Abstract: To provide an optical system that lengthens the lifetime of a fiber, an optical system 13 guides light beams emitted from a plurality of light emitting parts ep into a single optical fiber 12, the plurality of light emitting parts ep are arranged to be aligned along a first direction d1, and the optical system 13 allows the light beams emitted from the plurality of light emitting parts ep to have different light collection centers which are offset from each other at least in a second direction d2.

Abstract: Provided is an optical glass having low specific gravity, low abrasion degree, and high devitrification-proof stability, as well as a preform for precision press molding and an optical element which use such an optical glass. The optical glass has a composition including, in cationic % expression, P5+: 36 to 40%, Al3+: 11 to 16%, Mg2+: 11 to 19%, Ca2+: greater than 0% and 2% or less, Sr2+: 0 to 4%, Ba2+: 25 to 31%, Zn2+: 0% or more and less than 2.4%, and Y3+: 2 to 7%, a total amount of Zn2+and Y3+ (Zn2++Y3+) being 3 to 7%. The composition also includes, in anionic % expression, O2?: 74 to 78%, and F?: 22 to 26%. Li+, Na+, K+, La3+, and Gd3+ are not included. The optical glass further has a refractive index (nd) of 1.58 to 1.60 and an Abbe number (?d) of 67 to 69.

Abstract: Provided is a medium-refractive-index low-dispersion optical glass that may be precision press-molded, that has a high water resistance, and that has a low specific gravity, as well as a preform for precision press molding and an optical element which use such an optical glass. The optical glass has a composition including, in % by mass, SiO2: 35 to 55%, B2O3: 12 to 27%, Al2O3: 6 to 16%, Li2O: 5 to 12%, MgO: 0 to 10%, CaO: 5 to 17%, ZrO2: 0 to 7%, La2O3: 0 to 7%, ZnO: 0 to 5%, TiO2: 0 to 5%, Nb2O5: 0 to 5%, and Ta2O5: 0 to 5%. SrO and BaO are not included.

Abstract: A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Abstract: A light-emitting device includes a light source including an element mounting substrate, an LED element mounted thereon by flip-chip connection and a sealing portion for sealing the LED element on the element mounting substrate, and a light guide plate including a housing hole for housing the light source. The housing hole extends from one surface side to another surface side of the light guide plate and an area of an inner surface thereof on which light is incident from the light source is parallel to a thickness direction of the light guide plate. The light source is housed in the housing hole so that the element mounting substrate is located on the other surface side of the light guide plate, emits light toward the one surface side of the light guide plate in the housing hole and the inner surface side of the housing hole, and has an optical axis parallel to the thickness direction of the light guide plate.

Abstract: An optical device has a substrate, an optical element mounted on the substrate, a first glass member sealing the optical element and the substrate, and a second glass member formed on the first glass member and having a mold separation property higher than the first glass member.

Abstract: An object of the present invention is to provide optical glass having improved glass-devitrification resistance and moldability without causing reduction in refractive index, and also provide an optical element using the optical glass as a raw material. Specifically, the present invention provides an optical glass containing components of, by mol %: B2O3: over 60% through 75%; Bi2O3: 24% to 39%; La2O3: 7% or lower; Gd2O3: 7% or lower; and ZrO2: 7% or lower.

Abstract: A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Abstract: A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

Abstract: A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.

Abstract: A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.

Abstract: A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a B2O3—SiO2—Li2O—Na2O—ZnO—Nb2O5 based glass, which is composed of 21 wt % to 23 wt % of B2O3, 11 wt % to 13 wt % of SiO2, 1 wt % to 1.5 wt % of Li2O, and 2 wt % to 2.5 wt % of Na2O.

Abstract: A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.

Abstract: A light-emitting device includes a light source including an element mounting substrate, an LED element mounted thereon by flip-chip connection and a sealing portion for sealing the LED element on the element mounting substrate, and a light guide plate including a housing hole for housing the light source. The housing hole extends from one surface side to another surface side of the light guide plate and an area of an inner surface thereof on which light is incident from the light source is parallel to a thickness direction of the light guide plate. The light source is housed in the housing hole so that the element mounting substrate is located on the other surface side of the light guide plate, emits light toward the one surface side of the light guide plate in the housing hole and the inner surface side of the housing hole, and has an optical axis parallel to the thickness direction of the light guide plate.

Abstract: An optical glass for precision molding having a high refractive index (nd) and a low yield temperature (At). The optical glass comprises, as glass components in wt %, 64 to 83% of Bi2O3; 4 to 17% of B2O3; 0 to 12% of GeO2 (wherein the total of B2O3 and GeO2 is 10 to 20%); 0 to 7% of La2O3; 0 to 7% of Gd2O3 (wherein the total of La2O3 and Gd2O3 is 1 to 13%); 0 to 4% of ZrO2; 0 to 5% of Ta2O5; 0 to 15% of ZnO; 0 to 2% of Sb2O3; and 0 to 1% of In2O3. The optical glass has optical constants, that is, a refractive index (nd) of 2.05 to 2.25 and an Abbe number (vd) of 15 to 22, and a yield temperature (At) of 510° C. or less.

Abstract: A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

Abstract: A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.

Abstract: A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.

Abstract: A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.