Abstract: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

Abstract: The present invention provides a body fluid suction reservoir including a flexible bag, two plates for supporting the bag, and a spring put between the two plates. The body fluid suction reservoir further includes a lock having a hook and a release part and consisting of a member different from the two plates, by which lock the spring is held in a state compressed between the two plates, and the held state is releasable. The lock has flexibility and is held by one of the plates so as to be deformable from a first state in which the hook is engaged with the other plate to a second state in which the hook is not engaged, and the lock is urged to take the first state.

Abstract: A manufacturing apparatus is provided for manufacturing a tubular resin film of high quality and little thickness variations, which is stretched and given an orientation, and suitable as retardation film or the like. It comprises a stretching section (6) for stretching the tubular resin film (20), and a maintaining section (7) for maintaining a shape of said tubular resin film (20) stretched. Further, said stretching section (6) is arranged to apply a stretching force to said tubular resin film for longitudinally and/or circumferentially stretching said tubular resin film (20).

Abstract: It is a main object of the present invention to provide an alkylphenol resin for rubber compounding to obtain a rubber composition having high tackiness, and a rubber composition using the same. The present invention solves the above object by providing a resin for rubber compounding synthesized from a phenol having a para-substituted alkyl group having 1 to 18 carbon atoms and an aldehyde other than formaldehyde.

Abstract: An area mount type semiconductor device having high reliability when a semiconductor element is mounted on a surface with the use of a lead-free solder, and a die bonding resin composition and encapsulating resin composition used for the area mount type semiconductor device attainable by an area mount type semiconductor device mounting a semiconductor element or a stacked element comprising a substrate, and a semiconductor element mounted on a surface of the substrate via a die bonding resin composition, and substantially having only the surface of the substrate mounting the semiconductor element encapsulated with the use of an encapsulating resin composition, wherein an elastic modulus of a cured product of the die bonding resin composition at 260° C. is 1 MPa to 120 MPa, an elastic modulus of a cured product of the encapsulating resin composition at 260° C. is 400 MPa to 1,200 MPa, and a thermal expansion coefficient of the cured product of the encapsulating resin composition at 260° C. is 20 ppm to 50 ppm.

Abstract: A main object of the invention is to provide a polymer compound for medicine which has an excellent capability of fixing a biologically active substance and has such chemical/physical stability that the compound is less dissolved or deteriorated in a washing step, in particular, which can be suitably applied to a plastic substrate surface. The invention provides a polymer compound for medical material which is a polymer comprising repeating units derived from an ethylenically unsaturated polymerizable monomer (a) having a functional group for fixing a biologically active substance, wherein the polymer has a reactive functional group on at least one terminal side thereof, and a biochip substrate wherein a layer containing the polymer compound is formed on a substrate surface, thereby attaining the object.

Abstract: A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same.

Abstract: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—

Abstract: A resin composition which can be used to form a prepreg having sufficient flexibility to prevent cracking from occurring therein is provided. Further, a prepreg having sufficient flexibility to prevent cracking from occurring, a prepreg having excellent workability even in the case where the resin composition in the prepreg is in an uncured state, and a laminate provided with such a prepreg are also provided. The resin composition is used to form a sheet-shaped prepreg by impregnating a base material with the resin composition, and the composition comprises a first thermosetting resin, a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a base sheet material with the resin composition described above. The laminate is formed by laminating a metallic foil on the prepreg and then molding them by heating under pressure.

Abstract: In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.

Abstract: An apparatus for embossing a carrier tape by heating the tape at a heating portion and embossing the tape by heat molding at a molding portion while a long sheet of the tape made of a thermoplastic resin is intermittently transferred by pitch transfer, the apparatus comprising a temperature-maintaining portion having a length approximately corresponding to one pitch disposed between the heating portion and the molding portion; and a process for producing a carrier tape using the apparatus, the process comprising heating the tape at a heating portion, maintaining a temperature of the heated tape at a temperature-maintaining portion and embossing the tape by heat molding at a heat molding portion while a long sheet of the tape is intermittently transferred by pitch transfer. The length of the rib portion connecting embossed portions is decreased by contriving the heating method of the tape.

Abstract: The invention provides a positive-working photosensitive resin composition comprising an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device.

Abstract: A copolymer composition including a copolymer having repeat units of structural formula I: where X is selected from —CH2—, —CH2—CH2— and O; m is an integer from 0 to 5; and each occurrence of R1-R4 are independently selected from H; C1 to C25 linear, branched, and cyclic alkyl, aryl, aralkyl, alkaryl, alkenyl and alkynyl that can include one or more hetero atoms selected from O, N, and Si; a group that contains an epoxy functionality; —(CH2)nC(O)OR5; —(CH2)nC(O)OR; —(CH2)nOR6; —(CH2)nOC(O)R6; —(CH2)nC(O)R6; —(CH2)nOC(O)OR6; and any combination of two of R1, R2, R3, and R4 linked together by a linking group. A portion of the repeat units having structural formula I contain at least one epoxy functional pendant group. The copolymer composition can be included with a material that photonically forms a catalyst in a photodefinable dielectric composition, which can be used to form a photodefinable layer on a substrate.

Abstract: A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

Abstract: A copolymer composition including a copolymer having repeat units of structural formula I: where X is selected from —CH2—, —CH2—CH2— and O; m is an integer from 0 to 5; and each occurrence of R1–R4 are independently selected from H; C1 to C25 linear, branched, and cyclic alkyl, aryl, aralkyl, alkaryl, alkenyl and alkynyl that can include one or more hetero atoms selected from O, N, and Si; a group that contains an epoxy functionality; —(CH2)nC(O)OR5; —(CH2)nC(O)OR6; —(CH2)nOR6; —(CH2)nOC(O)R6; —(CH2)nC(O)R6; —(CH2)nOC(O)OR6; and any combination of two of R1, R2, R3, and R4 linked together by a linking group. A portion of the repeat units having structural formula I contain at least one epoxy functional pendant group. The copolymer composition can be included with a material that photonically forms a catalyst in a photodefinable dielectric composition, which can be used to form a photodefinable layer on a substrate.

Abstract: A novel aromatic carboxylic acid useful as a material for macromolecular compounds and, in particular, for polycondensed macromolecular compounds exhibiting excellent heat resistance, an acid halide derivative thereof and a process for producing these compounds are disclosed. The aromatic carboxylic acid and the acid halide derivative thereof have structures represented general formulae (1) and (2), respectively, and can be efficiently produced from a dialkyl ester derivative of isophthalic acid and an acetylene derivative in accordance with the disclosed process comprising specific steps. In the above formulae, A represents: —C?C—R1??(a) or (R1 represents hydrogen atom, an alkyl group or an aromatic group, R2 represents an alkyl group or an aromatic group) and X represents a halogen atom.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: The present invention provides a die-attaching paste superior in solder cracking resistance, used for bonding of semiconductor chips. The present invention lies in a die-attaching paste comprising as essential components: (A) a hydrocarbon having a number-average molecular weight of 500 to 5,000 and at least one double bond in the molecule, or its derivative, (B) a reactive diluent, (C) a radical polymerization catalyst, and (D) a filler.

Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.