly connect the ground metal filled vias to the ground bonding pads.

Abstract: An as-fired alumina substrate for a hybrid microcircuit formed of GaAs dies operating at gigahertz frequencies has a large number of about 0.013" diameter via holes drilled on the surface thereof by use of a laser. A metal filling in each via hole is formed with about 85% sintered tungsten and 15% copper reflowed into the pores thereof to provide a composition that has a thermal coefficient of expansion that substantially matches that of the GaAs dies and the alumina substrate and also provides for hermetically sealing the via holes. The alumina substrate is further provided with a ground plane by which it is mounted on a metal block serving as a heat sink. The high frequency GaAs dies mounted on the via holes use the metal fillings therein to carry their internally generated heat to the heat sink and to provide low inductance ground paths for the microcircuit.