Patents Assigned to Surface Technologies, Inc.
  • Patent number: 4358923
    Abstract: Disclosed are processes and articles for composite electroless coatings comprising at least two distinct layers, the first layer comprising a metal and/or a metal alloy plus particulate matter and the second layer comprising a metal and/or a metal alloy and being substantially free of particulate matter.
    Type: Grant
    Filed: November 14, 1980
    Date of Patent: November 16, 1982
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4328266
    Abstract: A process is described for the reception of composite electroless plating onto a non-catalytic metal or non-catalytic alloy, non-catalytic to composite electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with a composite electroless plating bath comprising particulate matter to deposit a metallic layer with finely divided particulate matter dispersed throughout.
    Type: Grant
    Filed: March 10, 1980
    Date of Patent: May 4, 1982
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4321285
    Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.
    Type: Grant
    Filed: December 18, 1980
    Date of Patent: March 23, 1982
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4318940
    Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.
    Type: Grant
    Filed: July 26, 1979
    Date of Patent: March 9, 1982
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4305997
    Abstract: A process, article produced therefrom, and compositions are described for the reception of electroless plating onto a substrate of a non-catalytic metal or non-catalytic alloy. The process comprises contacting the surface of the non-catalytic substrate with a promotor composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with an electroless plating bath comprising hypophosphite for metallic build-up.
    Type: Grant
    Filed: December 26, 1979
    Date of Patent: December 15, 1981
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4278712
    Abstract: Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with activated colloid(s) of non-precious metals and wherein the activated colloids are prepared by the controlled oxidation of weakly active colloids.
    Type: Grant
    Filed: June 28, 1979
    Date of Patent: July 14, 1981
    Assignee: Surface Technology, Inc.
    Inventor: Thomas G. Thomann
  • Patent number: 4239538
    Abstract: In the electroless plating of dielectric or non-conductive substrates by first priming the surface of the substrate with aqueous solutions containing stannous and copper ions, followed by developing the substrate with a reducing agent capable of reducing the valence state of the copper ions, the substrate is contacted with a linking agent for the stannous ion either prior to or concurrently with the priming step permitting the use of lower amounts of stannous and copper ions while achieving improved plating and improved primer usefulness.
    Type: Grant
    Filed: March 30, 1976
    Date of Patent: December 16, 1980
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4181760
    Abstract: A process is described for the reception of electroless plating onto a non-catalytic metal or alloy substrate, non-catalytic to conventional electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition comprising ions selected from the group consisting of nickel, cobalt, iron and mixtures thereof; and a suitable reducing agent capable of chemically interacting with the non-catalytic metal or alloy and the metal ions in the promoter composition and further wherein the relative concentration of the reducing agent to metal ions is so adjusted as to yield first a reaction of the reducing agent with the non-catalytic metal or alloy and thereafter a heterogeneous reduction of the metal ions; and thereafter contacting the treated substrate with a conventional electroless plating bath, e.g, a nickel or cobalt-hypophosphite type bath or a copper-formaldehyde type bath for the metallic build-up.
    Type: Grant
    Filed: June 6, 1977
    Date of Patent: January 1, 1980
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4150171
    Abstract: Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.
    Type: Grant
    Filed: April 5, 1978
    Date of Patent: April 17, 1979
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 4136216
    Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.
    Type: Grant
    Filed: October 12, 1976
    Date of Patent: January 23, 1979
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 3993799
    Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.
    Type: Grant
    Filed: August 26, 1975
    Date of Patent: November 23, 1976
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 3993848
    Abstract: In the electroless plating of dielectric or non-conductive substrates by first priming the surface of the substrate with aqueous solutions containing stannous and copper ions, followed by developing the substrate with a reducing agent capable of reducing the valence state of the copper ions, the substrate is contacted with a linking agent for the stannous ion either prior to or concurrently with the priming step permitting the use of lower amounts of stannous and copper ions while achieving improved plating and improved primer usefulness.
    Type: Grant
    Filed: February 18, 1975
    Date of Patent: November 23, 1976
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 3993801
    Abstract: Improved processes and systems are described for the reception of electroless plating of non-metallic substrates, the processes comprising forming a coating of metal ions onto the non-metallic substrate, immersing the coated substrate in a developer solution containing ions selected from nickel, cobalt and copper ions and mixtures thereof and a reducing agent, and thereafter immersing the substrate in conventional electroless plating baths, e.g., nickel or cobalt-hypophosphite baths or a copper-formaldehyde bath.
    Type: Grant
    Filed: February 18, 1975
    Date of Patent: November 23, 1976
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 3993491
    Abstract: Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.
    Type: Grant
    Filed: November 8, 1974
    Date of Patent: November 23, 1976
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein