Abstract: A wire harness is disposed across an interior area and an exterior area, and is connected to a connection target component in the exterior area. The wire harness includes: a water shut-off cable being disposed across a boundary between the interior area and the exterior area, and having inter-wire water shut-off property; and a non-water shut-off cable being connected to the water shut-off cable in the exterior area, and being connectable to the connection target component.

Abstract: Provided is a glass eccentricity measurement device which includes an irradiation unit that irradiates a side surface of a coated glass fiber obtained by coating the striated glass with light, and a light receiving unit that receives light scattered and/or refracted following irradiation of the side surface of the coated glass fiber therewith, and measures an eccentricity of the glass in the coated glass fiber by a pattern of brightness and darkness in the light received by the light receiving unit, in which three or more sets including the irradiation unit and a screen are provided around the coated glass fiber, and the sets are arranged respectively in directions having different angles on a circumference centered on the coated glass fiber.

Abstract: A composite cable includes a signal line part, a pair of power supply lines, and a sheath. The signal line part is composed of a first signal line and a second signal line twisted together. Each of the first signal line and the second signal line is composed of a pair of wires twisted together. The sheath covers an outer circumference of a wire bundle composed of the signal line part and a pair of power supply lines, the signal line part and the pair of power supply lines being twisted together. The signal line part is covered with a shield conductor formed of a braid composed of a plurality of conductive element wires braided together.

Abstract: A male connector 1 includes a housing 11 made of resin and to be fit to a female connector, a male terminal 12 made of metal, partially embedded in the housing 11, projecting forward in a connecting direction from the housing 11 and formed into a tubular shape, resin 12G being filled inside the male terminal, and a resin cap 13 configured to cover a tip of the male terminal 12 on a front side in the connecting direction. The male terminal 12 is provided with a communication opening 12F in a part embedded in the housing 11, the communication opening allowing communication between inside and outside of the male terminal 12, and a projection 12D is formed on an outer peripheral surface of the embedded part. The housing 11 is formed with a recess 12J configured to expose the projection 12D to outside.

Abstract: A shield terminal (T) includes inner conductors (52) connected to cores (62) of a shielded cable (60) and a dielectric (46) accommodates the inner conductors (52). A body (11) of an outer conductor (10) includes a tubular holding portion (14) that surrounds the dielectric (46) and a crimping portion (32) connected to a front of a shield layer (65) of the shielded cable (60). An upper member (35) of the outer conductor (10) is separate from the body (11) and with the body (11) surrounds the cores (62) over an entire periphery. A second hook (39) on a front part of the upper member (35) is lockable to a rear edge of the holding portion (14). A second guide means (29) guides the upper member (35) to a proper position while allowing the upper member (35) to swing with the second hook (39) as a fulcrum.

Abstract: A machining jig holds a workpiece with respect to a tool that partially removes an outer peripheral surface of the workpiece. The machining jig includes a first jig including an inner peripheral surface having a shape similar to a contour of the workpiece and an outer peripheral surface including a first inclined section inclined with respect to an axial direction of the workpiece; a second jig including an inner peripheral surface including a second inclined section configured to be fitted to the first inclined section; a base to which the second jig is coaxially fixed; and a sliding mechanism that enables a large-diameter portion of the first inclined section and a small-diameter portion of the second inclined section to move toward and away from each other.

Abstract: A semiconductor device has a semiconductor layer and a substrate. The semiconductor layer constitutes at least a part of a current path, and is made of silicon carbide. The substrate has a first surface supporting the semiconductor layer, and a second surface opposite to the first surface. Further, the substrate is made of silicon carbide having a 4H type single-crystal structure. Further, the substrate has a physical property in which a ratio of a peak strength in a wavelength of around 500 nm to a peak strength in a wavelength of around 390 nm is 0.1 or smaller in photoluminescence measurement. In this way, the semiconductor device is obtained to have a low on-resistance.

Abstract: A semiconductor integrated optical device includes: a supporting base including semi-insulating semiconductor; a first photoelectric convertor having first photodiode mesas; a second photoelectric convertor having second photodiode mesas; a first 90° optical hybrid having at least one first multimode waveguide mesa; a second 90° optical hybrid having at least one second multimode waveguide mesa; an optical divider mesa; first and second input waveguide mesas coupling the first and second 90° optical hybrids with the optical divider mesa, respectively; a conductive semiconductor region disposed on the supporting base, the conductive semiconductor region mounting the first photodiode mesas, the second photodiode mesas, the first multimode waveguide mesas, the second multimode waveguide mesas, and the optical divider mesa; a first island semiconductor mesa extending between the first and second multimode waveguide mesas; and a first groove extending through the first island semiconductor mesa and the conductive

Abstract: An optical connection component 1 includes an optical fiber 10 having a bent portion BA, and a fiber fixing part 20. The optical fiber 10 includes a glass fiber 11 and a resin coating 12. The fiber fixing part 20 includes an optical array member 24 and a protective resin 23. A distal end of the glass fiber 11 and an end surface of the optical array member 24 form a reference surface S. The bent portion BA is formed in a region including the exposed glass fiber 11. A predetermined section in a region C, which continues from the bent portion BA on a side opposite to an end portion of the optical fiber 10 supported by the fiber fixing part 20 with the bent portion BA interposed therebetween, is inclined to approach the reference surface S while going away from the bent portion BA.

Abstract: A terminal module M1 is to be accommodated into an outer housing 30, and includes male terminals 20 to be connected to ends of signal wires 11, a first terminal holding member 61 including accommodation recesses 78 for accommodating the terminals 20 inserted in a direction intersecting an extending direction of the terminals 20 with tip parts 21 of the terminals 20 projecting, and a second terminal holding member 65 to be assembled with the first terminal holding member 61. The second terminal holding member 65 is relatively movable toward ends of the signal wires 11 from a terminal tip protection position where the second terminal holding member 65 covers tip parts 21 of the terminals 20 projecting from the first terminal holding member 61.

Abstract: A shield connector includes a male shield terminal (20) mounted in a male housing (10), male inner conductors (37) constituting the male shield terminal (20) and to be connected to female inner conductors (78) by connecting both housings (10, 70), a male outer conductor (21) surrounding the male inner conductors (37) via a male dielectric (31) and configured to contact a female outer conductor (76) by connecting the both housings (10, 70), a tube (25) formed in the male outer conductor (21) and surrounding the female outer conductor (76) with the housings (10, 70) connected, and resilient contact pieces (26) formed in the male outer conductor (21) and to be resiliently connected to an outer periphery of the female outer conductor (76). The tube (25) is continuous over an entire periphery, thereby restricting an expanding deformation thereof.

Abstract: A process of depositing a silicon nitride (SiN) film on a nitride semiconductor layer is disclosed. The process includes steps of: (a) loading an epitaxial substrate including the nitride semiconductor layer into a reaction furnace at a first temperature and converting an atmosphere in the furnace into nitrogen (N2); (b) raising the temperature in the furnace to a second temperature while keeping pressure in the furnace at a first pressure higher than 30 kPa; (c) converting the atmosphere in the furnace to ammonia (NH3) at the second temperature; and (d) beginning the deposition by supplying SiH2Cl2 as a source gas for silicon (Si) at a second pressure lower than 100 Pa. A feature of the process is that a time span from when the temperature in the furnace reaches the critical temperature to the supply of SiH2Cl2 is shorter than 20 minutes, where the first pressure becomes the equilibrium pressure at the critical temperature.

Abstract: It is aimed to simplify the shape of a short-circuit means. A joint connector (A) includes a housing (10), a plurality of terminal fittings (35F, 35S, 35T) provided in the housing (10) and each formed such that a plurality of tabs (37F, 37D, 7R) are coupled by a terminal base portion (36), and a short-circuit module (40) provided in the housing (10) and formed by arranging a plurality of short-circuit plates (42) side by side in a length direction of the tabs (37F, 37D, 37R). The short-circuit plate (42) is formed with a plurality of conduction holes (45) for allowing the tabs (37F, 37D, 37R) to pass therethrough in a contact state and non-contact holes (44) for allowing the tabs (37F, 37D, 37R) to pass therethrough in a non-contact state, and an arrangement of the plurality of conduction holes (45) differs among the plurality of short-circuit plates (42).

Abstract: Provided is a method for manufacturing a single-crystal diamond, the method including the steps of: forming a protective film on at least a part of a surface of an auxiliary plate; preparing a diamond seed crystal substrate; disposing an auxiliary plate with a protective film that has the protective film formed on the auxiliary plate, and a diamond seed crystal substrate in a chamber; and growing a single-crystal diamond on a principal surface of the diamond seed crystal substrate by a chemical vapor deposition method while introducing a carbon-containing gas into the chamber.

Abstract: The polycrystalline cubic boron nitride contains a cubic boron nitride at a content greater than or equal to 98.5% by volume, and has an area rate S1 of crystal grains, the crystal grains having an equivalent circle diameter greater than or equal to 1 ?m, less than or equal to 20 area % at a cross section of the polycrystalline cubic boron nitride as observed with a scanning electron microscope at a magnification of 10,000.

Abstract: A communication cable that includes a twisted wire pair that includes a pair of insulated wires that are twisted together and that each include a conductor and an insulating covering that covers an outer periphery of the conductor; and a sheath that is made of an insulating material and continuously covers an entire outer periphery of the twisted wire pair about a center along a longitudinal axis of the twisted wire pair, wherein the sheath has a dielectric loss tangent of 0.0001 or more in a frequency range of 1 to 50 MHz.

Abstract: An optical fiber preform including a glass material and a refractive index adjusting additive is disclosed. This preform has striae due to difference in concentration of the additive and the striae have concentric refractive index periodicity in at least a part thereof from a radial center of the preform to an outer periphery thereof. The respective striae pitches each indicating a period of the refractive index periodicity increase from the center of the preform to the outer periphery thereof.

Abstract: A porous metal body has a three-dimensional mesh-like structure skeleton and containing at least nickel and tin. The nickel content is 50 mass % or more, and the tin content is 5 mass % or more and 25 mass % or less. The porous metal body has a thickness of 0.10 mm or more and 0.50 mm or less.