Abstract: Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.

Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.

Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.

Abstract: A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa·s at 25° C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.

Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated monocarboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: A photocurable and thermosetting resin composition comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a-polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: A printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition which comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated carboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.

Abstract: An unsaturated polyester compound having an ethylenically unsatureated group in its terminal and hydroxymethyl group in its side chain is obtained by the reaction of (a) a compound containing at least two oxetane rings in its molecule with (b) a compound containing at least two carboxyl groups in its molecule and (c) an unsaturated monocarboxylic acid in the presence of a reaction promotor in such a proportion that the ratio of said compound (b) to said compound (a) falls in the range of 0.1<(b)/(a)<1. BY further reacting (d) a polybasic acid anhydride with the resultant unsaturated polyester compound (A?), there is obtained an actinic energy ray-curable resin which is soluble in an aqueous alkaline solution. A photocurable and/or thermosetting composition is obtained by mixing the unsaturated polyester compound (A?) and/or the actinic energy ray-curable resin with a polymerization initiator (B).

Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f) with the resultant reaction product (e). A photocurable and thermosetting composition comprising (A) the carboxyl group-containing photosensitive resin mentioned above, (C) a photopolymerization initiator, and (D) an epoxy resin, or further comprising (B) a photosensitive (meth)acrylate compound, preferably further comprising (E) an organic solvent and/or (F) a curing catalyst is useful as an ultraviolet-curable type printing ink, various resists and interlaminar insulating materials to be used in the manufacture of printed circuit boards, or the like.

Abstract: The photocurable and thermosetting resin composition of the present invention includes (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component. In the general formula (1), R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: A photocurable and thermosetting resin composition comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: A photocurable and thermosetting composition which is useful in forming a matte film and can be developed with an aqueous alkaline solution is provided. The composition comprises (A) a photosensitive prepolymer obtained by causing a saturated or unsaturated polybasic acid anhydride to react with a hydroxyl group of an esterification product of a novolak type epoxy compound and an unsaturated monocarboxylic acid, (B) a carboxyl group-containing copolymer resin, (C) a photopolymerization initiator, (D) a diluent, (E) a polyfunctional epoxy compound having at least two epoxy groups in its molecule, and, when necessary, (F) an inorganic filler. The composition may further comprise (G) an epoxy resin curing agent. This composition can be advantageously used for the formation of a solder resist on a printed circuit board.

Abstract: An alkali development type photocurable composition comprises (A) an alkali-soluble macromolecular binder having a weight-average molecular weight in the range of 5,000 to 100,000 and an acid value in the range of 50 to 150 mg KOH/g and obtained by causing (d) a compound possessing one glycidyl group in its molecule to react with a carboxyl group of (A-1) a copolymer of (a) an ethylenically unsaturated bond-containing compound possessing one carboxyl group in its molecule with (b) an ethylenically unsaturated bond-containing compound possessing neither hydroxyl group nor acidic group in its molecule, or a carboxyl group of (A-2) a copolymer of the compounds (a) and (b) mentioned above and (c) an ethylenically unsaturated bond-containing compound possessing a hydroxyl group and then causing (e) a polybasic acid anhydride to react with a hydroxyl group caused by the above reaction, (B) an inorganic powder, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) an organic solvent.

Abstract: A photocurable and thermosetting resin composition comprises (A) a high purity synthetic silica powder having a uranium content of not more than 1.0 ppb, (B) a photosensitive prepolymer containing a carboxylic group and at least two ethylenically unsaturated groups in its molecule and having an acid value of solid content of 50 to 150 mg KOH/g, (C) a photosensitive (meth)acrylate compound, (D) a photopolymerization initiator, (E) an epoxy resin, and (F) a curing catalyst. A cured film which emits alpha rays at a fully low dose is obtained by forming a film of the composition on a substrate, subjecting the film to exposure to light and development, and finally curing the coating film by irradiation with active energy rays and/or thermal curing.

Abstract: A liquid thermosetting insulating resin composition and a method for permanently filling holes in a printed circuit board by the use of the composition are provided. The liquid thermosetting insulating resin composition comprises (A) an epoxy resin assuming a liquid state at room temperature, preferably in combination with (B) a phenolic resin assuming a liquid state at room temperature, (C) a curing catalyst, and (D) a filler, wherein the filler (D) contains a spherical filler and a ground filler. Preferably the spherical filler includes a spherical fine filler and a spherical coarse filler. In a method for permanently filling holes in the printed circuit board, the composition is applied to the board so as to fill the holes in the printed circuit board and precured by application of heat. Thereafter, the parts of the precured composition protruding from a surface defining the holes is removed by polishing and then the precured composition is further heated to cause final curing thereof.

Abstract: An ultraviolet-curable resin composition comprising a phosphorus atom-containing photopolymerizable compound and a carboxyl group-containing photopolymerizable compound and exhibiting surface tension at 25° C. in the range of 30 to 50 mN/m. Preferably the composition comprises (a) a compound having one or more (meth)acryloyl groups in its molecule and a phosphorus atom, (b) a compound having at least one carboxyl group and one (meth)acryloyl group in its molecule, (c) a compound having one or more (meth)acryloyl groups in its molecule, (d) a leveling agent, and (e) a photoinitiator. The ultraviolet-curable resin composition is useful as a protective material for etching, particularly as a back-coating material in the production of a shadow mask.