Abstract: Provided is a microorganism that is capable of efficiently producing para-aminobenzoic acid (4-ABA) or a salt thereof, using saccharides as raw materials, and a method for efficiently producing 4-ABA or a salt thereof by using this microorganism. A transformant obtained by introducing, into a coryneform bacterium, a gene that encodes 4-amino-4-deoxychorismate lyase, a gene that encodes a para-aminobenzoate synthase component I, and a gene that encodes a para-aminobenzoate synthase component II, is capable of efficiently producing 4-ABA or a salt thereof from saccharides.

Abstract: A medical treatment implement which has an excellent degree of freedom of a procedure and into which a trocar can be re-stuck includes a tubular retractor main body configured to be indwelled in an incision wound and a converter (20) configured to close an opening end portion of an upper end of the retractor main body and to be puncturable with a trocar. The converter (20) includes a ring-shaped frame portion (22) detachably mounted on the opening end portion and a sheet portion (21) which is mounted inside the frame portion (22) and airtightly covers the opening end portion. A compression force P is applied to the sheet portion (21) in an inner diameter direction.

Abstract: In the phenolic resin to be blended with rubber of the present invention, when the total peak area in a chemical shift measured by 13C-NMR of 110 ppm or more and 160 ppm or less is taken as 100, the total peak area in 0 ppm or more and less than 60 ppm is 80 to 400 and the total peak area in 60 ppm or more and less than 110 ppm is 2 to 70.

Abstract: Provided is a microorganism that is able to efficiently produce protocatechuic acid or a salt thereof by using a saccharide as a raw material, and a method of efficiently producing protocatechuic acid or a salt thereof by using the microorganism. Provided is a transformant having protocatechuic acid producing ability, subjected to modifications (A), (B), and (C) below: (A) enhancement of 3-dehydroshikimate dehydratase activity; (B) enhancement of chorismate pyruvate lyase activity; and (C) enhancement of 4-hydroxybenzoate hydroxylase activity. Also provided is a method of producing protocatechuic acid or a salt thereof, including the step of culturing the transformant in a reaction solution containing a saccharide so as to cause the transformant to produce protocatechuic acid or a salt thereof.

Abstract: A fiber-containing particulate resin structure (S) is a particulate resin structure including a resin (1) and fibers (2), in which the fibers (2) are dispersed in the resin (1) in an opened state, and an average density of the resin structure is in a range of 0.20 to 1.00 (g/cm3).

Abstract: Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.

Abstract: A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140° C. to 180° C., the composition has a temperature width of equal to or larger than 10° C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180° C. and 2 hours, is equal to or lower than 5% by weight.

Abstract: A pervaporation membrane formed from a series of vinyl addition block polymers derived from functionalized norbornene monomers are disclosed and claimed. Also disclosed are the fabrication of membranes which exhibit unique separation properties, and their use in the separation of organic volatiles from biomass and/or organic waste, including butanol, phenol, and the like.

Abstract: The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler. In the general formulae (1), (2-1) and (2-2), each of X2, X3 and X4 independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula “—SO2—” or “—CO—”, an oxygen atom or a single bond.

Abstract: According to the present invention, there is provided a clip cartridge in which a clip having a structure enabling a user to easily perform a series of procedures can be easily and reliably mounted on a treatment instrument body. A clip cartridge (200) according to the present invention includes an inner case (30) that has a first accommodation region (32) for accommodating a clip (110), and an outer case (40) that has an elongated insertion hole (43) into which a treatment instrument body (90) is inserted, and a second accommodation region (42) which accommodates the inner case (30) so as to be movable. The treatment instrument body (90) is inserted into the insertion hole (43), and an operation wire is pressed forward so that a distal connection portion and a diameter enlargement portion of the sleeve protrude from the sheath to a distal side and enter the second accommodation region (42), and so that a diameter enlargement portion is elastically enlarged in diameter.

Abstract: Provided is a liquid phenolic resol resin containing a partial structure represented by General Formula (P-1) [in the formula, R1, R2 and R3 each independently represent a hydrogen atom or —CH2OH, R4 represents a linear unsaturated hydrocarbon group having 10 or more carbon atoms, and * represents a bond].

Abstract: A process for the production of high compressive strength microspheres of cured phenolic resins are disclosed. Specifically, the microspheres formed by this process exhibit excellent viscoelastic properties in that the microspheres retain their shape even after applying a load of at least 4 GPa at 2.5 percent strain, and exhibit high hardness of at least about 0.3 GPa.

Abstract: There is provided a phenolic resin composition as a molding material. It includes a resol-type phenolic resin (A) and a novolac-type phenolic resin (B). The novolac-type phenolic resin (B) includes a novolac-type phenolic resin (B1) represented by General Formula (1) and a modified novolac-type phenolic resin (B2) represented by General Formula (2).

Abstract: The phenolic resin composition of the present invention includes a novolac-type phenolic resin, a resorcinol resin, and a curing agent, and is of a solid form. The mixing ratio of the resorcinol resin is preferably more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin. The mixing ratio of the curing agent is preferably more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin. The phenolic resin cured product is obtained by heat-curing the phenolic resin composition.

Abstract: A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140° C. to 180° C., the composition has a temperature width of equal to or larger than 10° C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180° C. and 2 hours, is equal to or lower than 5% by weight.

Abstract: A lignin derivative that is extracted from biomass and is used for rubber reinforcement or for use in a molding material is provided. Such a lignin derivative has a number average molecular weight of 300 to 2,000, and contains a component that is soluble in a polar organic solvent, in an amount of 80% by mass or more. When such a lignin derivative is incorporated, a lignin resin composition, a rubber composition, or a molding material, all of which have excellent low hysteresis loss characteristics, elastic modulus, or tensile properties, can be obtained. Furthermore, when a component that is thermofusible is used as the soluble component, a lignin resin composition, a rubber composition, or a molding material, all of which have superior aforementioned characteristics, can be obtained.

Abstract: The present invention provides an endoscopic clip device and a clip in which a connection operation between a clip and an operation wire is facilitated, and in which a procedure can be quickly performed by reducing an exchange frequency of a treatment instrument body. An endoscopic clip device (100) according to the present invention includes a clip (110) that has a plurality of arms (120) for gripping a living body tissue and a locking portion (130), and a treatment instrument body that comprises an elongated sheath (10) and an operation wire (20) in which a chunky distal connection portion (50) is disposed in a distal end. In a state where the distal connection portion (50) is accommodated in an accommodation portion (134), the operation wire (20) is drawn to a proximal side in a forward/backward movement direction so that the arms (120) are closed to grip the living body tissue.

Abstract: Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.

Abstract: A resin composition for sealing of the present invention contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a compound (D) represented by Formula (1). In Formula (1), R1 represents a polar group or a hydrocarbon group. An electronic component device (10) of the present invention has an electronic component (11) and a sealing material (12) sealing the electronic component (11), in which the sealing material (12) is a cured substance of the resin composition for sealing.

Abstract: A resin composition is used for forming a surface layer coating at least a part of an outer surface of a particle. The particle is adapted to be packed into a fracture formed in a subterranean formation, and contains a thermosetting resin and a hydrophilic polymer. It is preferred that the resin composition further contains a surfactant. According to the present invention, it is possible to provide an effect of preventing pieces of core particles from being scattered due to the action of a thermo-setting resin and an effect of improving compatibility with respect to water (that is, fluid repellent with respect to hydrocarbon) due to the action of a hydrophilic polymer in a synergistic manner. This increases conductivity of packed spaces of a subterranean formation (that is, fractures of the subterranean formation) in which coated particles are packed.