Abstract: An oscillator comprising a three-terminal device and circuitry coupled across a first terminal and a second terminal of the device. The circuitry is preferably operable to bias the device and feedback a select amount of noise generated by the device into the device so as to reduce a proportional amount of phase noise present at a third terminal of the device.

Abstract: The present invention relates to a single side band modulator for splitting a signal into a first split signal and a second split signal 90 degrees out of phase with the first split signal. A first double balanced mixer modulates the first split signal and includes a transformer, a modulating signal input, and a first diode ring. The transformer connects the first diode ring to a quadrature hybrid. A second double balanced mixer modulates the second split signal and includes a transformer, a modulating signal input, and a second diode ring. The transformer of the second double balanced mixer connects the second diode ring to the quadrature hybrid. The first and second diode rings are connected in parallel and are connected to a third transformer which performs the function of a power combiner.

Abstract: A multi-layer circuit comprises first and second transmission lines. The first transmission line includes vertically stacked bottom and middle dielectric layers. A conductive pattern is disposed between the bottom and middle dielectric layers. A bottom ground layer is in contact with a bottom surface of the bottom dielectric layer. The second transmission line is vertically stacked above the first transmission line and includes a top dielectric layer and a conductive pattern in contact with a top surface of the top dielectric layer and at least one ground layer separating a bottom surface of the top dielectric layer from the middle dielectric layer. At least one plated through hole electrically connects the first and second transmission lines. All of the dielectric layers comprise a ceramic-filled substrate with woven glass reinforcement.

Abstract: A surface mount package particularly suitable for transformers and other components having numerous windings of fragile, difficult to handle wire has a housing which includes openings along the lower edge, the housing being plated with an electrically conductive material on portions of the lower edge and in areas surrounding the opening. A component is held within the housing, and the leads of the component are disposed in the openings at a point above the lower edge of the housing, and the leads are electrically connected to the plating surrounding the openings and the plating at the flat portions of the lower edge. The plating on the flat portions of the lower edge can be at any suitable location, i.e., remote from or adjacent to the openings. Additional components can be stacked on the exterior of the housing, as connected to the plating surrounding the openings.

Abstract: Voltage controlled oscillator (VCO) circuits include a VCO and voltage regulator provided on an integrated VCO module, balanced control input for the VCO, buffering of the VCO and frequency multiplication of the VCO output signal. Such improved VCO circuits are especially useful in phase-locked loop (PLL) circuits. Improved PLL circuits are also provided, including a PLL circuit with separate analog and digital grounds.

Abstract: An improved modulator circuit for mixing a modulation signal with a carrier signal includes first and second harmonic mixers which are operative to produce modulated output signals at an output frequency corresponding to both the sum and the difference of the modulation signal frequency and the even harmonic frequencies of the carrier signal frequency. In one configuration employing a 90.degree. hybrid, the output signals of the harmonic mixers are combined to produce a single sideband modulated output signal. A novel harmonic mixer circuit is also provided along with demodulator circuits and methods of modulating and demodulating modulation signals.

Abstract: A manner of using a plurality of transformers having cylindrical cores such that operation of the transformers at high frequencies allows the cores of the transformers to be disposed parallel to each other and in relatively close proximity without substantial interference.

Abstract: A mass of dielectric material intimately surrounds a high frequency circuit having plural transformers in relative close proximity to one anther and provides mechanical stability and electrical protection to the circuit. The mass of dielectric material surrounding the circuit has a dielectric constant less than about 2.6 and a loss tangent less than about 0.009.

Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.

Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.