Abstract: A method for packaging fingerprint sensing chips and a fingerprint sensing module using the method are disclosed. The method includes the steps of: A. providing a number of PCBs for packaging fingerprint sensing chips, wherein the PCBs are connected in a form of a panel before cutting; each PCB located in the periphery has a protruding structure on a top surface thereof; each protruding structure connects to adjacent protruding structures to form an cofferdam body; B. mounting a fingerprint sensing chip and other electronic components for each PCB to form a number of PCBAs; C. fixing the PCBAs so that the top surfaces of the fingerprint sensing chips are on the same level substantially; D. dispensing a liquid packaging material to a space enclosed by the cofferdam body; E. curing the liquid packaging material; and F. cutting the connected PCBAs and removing the protruding structure to form independent PCBAs.

Abstract: A compound and securable key is disclosed in the present invention. It includes a printed circuit board, a fingerprint sensor, a micro control unit, and a housing. The present invention provides a key structure with combination of a physical key patterns and biometrics for identification. The key is convenient to carry, difficult to duplicate. It is also has advantages such as low cost, easy use, and compact size of biometric module. The invention enhances security of keys.

Abstract: A Printed Circuit Board Assembly (PCBA) forming an enhanced fingerprint module is disclosed. The PCBA includes a Printed Circuit Board (PCB), an image sensing chip, at least one electrode and a protection layer. An opening in a first insulation layer and a second insulation layer of the PCB together form a sensor portion so that the image sensing chip can be packaged in the opening. Thus, the thickness of the enhanced fingerprint module can be thinner than other fingerprint modules provided by the conventional package methods.

Abstract: A contact image sensor is disclosed in the present invention. The contact image sensor includes: a substrate; an array of sensing units, formed above the substrate; a first insulation structure, formed over the sensing units and the substrate; a number of focusing units, formed above the first insulation structure, each focusing unit is aligned above a corresponding sensing unit with the first insulation structure sandwiched therebetween; a conductive metal layer, linked to a control circuit; an array of Organic Light-Emitting Diode (OLED) units, formed above the conductive metal layer and connected thereto; a transparent conductive layer, formed above the array of OLED units, and connected to the control circuit to control the statuses of the OLED units; and a transparent insulation structure, formed above the transparent conductive layer.

Abstract: A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.

Abstract: A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; a first metal layer, formed above the substrate; an inter-metal dielectric layer, formed above the first metal layer, having concave portions formed along the peripheries of the chip so that a portion of the first metal layer is exposed to form an input-output (I/O) pad in each of the concave portions which are spaced apart from each other; and a passivation layer, formed above the second metal layer without covering the concave portions so that specific circuits are formed by the first metal layer and the second metal layer, respectively. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.

Abstract: A multi-function identification system is described in the present invention. The system includes an appliance and a number of keys. Under a registration process, the system allows multiple appliances to be controlled by a single key or an appliance can be controlled by different keys. The system can also allow users to set specified actions to be conducted after identification processes are completed. That satisfies requirements of a multi-function identification. Meanwhile, the key is a plug-and play and on-the-go product. It is desired that the key is a host used for other purpose.

Abstract: A capacitive fingerprint sensing unit and enhanced capacitive fingerprint reader using the capacitive fingerprint sensing units are disclosed. The enhanced capacitive fingerprint reader includes a number of capacitive fingerprint sensing units, forming a fingerprint sensing array; a conductive element; and an excitation signal driver, for providing excitation signals to the conductive element. By increasing the thicknesses of a first inter-metal dielectric layer and a second inter-metal dielectric layer in fingerprint sensing units in the enhanced capacitive fingerprint reader, sensitivity of the enhanced capacitive fingerprint reader can be improved.

Abstract: A Printed Circuit Board Assembly (PCBA) for forming an enhanced biometric module and a method for manufacturing the PCBA are disclosed. The method includes the steps of providing a PCB, a biometric sensing chip and SMDs; mounting the biometric sensing chip on the PCB with each bonding pad being electrically linked to one corresponding first contact pad; mounting the SMDs on second contact pads which are electrically linked thereto, respectively; and forming a protection layer. The present invention takes advantages of compact size of small conductive elements to avoid cracks in the protection layer.

Abstract: A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; at least two metal layers, formed above the substrate, each metal layer forming a specific circuit, wherein two adjacent metal layers are separated by an inter-metal dielectric layer; and a passivation layer, formed on a top side of the chip. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.

Abstract: A Printed Circuit Board Assembly (PCBA) forming an enhanced fingerprint module is disclosed. The PCBA includes a Printed Circuit Board (PCB), an image sensing chip, at least one electrode and a protection layer. An opening in a first insulation layer and a second insulation layer of the PCB together form a sensor portion so that the image sensing chip can be packaged in the opening. Thus, the thickness of the enhanced fingerprint module can be thinner than other fingerprint modules provided by the conventional package methods.

Abstract: A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; at least two metal layers, formed above the substrate, each metal layer forming a specific circuit, wherein two adjacent metal layers are separated by an inter-metal dielectric layer; and a passivation layer, formed on a top side of the chip. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.

Abstract: A capacitive image sensor and a method for running the capacitive image sensor are disclosed. The capacitive image sensor includes a number of capacitive sensing elements, forming an array, each capacitive sensing element for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output voltage, wherein a value of the output voltage is changed by a driving signal exerted on the finger; an A/D converter, for converting the output voltage into a number and outputting the number; and a signal source, for providing the driving signal to the finger.

Abstract: A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.

Abstract: An enhanced capacitive fingerprint sensing unit is disclosed. The enhanced capacitive fingerprint sensing unit includes a base structure and a fingerprint sensing structure. The fingerprint sensing structure has a first inter-metal dielectric layer, a second metal layer, a second inter-metal dielectric layer, a third metal layer, and a passivation layer. By connecting the third metal layer to Transient Voltage Suppressor (TVS) device, anti-Electrostatic Discharge (ESD) is available. By increasing the thicknesses of the first inter-metal dielectric layer and the second inter-metal dielectric layer, sensitivity of the enhanced capacitive fingerprint sensing unit can be improved.

Abstract: An enhanced capacitive fingerprint sensing unit is disclosed. The enhanced capacitive fingerprint sensing unit includes a base structure and a fingerprint sensing structure. The fingerprint sensing structure has a first inter-metal dielectric layer, a second metal layer, a second inter-metal dielectric layer, a third metal layer, and a passivation layer. By connecting the third metal layer to Transient Voltage Suppressor (TVS) device, anti-Electrostatic Discharge (ESD) is available. By increasing the thicknesses of the first inter-metal dielectric layer and the second inter-metal dielectric layer, sensitivity of the enhanced capacitive fingerprint sensing unit can be improved.

Abstract: A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.

Abstract: A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.

Abstract: A read-only method and a read-only system for operating a portable device are disclosed. The system includes a portable device which has a memory unit and a processing unit, and a host which has a display unit and a processor. A browser requests an access to a portable device inserted to a host. After the storage units been accessed are traced, corresponding service will be performed by the portable device without being blocked by the security system of the host.

Abstract: A method for forming a stacked metal contact in electrical communication with aluminum wiring in a semiconductor wafer of an integrated circuit is disclosed. The method includes the steps of: forming at least one passivation layer on a surface of the semiconductor wafer of the integrated circuit, where an aluminum wiring is embedded; forming a patterned terminal via opening through the passivation layer to expose the aluminum wiring; removing a portion of the aluminum wiring from the patterned terminal via opening by chemical etching and forming a thin zinc film on an etched surface at the same time; forming a nickel film stacked on the zinc film; and; and forming a metal stack in the patterned terminal via opening and/or at least a portion of the passivation layer by chemical plating or metal plating.