Patents Assigned to TACTOTEK OY
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Patent number: 11357111Abstract: A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.Type: GrantFiled: August 27, 2018Date of Patent: June 7, 2022Assignee: TACTOTEK OYInventors: Janne Asikkala, Tomi Simula, Antti Keränen
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Patent number: 11309676Abstract: An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.Type: GrantFiled: May 12, 2020Date of Patent: April 19, 2022Assignee: TACTOTEK OYInventors: Ilpo Hänninen, Jarmo Sääski, Mikko Heikkinen
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Patent number: 11292166Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.Type: GrantFiled: April 7, 2017Date of Patent: April 5, 2022Assignee: TACTOTEK OYInventors: Anne Isohätälä, Hasse Sinivaara, Mikko Heikkinen
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Patent number: 11287564Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.Type: GrantFiled: January 20, 2021Date of Patent: March 29, 2022Assignee: TACTOTEK OYInventors: Antti Keränen, Mikko Heikkinen
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Patent number: 11285645Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.Type: GrantFiled: September 5, 2019Date of Patent: March 29, 2022Assignee: TACTOTEK OYInventors: Anne Isohätälä, Hasse Sinivaara, Mikko Heikkinen
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Patent number: 11175014Abstract: An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.Type: GrantFiled: May 17, 2021Date of Patent: November 16, 2021Assignee: TACTOTEK OYInventors: Juha-Matti Hintikka, Miikka Kärnä, Heikki Tuovinen, Tuomas Nieminen, Johannes Soutukorva, Ville Wallenius, Tero Rajaniemi, Tomi Simula, Jari Lihavainen, Mikko Heikkinen, Jarmo Sääski, Hasse Sinivaara, Antti Keränen, Ilpo Hänninen
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Patent number: 11175438Abstract: An optoelectronically functional multilayer structure and related methods of manufacturing an optoelectronically functional multilayer structure, such structure including an optionally thermoplastic formable substrate film, electronics comprising preferably light-emitting and/or light-sensitive elements, an optically transmissive layer, and a light-blocking layer defining a number of structural channels extending in at least a first direction.Type: GrantFiled: May 17, 2021Date of Patent: November 16, 2021Assignee: TACTOTEK OYInventors: Juha-Matti Hintikka, Miikka Kärnä, Heikki Tuovinen, Tuomas Nieminen, Johannes Soutukorva, Ville Wallenius, Tero Rajaniemi, Tomi Simula, Jari Lihavainen, Mikko Heikkinen, Jarmo Sääski, Hasse Sinivaara, Antti Keränen, Ilpo Hänninen
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Patent number: 11166364Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: GrantFiled: March 30, 2020Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
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Patent number: 11166380Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.Type: GrantFiled: October 16, 2020Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Tomi Simula, Mika Paani, Miikka Kärnä, Outi Rusanen, Johanna Juvani, Tapio Rautio, Marko Suo-Anttila, Mikko Heikkinen
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Patent number: 11166363Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: GrantFiled: January 11, 2019Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
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Patent number: 11088066Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: GrantFiled: March 19, 2018Date of Patent: August 10, 2021Assignee: TACTOTEK OYInventors: Jarmo Sääski, Mikko Heikkinen, Tero Heikkinen, Mika Paani, Jan Tillonen, Ronald Haag
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Patent number: 10986735Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.Type: GrantFiled: October 24, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986734Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: September 25, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986733Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: November 15, 2017Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
Patent number: 10960641Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.Type: GrantFiled: October 2, 2020Date of Patent: March 30, 2021Assignee: TACTOTEK OYInventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula -
Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
Patent number: 10946612Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.Type: GrantFiled: August 27, 2018Date of Patent: March 16, 2021Assignee: TACTOTEK OYInventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula -
Patent number: 10928583Abstract: A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.Type: GrantFiled: May 11, 2020Date of Patent: February 23, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Mikko Heikkinen
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Patent number: 10897196Abstract: An arrangement involving printed conductive traces includes at least a voltage source (Vsupply) and at least one target component, preferably a light-emitting component such as an LED. The arrangement is adapted to produce a current-controlled voltage (VOUT2, Vout) originating from the voltage source, the current-controlled voltage being coupled to the at least one target component, wherein said voltage is dependent on the current (IR,LED, ILED) that is being passed through the target component and said voltage is adaptable to a varying resistance of the arrangement and its features.Type: GrantFiled: November 13, 2019Date of Patent: January 19, 2021Assignee: TACTOTEK OYInventors: Miikka Kärnä, Tuomas Heikkilä
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Patent number: 10849235Abstract: A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.Type: GrantFiled: May 20, 2020Date of Patent: November 24, 2020Assignee: TACTOTEK OYInventors: Tomi Simula, Mika Paani, Miikka Kärnä, Outi Rusanen, Johanna Juvani, Tapio Rautio, Marko Suo-Anttila, Mikko Heikkinen
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Patent number: 10827609Abstract: An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.Type: GrantFiled: December 12, 2019Date of Patent: November 3, 2020Assignee: TACTOTEK OYInventors: Tero Heikkinen, Antti Keranen, Mikko Heikkinen, Jarmo Saaski