Abstract: A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

Abstract: A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force comprises a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the holder arm to the carrier device. The holder arm and fastening arm are connected to one another by a parallel guide whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented making it easier for the probe needle to carry out a vertical yielding movement, with almost no rotation of the probe needle about a horizontal axis.

Abstract: A probe holder has a manipulator, a probe arm arranged on the manipulator, and a probe needle that is at least indirectly connected to the probe arm. To increase the number of contacts of a substrate to be tested and to make it possible to test a plurality of contacts in etched trenches of semiconductor elements in a group of wafers, the probe arm is connected to a needle support on which the probe needle and at least one second probe needle are arranged.

Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

Abstract: Method for calibrating a vectorial network analyzer, with n measurement ports (n>2) and at least m measurement sites, where m>n+1 includes measurement of three different n-port reflection standards, connected between measurement ports in any desired order, and successive measurement of reflection and transmission parameters at different transmission standards, connected between two respective measurement ports, and computational determination of error coefficients and error-corrected scattering matrices [Sx] of the n-port standards. Reflection standards, Short and Open, are unknown, but physically identical at each n-fold one-port. Reflection standard, realized by wave terminations, is known, but can be different at each n-fold one-port. Transmission standards are measured at a transmission standard, having known length and attenuation at a two-port, and at unknown transmission standards, identical for incident and reflected waves at remaining two-ports, which can be connected.

Abstract: A method is provided for calibration of a vectorial network analyzer, having n measurement ports (n>1) and at least m measurement sites with n+1<m<2n. Calibration includes measurement of three different n-port reflection standards connected between the measurement ports in any sequence, and measurement of different transmission standards connected between two measurement ports, and mathematical determination of the error coefficients of the network analyzer and the error-corrected scattering matrices [Sx] of the n-port calibration standards. The reflection standards, similar to shorts and opens, are unknown and the reflection standard implemented by wave terminations is known, but can be different at each n-fold one-port. The measurement of the transmission standards occurs on a transmission standard known in length and attenuation, which is implemented on each possible two-port by different combination of measurement ports.

Abstract: A prober for testing components comprises a lower frame, over which a probe holder plate is disposed at a distance therefrom for receiving test probes that make contact with the components to be tested and to which a displacement device is connected. A substrate carrier is disposed in the space between the frame and the probe holder plate, and the probe holder plate is provided with an opening, below which the substrate carrier can be displaced. To expand the scope of application of probers used for testing components, all those components of the prober that surround the substrate are made from a non-magnetic material.

Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.

Abstract: In a method for measurement of impedance of electronic circuits, an input of the electronic circuit is acted upon by a high-frequency ac voltage with a measurement frequency f as a test signal and, from the reaction of the circuit to the test signal, the impedance Z of the circuit is determined. A parameter S, which represents the value S = Z - Z 0 Z + Z 0 at a stipulated reference impedance Z0, is produced by an analyzer with a reference impedance Z0, and from this parameter S the impedance Z is determined. To minimize the error in measuring the impedances by determining parameter S, the measurement frequency f is set so that a minimal error ?Z is produced for Z.

Abstract: In a method and devices for forming a temporary electrical contact to a solar cell for testing purposes, probes form a contact to the electrode terminals of a solar cell held by a sample holder. The probes are held by a probe holder and exhibit an elastic, electrically conductive contact element and at least one reference sensor. In order to form a contact, the solar cell and the probes are positioned in relation to each other, and then a probe is placed on an electrode terminal of the solar cell. To this end, a feed motion of the probe is carried out until a reference sensor of the probe generates a reference signal upon reaching a predefined distance. Then the feed motion is continued by a predefined path that goes beyond the contact element making contact with the electrode terminal, in order to carry out an overtravel.

Abstract: A probe for temporarily electrically contacting a solar cell for testing purposes, has at least one elastic, electrically conductive contact element for producing the electrical contact, at least one reference sensor for indicating a distance of the contact element to an external reference surface using an electrical signal of the reference sensor, and a mounting plane to which the tip of the contact element is oriented. The probe ensures a secure electrical contact of the solar cell in a testing station with minimal mechanical stress, and is also suitable for use in an industrial continuous production method.

Abstract: A method and an apparatus are provided which make it possible, when testing chips arranged on a wafer, to be able to test optionally both additional components arranged on horizontal boundary lines and on vertical boundary lines. The additional components arranged on horizontal boundary lines are tested in a first position of the wafer. For testing the additional components arranged on vertical boundary lines, the wafer is rotated about its vertical axis through 90° relative to the first position into a second position. The apparatus comprises a housing and, in the housing, at least one test probe for making contact with an electronic component, a chuck for moving the wafer and a rotatably mounted additional plate operatively connected to the chuck.

Abstract: In a method for producing semiconductor components, in which chips are structured, tested, and isolated into dies on a wafer, in the event of a wafer being broken during the method, undamaged chips of a fragment of the wafer delimited by at least one edge section and at least one fracture contour are processed further as usual. The method has the result that the yield of usable chips is significantly increased in relation to the discarding and disposal of broken wafers provided in the prior art. The average production costs of electronic components and the loss of valuable semiconductor materials and the costs for the disposal of the fragments viewed as discards up to this point are thus significantly reduced.

Abstract: A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes comprises a probe card holder, a probe card, and a probe card adapter, The probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed such that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from the holder. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component.

Abstract: A method and apparatus are provided for assembly of several semiconductor components on a target substrate. At least two semiconductor components are removed from a dispenser by a transfer device and simultaneously mounted in predefined target positions on the target substrate. The apparatus includes positioning units for positioning of the semiconductor components relative to the target substrate. Feed of the target substrate occurs by a first positioning unit into an assembly area where the semiconductor components are mounted on the target substrate in a first X direction, and feed of the transfer device with the semiconductor components occurs by a second positioning unit into the assembly area in a second Y direction. Both directions deviate from each other and the assembly area represents vicinity of the intersection point of the X and Y directions. Removal of the process target substrate from the assembly area continues its feed movement.

Abstract: In a method for calibration of a measurement unit for determination of electrical properties of electronic components using at least one planar calibration standard, an electrical measurement quantity is measured at two different temperatures. The electrical property of the calibration standard is known at at least one temperature or is to be determined by calculation. A temperature coefficient is determined from both measured quantities, which describes the relative change of the electrical property of the calibration standard accompanying the temperature change and with which the electrical property of the calibration standard is determined at a measurement temperature. From the change in electrical property, an error coefficient of the measurement unit is determined. A method is also provided for determination of an electrical property of an electronic component, using the calibration method.

Abstract: A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.

Abstract: A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.

Abstract: A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force, includes a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the probe holder to the carrier device. The holder arm and the fastening arm are connected to one another by an articulated joint, whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented by increasing the radius of the yielding movement of the probe needle.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.