Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.

Abstract: To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.

Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.

Abstract: A test probe for executing high-frequency measurements comprises: a coaxial high-frequency wave guide containing an inner conductor and an outer conductor for delivering a primary electrical potential and a secondary electrical potential, respectively, a supporting structure conductively connected to at least the outer conductor and to at least two contact elements for creating a contact with an electronic circuit to be tested. The support structure is provided with conductive paths for the transmission respectively of a high-frequency signal from the inner conductor and a high-frequency ground potential from the outer conductor to at least one contact element and each conductive path is conductively connected to the inner or outer conductor. The support structure has at least one U-shaped cut-out with a width essentially equivalent to an outer diameter of the wave guide and sides of the U-shaped cut-out are connected to the outer conductor.

Abstract: An adapter for positioning of contact tips has a location surface for locating a contact tip and a base element with a base for setting the adapter on a mounting surface. A positioning element is in mechanical contact with and mobile relative to the base element. The location surface can be positioned relative to the base, in at least one positioning direction, by the positioning element which includes a gearing for converting rotary movement to translational movement in the positioning direction.

Abstract: A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.

Abstract: A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

Abstract: A test probe for executing high-frequency measurements comprises: a coaxial high-frequency wave guide containing an inner conductor and an outer conductor for delivering a primary electrical potential and a secondary electrical potential, respectively, a supporting structure conductively connected to at least the outer conductor and to at least two contact elements for creating a contact with an electronic circuit to be tested. The support structure is provided with conductive paths for the transmission respectively of a high-frequency signal from the inner conductor and a high-frequency ground potential from the outer conductor to at least one contact element and each conductive path is conductively connected to the inner or outer conductor. The support structure has at least one U-shaped cut-out with a width essentially equivalent to an outer diameter of the wave guide and sides of the U-shaped cut-out are connected to the outer conductor.

Abstract: A probe station allows for effective EMI shielding of the passage of the probe through the wall of the housing of such probe station. The probe is freely movable in the X, Y and Z directions. The probe station comprises a housing having at least one aperture through which a probe can extend, a chuck for supporting a test device, the chuck being arranged inside the housing, at least one probe support for supporting a probe, the probe support being arranged relative to the housing such that a first portion of the probe extends into the housing through one of said apertures, at least one positioning mechanism enabling at least one of said probe and said chuck to move relative to the other, and is characterized in that at least one electrically conductive, elastic bellows is attached to the edge of an aperture which provides a variable passage for the probe.

Abstract: A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.

Abstract: A probe station allows for effective EMI shielding of the passage of the probe through the wall of the housing of such probe station. The probe is freely movable in the X, Y and Z directions. The probe station comprises a housing having at least one aperture through which a probe can extend, a chuck for supporting a test device, the chuck being arranged inside the housing, at least one probe support for supporting a probe, the probe support being arranged relative to the housing such that a first portion of the probe extends into the housing through one of said apertures, at least one positioning mechanism enabling at least one of said probe and said chuck to move relative to the other, and is characterized in that at least one electrically conductive, elastic bellows is attached to the edge of an aperture which provides a variable passage for the probe.

Abstract: A process is provided for inspection of a variety of structures on the basis of a golden template, that was attained by recording and statistical analysis of greyscale pictures and is compared to the greyscale picture of the structure to be evaluated based on position. The underlying task is to report any such inspection process, with which a positioning of the test structure relative to the golden template and a structure detection with sub-pixel accuracy is carried out. In positioning of each further structure to be recorded, which follows a first recorded structure, the further structure is fundamentally positioned in accordance with the first positioned structure, applicable characteristic values of the greyscale picture recorded in this position are determined and hence a degree of similarity is determined.

Abstract: The invention relates to a method for calibrating a vectorial network analyzer having n measurement ports and at least 2n measurement locations (n>1) by successive measurement of the reflection and transmission parameters at different two-port calibration standards, which are connected between the measurement ports in any desired order and must all have a transmission path, and three different n-port calibration standards, which are connected between the measurement ports in any desired order and which are not permitted to show transmission and by calculation of error coefficient and scattering matrix [Sx] with the 10-term or 7-term multiport method. An object of the invention is to propagate a method for calibrating these vectorial network analyzer used for multiport measurement which permits a calibration with increased precision and considerable reproducibility of measurement.

Abstract: A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.

Abstract: The invention relates to a method for calibrating a vectorial network analyser having n measurement ports and at least 2n measurement locations (n>1) by successive measurement of the reflection and transmission parameters at different two-port calibration standards, which are connected between the measurement ports in any desired order and must all have a transmission path, and three different n-port calibration standards, which are connected between the measurement ports in any desired order and which are not permitted to show transmission and by calculation of error coefficient and scattering matrix [Sx] with the 10-term or 7-term multiport method. An object of the invention is to propagate a method for calibrating these vectorial network analyser used for multiport measurement which permits a calibration with increased precision and considerable reproducibility of measurement.