Patents Assigned to TACTOTEK OY
  • Patent number: 10813222
    Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: October 20, 2020
    Assignee: TACTOTEK OY
    Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
  • Patent number: 10675834
    Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: June 9, 2020
    Assignee: TACTOTEK OY
    Inventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula
  • Patent number: 10670800
    Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: June 2, 2020
    Assignee: TACTOTEK OY
    Inventors: Antti Keränen, Mikko Heikkinen
  • Patent number: 10667401
    Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: May 26, 2020
    Assignee: TACTOTEK OY
    Inventors: Mikko Heikkinen, Antti Keränen, Jarmo Sääski, Ronald H. Haag
  • Patent number: 10667396
    Abstract: Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: May 26, 2020
    Assignee: TACTOTEK OY
    Inventors: Antti Keranen, Ronald Haag, Mikko Heikkinen
  • Patent number: 10660211
    Abstract: A method for manufacturing an electromechanical structure includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the film in relation to a desired three-dimensional shape of the film, forming the film into the substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: May 19, 2020
    Assignee: TACTOTEK OY
    Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keranen
  • Patent number: 10653004
    Abstract: An electronic assembly includes a substrate film for accommodating electronics, an electrical contact pad coupled to the substrate film, an electrically conductive member coupled to the electrical contact pad, and a material layer molded onto the substrate film to embed the elastic electrically conductive member.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 12, 2020
    Assignee: TACTOTEK OY
    Inventors: Mikko Heikkinen, Jarmo Sääski
  • Patent number: 10642433
    Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: May 5, 2020
    Assignee: TACTOTEK OY
    Inventors: Jarmo Sääski, Jarkko Torvinen, Pasi Raappana, Mikko Heikkinen
  • Patent number: 10645796
    Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: May 5, 2020
    Assignee: TACTOTEK OY
    Inventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
  • Patent number: 10575407
    Abstract: A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: February 25, 2020
    Assignee: TACTOTEK OY
    Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
  • Patent number: 10561019
    Abstract: Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: February 11, 2020
    Assignee: TACTOTEK OY
    Inventors: Tero Heikkinen, Antti Keranen, Mikko Heikkinen, Jarmo Saaski
  • Patent number: 10491115
    Abstract: An arrangement involving printed conductive traces, the arrangement including at least a voltage source (Vsupply) and at least one target component, preferably a light-emitting component such as an LED. The arrangement is adapted to produce a current-controlled voltage (VOUT2, Vout) originating from the voltage source, the current-controlled voltage being coupled to the at least one target component, wherein said voltage is dependent on the current (IR,LED, ILED) that is being passed through the target component.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: November 26, 2019
    Assignee: TACTOTEK OY
    Inventors: Miikka Kärnä, Tuomas Heikkilä
  • Patent number: 10485094
    Abstract: Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: November 19, 2019
    Assignee: TACTOTEK OY
    Inventors: Anne Isohätälä, Hasse Sinivaara, Heikki Tuovinen, Ville Wallenius, Vinski Bräysy, Tomi Simula, Mikko Heikkinen, Minna Pirkonen, Tuukka Junkkari, Jarmo Sääski, Janne Asikkala, Antti Keränen
  • Patent number: 10455702
    Abstract: A method for manufacturing a multilayer structure includes obtaining a first substrate film for accommodating electronics, providing circuitry on at least the second side of the first substrate film, forming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing at least a portion of the circuitry on the at least the second side of the first substrate film, and melding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: October 22, 2019
    Assignee: TACTOTEK OY
    Inventors: Antti Keranen, Ronald Haag, Mikko Heikkinen
  • Patent number: 10408391
    Abstract: Embodiments of light-emitting multilayer structures incorporating substrate films 3D-formed with recesses for light sources and plastics material molded thereupon are presented. Related methods of manufacture are set forth as well.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: September 10, 2019
    Assignee: TACTOTEK OY
    Inventor: Sami Torvinen
  • Patent number: 10401547
    Abstract: Multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics, said film having the first side and a second side, at least one area light source and configured to emit light of predetermined frequency or frequency band, a molded lightguide layer, the lightguide layer being of optically at least translucent material, wherein the lightguide layer is configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the lightguide layer and is outcoupled therefrom via an outer surface thereof substantially opposite to the embedded light source, and a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer structure, wherein the masking layer defines a window for letting the light emitted by the embedded light source and propagated within the plastic lightguide layer to pass through the maskin
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: September 3, 2019
    Assignee: TACTOTEK OY
    Inventor: Antti Keränen
  • Patent number: 10383232
    Abstract: A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: August 13, 2019
    Assignee: TACTOTEK OY
    Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen
  • Patent number: 10288800
    Abstract: An integrated multilayer structure including a substrate film having a first side and an opposing second side; electronics including at least one light source, provided upon the first side and a number of electrical conductors, at least electrically coupled to the at least one light source which is configured to emit light in selected one or more frequencies or wavelengths; an optically transmissive element including thermoplastic optically transmissive material having a first refractive index and produced onto the first side of the substrate film so as to at least partially embed the at least one light source therewithin; and optical cladding including material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film.
    Type: Grant
    Filed: December 8, 2018
    Date of Patent: May 14, 2019
    Assignee: TACTOTEK OY
    Inventors: Antti Keränen, Mikko Heikkinen
  • Patent number: 10285261
    Abstract: An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 7, 2019
    Assignee: TACTOTEK OY
    Inventors: Tomi Simula, Vinski Bräysy, Mikko Heikkinen, Juha-Matti Hintikka, Juhani Harvela, Minna Pirkonen, Pasi Raappana, Tuomas Heikkilä, Jarmo Sääski
  • Patent number: 10257925
    Abstract: A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating electronics, providing at least an electrical contact pad to the substrate film, coupling an electrically conductive member to the electrical contact pad, and molding, such as injection molding, a material layer onto the substrate film to embed the elastic electrically conductive member utilizing a mold structure defining a cavity for molding. The elastic electrically conductive member is arranged to extend during the molding from the electrical contact pad through the cavity to be in contact with an element on a different side of the cavity with respect to the electrical contact pad for maintaining at least a part of the elastic electrically conductive member accessible after the molding to provide an electrical connection through the material layer to the electrical contact pad.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: April 9, 2019
    Assignee: TACTOTEK OY
    Inventors: Mikko Heikkinen, Jarmo Sääski