Patents Assigned to Sumitomo Seika Chemicals Co., Ltd.
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Publication number: 20210380767Abstract: Provided are a gelled composition containing a thickening agent homogeneously dissolved in a polyhydric alcohol and a method for producing it. The gelled composition contains a polymer containing an ethylenically unsaturated carboxylic acid unit and an anhydrous polyhydric alcohol. The polymer is a partially neutralized product that has a degree of neutralization of 20 to 75%, and the polymer is dissolved in the alcohol. The method for producing the composition includes a first step of preparing a dispersion of a polymer containing an ethylenically unsaturated carboxylic acid unit in an anhydrous polyhydric alcohol, and a second step of mixing the dispersion with an anhydrous polyhydric alcohol to prepare a solution of the polymer in the alcohol. The polymer for use in the first step is a partially neutralized product that has a degree of neutralization of 20 to 75%, and is in the form of spherical particles.Type: ApplicationFiled: October 24, 2019Publication date: December 9, 2021Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Makiko MIYAMOTO, Hirofumi YAMAGUCHI
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Patent number: 11193899Abstract: Provided is a non-destructive method for evaluating the structure of a water-absorbing resin which can be advantageously used for controlling various properties of the water-absorbing resin. This non-destructive method for evaluating the structure of a water-absorbing resin involves non-destructively evaluating the structure of a water-absorbing resin through an X-ray computer tomographic technique, wherein the method comprises a step 1 for installing the water-absorbing resin to be evaluated on a test piece stage of an X-ray computer tomography device, a step 2 for performing X-ray computer tomography on the water-absorbing resin using the X-ray computer tomography device and acquiring tomographic image data of the water-absorbing resin, and a step 3 for analyzing the tomographic image data using image analysis software and obtaining a tomographic image of the water-absorbing resin.Type: GrantFiled: March 2, 2018Date of Patent: December 7, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Mikito Chiba, Yuichi Onoda
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Patent number: 11142611Abstract: An aliphatic polycarbonate resin for forming a partition containing a constituent unit represented by the formula (1): wherein R1, R2, R3, and R4 are each independently a hydrogen atom, an alkyl group having one or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; at least one of R1, R2, R3, and R4 is an alkyl group having two or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; and R1, R2, R3, and R4 may be the same or different; and the aliphatic polycarbonate resin has a contact angle against water of 75° or more. Also disclosed is a partition material including the aliphatic polycarbonate resin, a substrate, a method of producing the substrate, a method for producing a wiring substrate, and a wiring forming method.Type: GrantFiled: April 5, 2017Date of Patent: October 12, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Kiyoshi Nishioka, Hideyuki Takeda
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Patent number: 11136420Abstract: Provided is a method of producing a water-absorbent resin comprising a step of polymerizing a water-soluble ethylenically unsaturated monomer in the presence of an internal-crosslinking agent, and a step of performing post-crosslinking, wherein: the step of polymerizing comprises one or more polymerization steps; all the polymerization steps are performed in the presence of both one or more azo based compounds and peroxides so that the both are coexistent in the all steps; in each polymerization step, a proportion of the azo compounds is 40-95 mass % relative to an amount of the azo compounds and the peroxides; the water-absorbent resin has a water-absorption capacity of physiological saline under a load of 4.14 kPa at 120 minutes passed from the start of water absorption of 20 ml/g or more; and the degree of swelling under a load at 30 minutes is 70%.Type: GrantFiled: February 28, 2020Date of Patent: October 5, 2021Assignee: Sumitomo Seika Chemicals Co. Ltd.Inventors: Tetsuhiro Hinayama, Masahiro Murakami, Hiroki Yabuguchi, Hideki Yokoyama
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Publication number: 20210301090Abstract: A masterbatch is disclosed including a sulfide compound (A) and silica (B). The sulfide compound (A) is a chain or cyclic compound of repeating units represented by R—Sx??(I) where R represents a linear, branched or cyclic alkylene group having 1 to 12 carbon atoms; a linear, branched or cyclic (poly)oxyalkylene group having 1 to 12 carbon atoms; or a linear, branched or cyclic (poly)thioalkylene group having 1 to 12 carbon atoms (wherein the alkylene group, the (poly)oxyalkylene group and the (poly)thioalkylene group are unsubstituted or have 1 or more optional substituents), and x represents an integer from 1 to 8. The number of the repeating units n is 1 to 400 and each of n repeating units is the same or different from each other. The silica (B) satisfies following conditions that: BET specific surface area is 0.1 to 200 m2/g and DBP oil absorption is 50 to 300 ml/100 g.Type: ApplicationFiled: October 20, 2017Publication date: September 30, 2021Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Shinya Murakami, Kaede Kawasaki
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Patent number: 11133191Abstract: The etching mask 80 for screen printing according to one embodiment of the present invention includes aliphatic polycarbonate. Further, the method of producing an oxide layer (the channel 44) according to one embodiment of the present invention includes: an etching-mask forming step of forming a pattern of the etching mask 80 including aliphatic polycarbonate; a contact step of, after the etching-mask forming step, contacting the oxide layer with a solution for dissolving a portion of the oxide layer (the channel 44) which is not protected by the etching mask 80; and a heating step of, after the contact step, heating the oxide layer (the channel 44) and the etching mask 80 to or above a temperature at which the etching mask 80 is decomposed.Type: GrantFiled: September 27, 2019Date of Patent: September 28, 2021Assignees: JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Satoshi Inoue, Tatsuya Shimoda, Kazuhiro Fukada, Kiyoshi Nishioka, Nobutaka Fujimoto, Masahiro Suzuki
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Publication number: 20210284820Abstract: An aqueous solution and an aqueous dispersion of a composition that contains a polyalkylene oxide, a phenolic antioxidant and a sulfur-containing amine compound are less likely to impair the stability of the polyalkylene oxide even in the case of containing an alkali. In the above composition, the content of each of the phenolic antioxidant and the sulfur-containing amine compound is preferably set to 0.001 to 5 pasts by mass based on 100 parts by mass of the polyalkylene oxide, and the ratio of the sulfur-containing amine compound relative to 100 parts by mass of the phenolic antioxidant is preferably set to 20 to 200 pasts by mass.Type: ApplicationFiled: May 28, 2021Publication date: September 16, 2021Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Noboru YAMAGUCHI, Toru IDO, Amina TASHIRO
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Publication number: 20210288326Abstract: Provided are a lithium ion secondary battery in which heat generation is suppressed when the battery is internally short-circuited by an external impact, such as nail penetration or collapse, or short-circuited by foreign matter contamination or the like; and an electrical appliance using the battery. More specifically, the following lithium ion secondary battery and electrical appliance comprising the lithium ion secondary battery are provided.Type: ApplicationFiled: October 11, 2017Publication date: September 16, 2021Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Yuta IKEUCHI, Taichi SAKAMOTO, Takashi MUKAI, Masahiro YANAGIDA, Junichi FUJISHIGE, Masako KINNO, Erina TAKAHASHI
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Patent number: 11117111Abstract: An apparatus for producing water-absorbing resin particles for which surface cross-linking treatment is conducted, the surface cross-linking treatment being conducted by spraying a surface cross-linking agent to a water-absorbing resin particle precursor and heating the agent and the precursor, the apparatus includes a treatment container in which the surface cross-linking treatment is conducted, a stirring device including a stirring member disposed in the treatment container, a heating device that heats an inside of the treatment container; and a spray nozzle disposed in the treatment container, the spray nozzle spraying into the treatment container the surface cross-linking agent supplied from a surface cross-linking agent supply source in an exterior of the treatment container through a supply pipe. In a flow path in the spray nozzle spanning from an entrance of the spray nozzle to a spray exit, a point whose opening cross-section is smallest in a flow path through which a fluid passes is the spray exit.Type: GrantFiled: June 23, 2020Date of Patent: September 14, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Masato Kotake, Tetsuya Takechi, Hideo Kazama
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Publication number: 20210277281Abstract: A polishing means is provided that can improve the flatness of a substrate without significantly reducing the polishing speed. More specifically, a polishing composition is provided which includes inorganic particles, water, and a modified polyalkylene oxide represented by formula (1): wherein each R1 is independently a group represented by R11—(O—R12)x—, where each R11 is independently a C1-24 alkyl group, each R12 is independently a C2-4 alkylene group, and x is an integer of 0 to 500; each R2 is independently a hydrocarbon group; each R3 is independently a C2-4 alkylene group; n is an integer of 1 to 1000, and m is an integer of 1 or more.Type: ApplicationFiled: July 1, 2019Publication date: September 9, 2021Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Tsuyoshi MASUDA, Hideaki NISHIGUCHI
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Publication number: 20210277282Abstract: Provided is a polishing means that can improve the flatness of a substrate without significantly reducing the polishing speed. More specifically, provided is a polishing composition comprising inorganic particles, water, and a water-soluble polymer, wherein (i) a 1 mass (wt/wt) % aqueous solution of the water-soluble polymer has a normal stress (N) of 1 or more at a shear rate of 10000 (1/S), or (ii) a 0.25 mass (wt/wt) % aqueous solution of the water-soluble polymer has a normal stress (N) of 1 or more at a shear rate of 10000 (1/S).Type: ApplicationFiled: July 1, 2019Publication date: September 9, 2021Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Tsuyoshi MASUDA, Hideaki NISHIGUCHI
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Patent number: 11111382Abstract: Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.Type: GrantFiled: January 9, 2018Date of Patent: September 7, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Noriaki Fukuda, Ryota Harisaki, Katsumasa Yamamoto
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Patent number: 11096961Abstract: To provide a gaseous pharmaceutical composition for suppressing spinal cord ischemic disorder, comprising carbon dioxide.Type: GrantFiled: April 1, 2020Date of Patent: August 24, 2021Assignees: SUMITOMO SEIKA CHEMICALS CO., LTD., Kotaro KidaInventor: Kotaro Kida
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Patent number: 11091627Abstract: Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.Type: GrantFiled: January 9, 2018Date of Patent: August 17, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Noriaki Fukuda, Ryota Harisaki, Katsumasa Yamamoto
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Patent number: 11084915Abstract: Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.Type: GrantFiled: December 26, 2016Date of Patent: August 10, 2021Assignees: Sumitomo Seika Chemicals Co., Ltd., Osaka Research Institute of Industrial Science and TechnologyInventors: Kiyoshi Nishioka, Hiroki Maeda, Kei Ishikura, Kimihiro Matsukawa, Yukiyasu Kashiwagi, Masashi Saitoh
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Patent number: 11084902Abstract: Provided is an aliphatic polycarbonate resin having excellent water repellency. Also provided are a partition material, a substrate and a method for producing the same, a method for producing a wiring substrate, and a wiring forming method. The aliphatic polycarbonate resin of the present invention comprises a structural unit represented by the following formula (1): wherein R1, R2, and R3 are each independently a hydrogen atom, a C1-C10 alkyl group, or a C6-C20 aryl group; X is a substituent having a fluorine atom; and R1, R2, and R3 may be the same or different; and the aliphatic polycarbonate resin has a contact angle against water of 90° or more.Type: GrantFiled: April 5, 2017Date of Patent: August 10, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Kiyoshi Nishioka, Hideyuki Takeda
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Patent number: 11084020Abstract: A water-absorbent resin that exhibits a high liquid-retention capacity under a load and a small amount of re-wet, even when it is used in an absorbent material having a low proportion of hydrophilic fibers. The water-absorbent resin includes a polymer of a water-soluble ethylenically unsaturated monomer, wherein when a cross-sectional image of the water-absorbent resin is observed using X-ray computed tomography, the water-absorbent resin has cavity area percentage in the cross-sectional image of 10% or less.Type: GrantFiled: March 2, 2018Date of Patent: August 10, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Mikito Chiba, Yuichi Onoda
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Publication number: 20210228621Abstract: This invention provides a means capable of treating skin ulcers. More specifically, the invention provides a composition for preventing and/or treating skin wounds, the composition comprising carbon monoxide.Type: ApplicationFiled: May 16, 2019Publication date: July 29, 2021Applicants: SUMITOMO SEIKA CHEMICALS CO., LTD., KYOTO PREFECTURAL PUBLIC UNIVERSITY CORPORATIONInventors: Tomohisa TAKAGI, Jun ASAI, Tetsuya OKAYAMA, Katsura MIURA, Shigeki SAKAUE
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Patent number: 11066510Abstract: The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc.Type: GrantFiled: May 22, 2020Date of Patent: July 20, 2021Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Noriaki Fukuda, Ryota Harisaki, Katsumasa Yamamoto, Nobukatsu Nemoto
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Publication number: 20210195887Abstract: The present invention provides a composition that can preserve biomaterials. The biomaterial preservation composition of the present invention includes a microbubble.Type: ApplicationFiled: May 31, 2019Publication date: July 1, 2021Applicants: Aichi Medical University, Sumitomo Seika Chemicals Co., Ltd.Inventors: Naoyuki Hatayama, Munekazu Naito, Shuichi Hirai, Shigeki Sakaue