Abstract: Disclosed are an organic acid salt of melamine represented by the following general formula (1) and a thermosetting and a photocurable and thermosetting coating compositions containing the salt mentioned above. ##STR1## wherein Z represents ##STR2## wherein R.sup.1 represents a hydrogen atom or an alkyl group, alkylene group, alicyclic hydrocarbon, or aromatic hydrocarbon severally having from 1 to 18 carbon atoms, or any of said groups or hydrocarbons whose hydrogen atom is substituted by carboxyl group, hydroxyl group, or a halogen atom, R.sup.2 represents a hydrogen atom or an alkyl group or alkylene group severally having from 1 to 9 carbon atoms, or any of said groups whose hydrogen atom is substituted by acryloyl group or methacryloyl group, R.sup.3 represents an alkyl group or alkylene group severally having from 1 to 9 carbon atoms, or any of said groups whose hydrogen atom is substituted by acryloyl group or methacryloyl group, and R.sup.

Abstract: Disclosed are novel cyanoguanidine derivatives which are usable as an epoxy resin curing agent and are represented by the following general formula (1). A thermosetting resin composition and a photocurable and thermosetting resin composition containing the following cyanoguanidine derivatives and other derivatives as the epoxy resin curing agent are also disclosed. ##STR1## wherein R.sup.1 represents a substituent selected from the group consisting of the following substituents (a) through (k).

Abstract: Disclosed are an organic acid salt of melamine represented by the following general formula (1) and a thermosetting and a photocurable and thermosetting coating compositions containing the salt mentioned above. ##STR1## wherein Z represents ##STR2## wherein R.sup.1 represents a hydrogen atom or an alkyl group, alkylene group, alicyclic hydrocarbon, or aromatic hydrocarbon severally having from 1 to 18 carbon atoms, or any of said groups or hydrocarbons whose hydrogen atom is substituted by carboxyl group, hydroxyl group, or a halogen atom, R.sup.2 represents a hydrogen atom or an alkyl group or alkylene group severally having from 1 to 9 carbon atoms, or any of said groups whose hydrogen atom is substituted by acryloyl group or methacryloyl group, R.sup.3 represents an alkyl group or alkylene group severally having from 1 to 9 carbon atoms, or any of said groups whose hydrogen atom is substituted by acryloyl group or methacryloyl group, and R.sup.

Abstract: The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom.In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.

Abstract: A photosetting liquid ink composition developable with a dilute alkaline aqueous solution and comprising (A) a resin curable with an activated energy ray, obtained by the reaction of a saturated or unsaturated polybasic acid anhydride with a product of the reaction of a novolak type epoxy compound and an unsaturated monocarboxylic acid, (B) a photopolymerization initiator, and (C) a diluent can be used for the production of an etching resist or a solder resist in the manufacture of a printed circuit. This composition, when combined with a thermosetting component, produces a photosetting and thermosetting liquid ink composition.

Abstract: A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life.By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and postcuring, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.