Patents Assigned to Sumitomo Bakelite Co., Ltd.
  • Cured phenolic spheres and method of producing the same
    Patent number: 10174148
    Abstract: A process for the production of high compressive strength microspheres of cured phenolic resins are disclosed. Specifically, the microspheres formed by this process exhibit excellent viscoelastic properties in that the microspheres retain their shape even after applying a load of at least 4 GPa at 2.5 percent strain, and exhibit high hardness of at least about 0.3 GPa.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: January 8, 2019
    Assignees: DUREZ CORPORATION, SUMITOMO BAKELITE CO., LTD.
    Inventors: Todd Warakomski, Matsuo Yoshihiro
  • Phenolic resin composition and molded body
    Patent number: 10155863
    Abstract: There is provided a phenolic resin composition as a molding material. It includes a resol-type phenolic resin (A) and a novolac-type phenolic resin (B). The novolac-type phenolic resin (B) includes a novolac-type phenolic resin (B1) represented by General Formula (1) and a modified novolac-type phenolic resin (B2) represented by General Formula (2).
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: December 18, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Yusuke Watanabe
  • Phenolic resin composition and phenolic resin cured product
    Patent number: 10144823
    Abstract: The phenolic resin composition of the present invention includes a novolac-type phenolic resin, a resorcinol resin, and a curing agent, and is of a solid form. The mixing ratio of the resorcinol resin is preferably more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin. The mixing ratio of the curing agent is preferably more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin. The phenolic resin cured product is obtained by heat-curing the phenolic resin composition.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: December 4, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Naoyuki Harada, Takao Kunimi
  • PASTE-LIKE ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR BONDING HEATSINK
    Publication number: 20180340101
    Abstract: A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140° C. to 180° C., the composition has a temperature width of equal to or larger than 10° C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180° C. and 2 hours, is equal to or lower than 5% by weight.
    Type: Application
    Filed: January 27, 2016
    Publication date: November 29, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Yasuo SHIMOBE, Ryuichi MURAYAMA, Koji MAKIHARA
  • Lignin derivative, lignin resin composition, rubber composition, and molding material
    Patent number: 10138377
    Abstract: A lignin derivative that is extracted from biomass and is used for rubber reinforcement or for use in a molding material is provided. Such a lignin derivative has a number average molecular weight of 300 to 2,000, and contains a component that is soluble in a polar organic solvent, in an amount of 80% by mass or more. When such a lignin derivative is incorporated, a lignin resin composition, a rubber composition, or a molding material, all of which have excellent low hysteresis loss characteristics, elastic modulus, or tensile properties, can be obtained. Furthermore, when a component that is thermofusible is used as the soluble component, a lignin resin composition, a rubber composition, or a molding material, all of which have superior aforementioned characteristics, can be obtained.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: November 27, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Taketoshi Murai, Hiroshige Nakagawa, Mitsutaka Matsumoto
  • ENDOSCOPIC CLIP DEVICE AND CLIP
    Publication number: 20180333156
    Abstract: The present invention provides an endoscopic clip device and a clip in which a connection operation between a clip and an operation wire is facilitated, and in which a procedure can be quickly performed by reducing an exchange frequency of a treatment instrument body. An endoscopic clip device (100) according to the present invention includes a clip (110) that has a plurality of arms (120) for gripping a living body tissue and a locking portion (130), and a treatment instrument body that comprises an elongated sheath (10) and an operation wire (20) in which a chunky distal connection portion (50) is disposed in a distal end. In a state where the distal connection portion (50) is accommodated in an accommodation portion (134), the operation wire (20) is drawn to a proximal side in a forward/backward movement direction so that the arms (120) are closed to grip the living body tissue.
    Type: Application
    Filed: August 21, 2015
    Publication date: November 22, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Takuya HAYASHI, Masao IKEDA, Hiroshi OTSUGI, Etsuro YAMABE, Hideaki MATSUNAMI
  • RESIN COMPOSITION FOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE
    Publication number: 20180337105
    Abstract: Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.
    Type: Application
    Filed: November 28, 2016
    Publication date: November 22, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Katsushi YAMASHITA, Yui TAKAHASHI
  • RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20180312730
    Abstract: A resin composition for sealing of the present invention contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a compound (D) represented by Formula (1). In Formula (1), R1 represents a polar group or a hydrocarbon group. An electronic component device (10) of the present invention has an electronic component (11) and a sealing material (12) sealing the electronic component (11), in which the sealing material (12) is a cured substance of the resin composition for sealing.
    Type: Application
    Filed: April 30, 2015
    Publication date: November 1, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Masaru NAKAO, Hirofumi KURODA
  • Resin composition, coated particles, injection material and method for injecting injection material into fracture
    Patent number: 10106729
    Abstract: A resin composition is used for forming a surface layer coating at least a part of an outer surface of a particle. The particle is adapted to be packed into a fracture formed in a subterranean formation, and contains a thermosetting resin and a hydrophilic polymer. It is preferred that the resin composition further contains a surfactant. According to the present invention, it is possible to provide an effect of preventing pieces of core particles from being scattered due to the action of a thermo-setting resin and an effect of improving compatibility with respect to water (that is, fluid repellent with respect to hydrocarbon) due to the action of a hydrophilic polymer in a synergistic manner. This increases conductivity of packed spaces of a subterranean formation (that is, fractures of the subterranean formation) in which coated particles are packed.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: October 23, 2018
    Assignees: DUREZ CORPORATION, SUMITOMO BAKELITE CO., LTD.
    Inventors: James J. Rappolt, Michael Santorelli, Motoko Mori, Masakatsu Asami
  • Cover tape for packaging electronic part
    Patent number: 10099454
    Abstract: The object of the present invention is to provide a cover tape for packaging an electronic part which enables the reduction of the production time, and decreases the defective fraction due to the temperature variation of the sealing trowel, the present invention provides a cover tape for packaging an electronic part which includes a base layer and a sealant layer, and is closely adhered to a carrier tape, wherein the sealant layer is made of a resin composition; a main component in the resin composition has a melting point of 100° C. or less; a peeling strength A under fixed measurement conditions after heat-sealing to a polycarbonate sheet through the sealant layer at 220° C. for 0.015 seconds and a peeling strength C under the fixed measurement conditions after heat-sealing to a polycarbonate sheet through the sealant layer at 180° C. for 0.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: October 16, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Ryo Yamaguchi
  • Resin composition for encapsulating, manufacturing method of on-vehicle electronic control unit, and on-vehicle electronic control unit
    Patent number: 10079188
    Abstract: Provided is a resin composition for encapsulating which is used for forming an encapsulating resin of an on-vehicle electronic control unit including a wiring substrate, a plurality of electronic components mounted on the wiring substrate, and the encapsulating resin encapsulating the electronic component, the resin composition including: a thermosetting resin; and one or more imidazole compounds, in which when a torque value is measured over time under conditions of the number of rotations of 30 rpm and a measurement temperature of 175° C. by using Labo Plastomill, a time T1 at which the torque value is less than or equal to 2 times a minimum torque value is longer than or equal to 15 seconds and shorter than or equal to 100 seconds, and the minimum torque value is greater than or equal to 0.5 N·m and less than or equal to 2.5 N·m.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: September 18, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Naoki Tomida, Kazuhiko Dakede
  • METHOD, KIT AND DEVICE FOR PREPARING GLYCOPROTEIN SUGAR CHAIN
    Publication number: 20180245115
    Abstract: Provided is a method for preparing a glycoprotein sugar chain including: an isolation step of acting a sugar chain-isolating enzyme on a sample which contains a glycoprotein fixed to a solid phase in a container to obtain an isolated product which contains a sugar chain; and a labeling step of adding a labeling reagent to the isolated product in the container to obtain a labeled product which contains a labeled substance of the sugar chain.
    Type: Application
    Filed: September 27, 2016
    Publication date: August 30, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Masaaki TOYODA
  • Lignin resin composition, cured product, and molded product
    Patent number: 10059793
    Abstract: Provided is a lignin resin composition including a lignin derivative having a weight-average molecular weight of 500 or more and 4000 or less and a novolac-type phenolic resin having a weight-average molecular weight of 1000 or more and 3000 or less, in which the content of the lignin derivative is not higher than the content of the novolac-type phenolic resin. In particular, the cured product (molded product) of a lignin resin composition obtained by melt-mixing such a lignin resin composition, adding hexamethylenetetramine thereto and then heating the resulting mixture has a high bending strength. Such a lignin resin composition is utilizable as a thermosetting resin substituting a phenolic resin.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: August 28, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Hiroshige Nakagawa, Mitsutaka Matsumoto, Taketoshi Murai
  • THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
    Publication number: 20180208820
    Abstract: The thermal conductive resin composition of first embodiment includes an epoxy resin, a cyanate resin, and thermal conductive filler. It has a thermal conductivity at 25° C., and cracking does not occur when a specific flex resistance test is carried out. The thermal conductive resin composition of a second embodiment includes an epoxy resin, a thermal conductive filler, and silica nanoparticles. An average particle diameter D50 of the silica nanoparticles is equal to or more than 1 nm and equal to or less than 100 nm, a content of the silica nanoparticles is equal to or more than 0.3% by mass and equal to or less than 2.5% by mass with respect to 100% by mass of a total solid content of the thermal conductive resin composition. The thermal conductive filler includes secondary agglomerated particles constituted of primary particles of scale-like boron nitride.
    Type: Application
    Filed: July 20, 2016
    Publication date: July 26, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Mika Tsuda, Haruyuki Hatano, Kazuya Kitagawa, Keita Nagahashi
  • THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR BONDING HEATSINK
    Publication number: 20180194869
    Abstract: A thermally conductive composition of the present invention contains metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, wherein the metal particles (A) form a particle coupling structure by being sintered through a thermal treatment, the metal particles (A) have a particle size D50 at 50% in a volume-based cumulative distribution of equal to or greater than 0.8 ?m and equal to or smaller than 5 ?m, and the metal particles (A) have a standard deviation of the particle size of equal to or less than 2.0 ?m.
    Type: Application
    Filed: July 1, 2016
    Publication date: July 12, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Yasuo SHIMOBE, Ryuichi MURAYAMA, Keiichiro SAITOH
  • Fixing resin composition, rotor, automobile, and method of manufacturing rotor
    Patent number: 9997968
    Abstract: A solid fixing resin composition, which has excellent filling properties, and a rotor using the same are provided. The fixing resin composition is used to form a fixing member constituting a rotor which includes a rotor core (110) which has a laminate formed by lamination of a plurality of plate members, is fixed and installed on a rotating shaft, and has a plurality of hole portions (150) arranged along the peripheral portion of the rotating shaft, provided in the laminate; a magnet (120) inserted in the hole portion (150); and a fixing member (130) formed by curing a fixing resin composition, filled in the separation portion between the hole portion (150) and the magnet (120), the resin composition including a thermosetting resin (A) containing an epoxy resin; a curing agent (B); and an inorganic filler (C), in which the ICI viscosity at 150° C. of the epoxy resin is equal to or less than 3 poises.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: June 12, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Tetsuya Kitada
  • CELL CULTURE VESSEL PACKAGING BAG AND PACKAGE
    Publication number: 20180127702
    Abstract: It is an object of the invention to provide a cell culture vessel packaging bag that is capable of achieving both the reduction of the amount of adsorption of hydrogen peroxide to a cell culture vessel and the suppression of adverse effects of an oxidizing gas on cells or cell aggregates. Provided is a cell culture vessel packaging bag for including a cell culture vessel, the packaging bag being formed from two or more sheets of film arranged along the direction of gas permeation, in which the film is a laminated film including at least a base material layer in which at least one kind of micropores selected from through-holes and non-through-holes are formed, and a sealant layer, and the micropores are slit-shaped pores and are formed at a density of 1,000 to 10,000 per cm2 of the base material layer.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 10, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Ryohei Tsukada, Aiko Mizuno
  • Fixing resin composition for use in rotor
    Patent number: 9960646
    Abstract: The fixing resin composition for use in a rotor includes a thermosetting resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C), wherein the content of the inorganic filler (C) is equal to or more than 50% by mass, based on 100% by mass of the total content of the fixing resin composition.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: May 1, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Hideaki Sasajima
  • RESOL TYPE MODIFIED PHENOL RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND ADHESIVE
    Publication number: 20180079938
    Abstract: The resol type modified phenol resin composition contains a resol type modified phenol resin having a structural unit A by General Formula (1) which is modified by dimethylphenols and a structural unit B represented by General Formula (2). In Formula (1), m representing an integer of 1 or more, wherein in a case where m is 1, R represents a methylol group; in a case where m is 2 or more, R's independently represent a hydrogen atom or a methylol group, and at least one of R's is a methylol group. In Formula (2), n representing an integer of 1 or more, wherein in a case where n is 1, R represents a methylol group; in a case where n is 2 or more, R's independently represent a hydrogen atom or a methylol group, and at least one of R's is a methylol group.
    Type: Application
    Filed: March 31, 2016
    Publication date: March 22, 2018
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Hajime Mifuka
  • Sheath for gastrostoma, sheathed dilator, sheath for gastrostoma with insertion aid, gastrostomy catheter kit, and method of splitting sheath for gastrostoma
    Patent number: 9919135
    Abstract: The present invention provides a sheath for gastrostoma (1), a sheathed dilator, a gastrostomy catheter kit and a method of splitting a sheath for gastrostoma. The sheath for gastrostoma (1) includes a sheath body (11) in which a gastrostomy catheter (2) is inserted and a handle (12). The sheath for gastrostoma (1) lowers the insertion resistance of a gastrostomy catheter when inserted in a fistula before insertion of the gastrostomy catheter in the fistula for replacement in the patient's body. According to the invention, a sheath for gastrostoma, a sheathed dilator, a sheath for gastrostoma with insertion aid, a gastrostomy catheter kit and a method of splitting a sheath for gastrostoma which can lower the insertion resistance during placement of a catheter in the patient's body, facilitate air supply control of an endoscope and stabilize endoscopic visual field during surgery are provided.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: March 20, 2018
    Assignees: SUMITOMO BAKELITE CO., LTD.
    Inventors: Yutaka Suzuki, Hideaki Matsunami, Yukihiko Sakaguchi, Masao Ikeda, Tomokazu Nakayama, Keiji Kamada, Ryo Tanaka