Patents Assigned to Sumitomo Seika Chemicals Co., Ltd.
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Publication number: 20230128897Abstract: Provided is copper foil with a resin layer, the resin layer having excellent adhesion, the copper foil exhibiting low dielectric characteristics, which is suitable for high-frequency applications, the copper foil being capable of exhibiting excellent characteristics of reducing transmission loss. More specifically, a laminate of copper foil and an epoxy resin composition layer is provided, the epoxy resin composition layer being present on at least one surface of the foil, the epoxy resin composition containing an epoxy resin and an acid-modified polyolefin, wherein a test piece composed of the laminate and a prepreg has 90-degree peel strength between the copper foil and the prepreg of 0.6 N/mm or more as measured in accordance with JISC6481, and has a reduction rate of the 90-degree peel strength between the copper foil and the prepreg of 20% or less after immersion of the test piece in boiling water for 2 hours.Type: ApplicationFiled: January 6, 2021Publication date: April 27, 2023Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventor: Ryota HARISAKI
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Publication number: 20230120487Abstract: Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).Type: ApplicationFiled: January 6, 2021Publication date: April 20, 2023Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventor: Ryota HARISAKI
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Patent number: 11629270Abstract: An object of the present invention is to provide an improved partial discharge-resistant electrical insulating resin composition that can inhibit deterioration of an insulator due to partial discharge. The partial discharge-resistant electrical insulating resin composition of the present invention comprises boehmite alumina and a resin.Type: GrantFiled: July 7, 2016Date of Patent: April 18, 2023Assignees: Sumitomo Seika Chemicals Co., Ltd., National Institute of Advanced Industrial Science and Technology, Shizuoka Institute of Science and TechnologyInventors: Noriyuki Hayashizaka, Kazunori Kawasaki, Masayuki Yamashita, Takeo Ebina, Takahiro Ishida, Satomi Hattori
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Publication number: 20230090751Abstract: Provided is an industrially advantageous method for producing an alkanedisulfonic acid compound easily and inexpensively with a high yield. The present invention is a method for producing an alkanedisulfonic acid compound comprising reacting at least one alkanesulfonic acid compound having a specific structure and at least one complex having a Lewis base and sulfur trioxide to thereby obtain an alkanedisulfonic acid compound. According to the production method of the present invention, it is possible to produce an alkanedisulfonic acid compound easily and inexpensively with a high yield, which is industrially advantageous.Type: ApplicationFiled: February 8, 2021Publication date: March 23, 2023Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Hirotake MORIYAMA, Yusaku MASUHARA
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Publication number: 20230088981Abstract: The invention provides a production method that is capable of obtaining a polyalkylene oxide having high whiteness by a simple method, and a polyalkylene oxide.Type: ApplicationFiled: September 14, 2022Publication date: March 23, 2023Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Akira KIMURA, Yuika IMAMURA
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Publication number: 20230082443Abstract: The present invention provides a production method for obtaining, by a simple method, a polyalkylene oxide whose molecular weight and polydispersity are controlled in the desired range. The method for producing a polyalkylene oxide of the present disclosure comprises step 1 of performing a polymerization reaction of an alkylene oxide in the presence or absence of a chain transfer agent to obtain a high-molecular-weight polyalkylene oxide; and step 2 of irradiating the high-molecular-weight polyalkylene oxide obtained in step 1 with radiation to obtain a polyalkylene oxide; wherein the amount of the chain transfer agent when used is less than 300 mass ppm relative to the alkylene oxide, and the high-molecular-weight polyalkylene oxide has a viscosity in a 1 mass % aqueous solution of 7500 mPa·s or more.Type: ApplicationFiled: September 14, 2022Publication date: March 16, 2023Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Yuika IMAMURA, Akira KIMURA
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Publication number: 20230079192Abstract: The present invention provides a production method for obtaining, by a simple method, a polyalkylene oxide whose molecular weight and polydispersity are controlled in the desired range. The method for producing a polyalkylene oxide of the present disclosure comprises step 1 of performing a polymerization reaction of an alkylene oxide in the presence of a chain transfer agent to obtain a high-molecular-weight polyalkylene oxide; and step 2 of irradiating the high-molecular-weight polyalkylene oxide obtained in step 1 with radiation to obtain a polyalkylene oxide; wherein the amount of the chain transfer agent is 800 mass ppm or more relative to the alkylene oxide, and the high-molecular-weight polyalkylene oxide has a viscosity in a 1 mass % aqueous solution of 6000 mPas or less.Type: ApplicationFiled: September 14, 2022Publication date: March 16, 2023Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Yuika IMAMURA, Akira KIMURA
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Patent number: 11603466Abstract: Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.Type: GrantFiled: January 9, 2018Date of Patent: March 14, 2023Assignee: SUMITOMO SEIKA CHEMICALS CO.. LTD.Inventors: Noriaki Fukuda, Ryota Harisaki, Katsumasa Yamamoto
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Patent number: 11576929Abstract: This invention provides a more efficient means for treating inflammatory gastrointestinal diseases using CO. More specifically, the invention provides a composition for preventing and/or treating inflammatory gastrointestinal diseases, the composition comprising carbon monoxide and a solvent, the CO concentration being 800 ?M or more.Type: GrantFiled: May 16, 2019Date of Patent: February 14, 2023Assignees: SUMITOMO SEIKA CHEMICALS CO., LTD., KYOTO PREFECTURAL PUBLIC UNIVERSITY CORPORATIONInventors: Tomohisa Takagi, Yuji Naito, Katsura Miura, Shigeki Sakaue
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Patent number: 11542418Abstract: There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.Type: GrantFiled: September 12, 2018Date of Patent: January 3, 2023Assignee: Sumitomo Seika Chemicals Co., Ltd.Inventors: Kairi Kakutaka, Noriaki Fukuda, Yuhei Funabiki
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Publication number: 20220387333Abstract: The present disclosure provides a method for producing an electrolyte solution which can contain a high concentration of microbubbles, and a method for producing a microbubble-containing solvent which can be used for preparing the electrolyte solution, by suppressing decrease in microbubbles during filtration.Type: ApplicationFiled: August 24, 2020Publication date: December 8, 2022Applicants: Aichi Medical University, Sumitomo Seika Chemicals Co., Ltd.Inventors: Naoyuki Hatayama, Munekazu Naito, Shuichi Hirai, Kaori Fukushige, Shigeki Sakaue
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Patent number: 11504695Abstract: Provided is a water-absorbent resin which is capable of giving an absorbent material improved gel-shape stability and which has excellent water-absorption capacity. A water-absorbent resin of the present invention is a polymer of a water-soluble ethylenically unsaturated monomer, and has the following properties (1) and (2): (1) A disintegration amount at 20-fold swelling is 30% by mass or less; and (2) a solubility in physiological saline is 25% by mass or less. (Determination Method for Disintegration Amount at 20-Fold Swelling) 5 g of the water-absorbent resin is added to 100 g of physiological saline to allow the water-absorbent resin to absorb the physiological saline, thereby obtaining a gel. The obtained gel is divided approximately equally into five portions, and these portions are introduced respectively into cylindrical molds having a length of 3.6 cm and a radius of 2.8 cm and molded. The masses of the five molded cylindrical gels are measured.Type: GrantFiled: March 22, 2018Date of Patent: November 22, 2022Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Kenta Kumazawa, Tetsuhiro Hinayama, Yohei Yamamoto
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Patent number: 11465125Abstract: A water-absorbing resin that exhibits excellent absorption performance and a high permeation rate with respect to liquids to be absorbed, and that effectively reduces liquid leakages, even in an absorbent body using a large amount of the water-absorbing resin. The water-absorbing resin is formed from a polymer of a water-soluble ethylenically unsaturated monomer, and when a cross-sectional image of the water-absorbing resin obtained by X-ray computer tomography is observed, the percent area of cavity portions in the cross-sectional image is 2-10%. The liquid flow rate index when a physiological saline liquid column flow rate test is performed on the water-absorbent resin having a particle diameter of 250 to 500 ?m at 37° C. is 5-20.Type: GrantFiled: March 2, 2018Date of Patent: October 11, 2022Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Mikito Chiba, Yuichi Onoda
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Patent number: 11420184Abstract: Disclosed are water-absorbent resin particles comprising a crosslinked polymer comprising a monomer unit derived from a water-soluble ethylenically unsaturated monomer, wherein an artificial menstrual blood volume increase rate as measured in an artificial menstrual blood swelling test conducted in the order of i), ii), and iii) is 70% or more. i) putting 1.0 g of water-absorbent resin particles into a measuring cylinder with an inner diameter of 27 mm. ii) injecting 10 ml of artificial menstrual blood into the cylinder at once to swell the water-absorbent resin particles. iii) measuring a volume (A) of the swollen water-absorbent resin particles after 60 seconds from the injection and calculating an artificial menstrual blood volume increase rate according to Equation (I) below. Artificial menstrual blood volume increase rate (%)=(A?B)/B×100 . . . (I), A . . . Volume (ml) of swollen water-absorbent resin particles, B . . . Volume (ml) of injected artificial menstrual blood.Type: GrantFiled: March 28, 2018Date of Patent: August 23, 2022Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Hiroki Yabuguchi, Hiromi Miyashita, Hideki Yokoyama
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Publication number: 20220257507Abstract: Provided is a viscous composition that does not lose its ease of handling even after long-term storage and is easily returned to a uniform composition even if layer separation occurs, despite containing a high concentration of a partially neutralized product of a polymer containing ethylenically unsaturated carboxylic acid units. More specifically, provided is a viscous composition comprising (A) 10 to 40 mass % of a partially neutralized product of a polymer containing ethylenically unsaturated carboxylic acid units, (B) 0 to 50 mass %, of glycerol, (C) 5 to 65 mass % of a dihydric alcohol, and (D) 0 to 20 mass % of water, the total of the components (B) and (C) being 40 mass % or more, the mass ratio of the total of the components (B) and (C) to the component (A), ((B)+(C))/(A), being 1.5 or more.Type: ApplicationFiled: April 17, 2020Publication date: August 18, 2022Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventor: Chiaki UEZUMI
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Publication number: 20220251060Abstract: Provided is a novel production method capable of easily producing a cyclic disulfonic acid ester compound. This method for producing a cyclic disulfonic acid ester compound comprises reacting a specific sulfonic acid compound with a specific sulfuric acid ester compound.Type: ApplicationFiled: July 22, 2020Publication date: August 11, 2022Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Seiji BANDO, Hirotake MORIYAMA, Seiya ASHIBE
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Publication number: 20220251365Abstract: Provided is a viscous emulsion composition that contains a relatively high concentration of a carboxyl-group-containing water-soluble copolymer but is not so viscous as to lose handleability.Type: ApplicationFiled: June 12, 2020Publication date: August 11, 2022Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventor: Hirofumi YAMAGUCHI
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Publication number: 20220251059Abstract: Provided is a novel production method capable of easily producing a methylene disulfonate compound. The method for producing a methylene disulfonate compound comprises reacting a specific sulfonic acid compound with a formaldehyde compound in the presence of sulfur trioxide.Type: ApplicationFiled: July 22, 2020Publication date: August 11, 2022Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Seiya ASHIBE, Seiji BANDO, Yusaku MASUHARA
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Patent number: 11406785Abstract: An aspect of the present invention is a gas product including: a gas container; and a gas composition filled in the gas container, in which the gas composition includes nitrogen monoxide, hydrogen, and an inert gas, and a concentration of the nitrogen monoxide is 20% by volume or less based on a volume of the gas composition.Type: GrantFiled: March 4, 2020Date of Patent: August 9, 2022Assignees: SUMITOMO SEIKA CHEMICALS CO., LTD., THE KITASATO INSTITUTEInventors: Masaaki Yamada, Ichiro Misawa, Hirosuke Kobayashi, Kenichi Kokubo
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Publication number: 20220243001Abstract: Provided is an epoxy resin composition that gives a cured product having excellent adhesion to metal and low dielectric characteristics, and that has good workability during use and high storage stability. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a specific phenol-based curing agent.Type: ApplicationFiled: June 15, 2020Publication date: August 4, 2022Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Ryota HARISAKI, Katsumasa YAMAMOTO