Abstract: An optical module according to an aspect of the present disclosure includes a substrate having a base plane, an optical circuit element having an optical waveguide and a reflector, a support member, a photo detector mounted on the base plane, the photo detector including a condenser lens and a light-receiving layer. The light beam travels along an optical path from the reflector to the tangent plane, the optical path having a shortest distance set to be smaller than a preset value, and as viewed from a direction perpendicular to the base plane, the light beam has an optical axis set apart from the top of the condenser lens by an offset distance.

Abstract: A driving circuit includes a first differential amplifier, wherein the first differential amplifier includes: a delay adjustment circuit that generates a second differential signal by delaying a first differential signal in response to instantaneous voltage level of the first differential signal; a differential circuit that divides a source current into a first current and a second current in response to the second differential signal; and a first load resistor and a second load resistor that generate a positive phase component and a negative phase component of the differential output signal based on the first current and the second current, wherein a third differential amplifier operates in a non-saturated region when a voltage level of the first differential signal is in an input voltage range, and operates in a saturated region when the voltage level of the first differential signal is out of the input voltage range.

Abstract: A fixing structure of a vehicle non-electrical wiring member includes: a plate-like member including a first layer and a second layer softer than the first layer; a vehicle non-electrical wiring member mounted on a vehicle together with the plate-like member; and a fixing member attached to the vehicle non-electrical wiring member to fix the vehicle non-electrical wiring member to the plate-like member. The fixing member includes: a through locking piece formed to be able to pass through the first layer and locked to the first layer while passing through the first layer; a regulation piece provided with a space between the regulation piece and the through locking piece to stop the through locking piece from passing through a surface of the plate-like member; and a column connecting the through locking piece and the regulation piece.

Abstract: A method of controlling an optical transmitter comprising a determining step, a dividing step and a determining step. In the determining step, a full range of an optical signal output from a light-generating device is determined by setting an upper and a lower limit thereof by keeping power of a continuous wave (CW) light constant and varying an electrical driving signal, the optical signal having 2n optical levels where n is an integer. In the dividing step, the full range of the optical signal is divided into sub-ranges each between the neighbor optical levels including the upper limit and the lower limit of the full range, the sub-ranges having preset ratios. In the determining step, electrical levels of the electrical driving signal are determined based on a non-linear transfer characteristic of the light-generating device between the electrical driving signal supplied thereto and the optical signal output therefrom.

Abstract: A device of manufacturing a silicon carbide single crystal includes a crucible, a first resistive heater, a second resistive heater, and a first support portion. The crucible has a top surface, a bottom surface opposite to the top surface, and a tubular side surface located between the top surface and the bottom surface. The first resistive heater is disposed to face the bottom surface. The second resistive heater is provided to surround the side surface. The first support portion supports the crucible such that the bottom surface is separated from the first resistive heater, and the side surface is separated from the second resistive heater. The first support portion is in contact with at least one of the top surface and the side surface.

Abstract: Provided is a technique that improves the heat dissipation properties of a wire that is arranged in a conduction path. A conduction path has a wire, a routing member that is made of a metal and has a routing groove in which the wire is routed, a bracket that is made of a metal and has a first mounting portion that is mounted to the routing member and has a second mounting portion that is mounted to an electrical connection box, and a heat transfer member that is made of a synthetic resin having a higher heat conductivity than air and is arranged in the routing groove and interposed between the wire and the routing member, in a region that corresponds to a portion of the routing member to which the first mounting portion is mounted.

Abstract: Provided is a wiring module with which there is no risk that a connector will interfere with other components in a state in which the connector is not connected to an external device. A wiring module to be attached to a power storage element group in which a plurality of power storage elements are lined up includes a bus bar for electrically connecting the plurality of power storage elements together, an insulating protector that accommodates the bus bar and is to be mounted onto the power storage element group, a wire that extends from the bus bar to the outside of the insulating protector, a connector that is provided at an extending end portion of the wire, the extending end portion extending from the insulating protector, and a connector holder that is provided in the insulating protector and detachably holds the connector.

Abstract: A wiring module comprising: a detection wire that has a core wire and an insulating coating covering the core wire and that detects a state of a power storage element, a bus bar, and a wire connection portion formed on the end portion of the bus bar and to which the end portion of the detection wire is connected. The wire connection portion includes a core wire connection portion to which the core wire of the detection wire is connected. The core wire connection portion includes a first core wire connection portion for drawing out the detection wire in one direction and a second core wire connection portion for drawing out the detection wire in another direction that is different from the one direction.

Abstract: An optical fiber preform includes a silica-glass core portion, and a cladding portion surrounding the core portion, the cladding portion being composed of a fluorine-containing silica glass having a lower refractive index than the core portion, the core portion including a first region that does not include the central axis thereof, the first region containing a first dopant selected from sodium, potassium, and compounds thereof, and a second region that includes the central axis, the second region containing a second dopant that reduces the viscosity of the silica glass, the second dopant having a diffusion coefficient of 1×10?12 cm2/s or more and less than the first dopant at 2,000° C. to 2,300° C., in which the entire core portion has an average first dopant concentration of 10 atomic ppm or more and 2,000 atomic ppm or less and an average second dopant concentration of 10 atomic ppm or more.

Abstract: A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60° or a branched portion having an angle of greater than or equal to 60° in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line.

Abstract: A crimp terminal may include: a receiving portion that is to receive conductor portions of electrical wires and has an end portion from which the electrical wires are to be lead out; a pair of first barrel portions that are connected to the receiving portion and compress the conductor portions along with the receiving portion; a bend portion that extends from an end portion of the receiving portion and is bent so as to be folded over; and an overlap portion that is connected to the bend portion and overlaps the receiving portion.

Abstract: A package for an optical receiver module is disclosed. The package includes a housing having electrically conductive walls including a rear and a pair of side walls, and a feed-through provided in the rear wall. The feed-through includes an internal portion, and an external portion protruding from the internal portion. The internal portion has a top face and a back face, the top face including ground lines, the back face including transmission lines with signal lines and ground lines.

Abstract: A shielded flat cable includes conductors arranged parallel to each other and respectively having a first surface and a second surface opposite to the first surface, a first insulator provided on the first surface of each of the conductors, and a second insulator provided on the second surface of each of the conductors. The first surface of each of the conductors includes an exposed surface at an end part along a longitudinal direction. The shielded flat cable further includes a shield member that includes a metal layer and is configured to cover the first insulator and a portion of the exposed surface of the first surface, via a resin layer.

Abstract: A spot-size converter includes: a support body that includes a main surface including a first to a fifth areas; a mesa structure that includes a first part on the first area and includes a second part on the second to the fourth areas; and an embedding structure that includes a first region and a second region in which a first and a second side-surfaces of the second part of the mesa structure are respectively embedded. The second part of the mesa structure includes a portion that has a width gradually decreasing in a direction from the third area toward the fifth area. The first region of the embedding structure extends along the first side-surface and terminates at one of the third and the fourth areas. The second region of the embedding structure extends along the second side-surface of the second part and is disposed on the fifth area.

Abstract: The present invention relates to an oxide sintered material that can be used suitably as a sputtering target for forming an oxide semiconductor film using a sputtering method, a method of producing the oxide sintered material, a sputtering target including the oxide sintered material, and a method of producing a semiconductor device 10 including an oxide semiconductor film 14 formed using the oxide sintered material.

Abstract: An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.

Abstract: A cutting tool holder according to one embodiment supports a cutting insert including a rake face, a flank face, and a cutting edge. The cutting tool holder according to one embodiment includes: a holder body having a seat face on which the cutting insert is placed; a pressing member that positions and fixes the cutting insert to the holder body; and a fixing member that fixes the pressing member to the holder body. The pressing member has: a front end portion close to the cutting edge; and a base end portion distant away from the cutting edge. The front end portion is provided with a first coolant ejection hole. A first flow path is provided inside the holder body. A coolant reservoir and a second flow path are provided inside the pressing member.

Abstract: An MIM capacitor of a semiconductor device is configured to include a dielectric layer between a lower electrode and an upper electrode, and a floating electrode provided in the dielectric layer, extended in parallel to the upper electrode and the lower electrode, and not electrically connected from any one of the lower electrode and the upper electrode is included.

Abstract: The present invention relates to an oxide sintered material that can be used suitably as a sputtering target for forming an oxide semiconductor film using a sputtering method, a method of producing the oxide sintered material, a sputtering target including the oxide sintered material, and a method of producing a semiconductor device 10 including an oxide semiconductor film 14 formed using the oxide sintered material.